Abstract: A chip card substrate is provided, which includes a plurality of layers. The plurality of layers includes a first polymer layer including a first polymer material, a second polymer layer disposed over the first polymer layer and a second polymer material different from the first polymer material. The plurality of layers further includes a third polymer layer disposed over the second polymer layer and including the first polymer material. The second polymer layer includes a plurality of cutouts at an edge of the second polymer layer so that the first polymer material of the first polymer layer and of the third polymer layer form a coupling through the plurality of cutouts.

Abstract: A chip card substrate is provided, which includes a plurality of layers. The plurality of layers includes a first polymer layer including a first polymer material, a second polymer layer disposed over the first polymer layer and a second polymer material different from the first polymer material. The plurality of layers further includes a third polymer layer disposed over the second polymer layer and including the first polymer material. The second polymer layer includes a plurality of cutouts at an edge of the second polymer layer so that the first polymer material of the first polymer layer and of the third polymer layer form a coupling through the plurality of cutouts.

Abstract: A chip module and to a chip card with a chip module which can be bent in such a way that a cross-sectional area runs along the greatest curvature of the bending line and parallel to one side of the chip module or the chip card. The module comprises contact areas within a surrounding line which are arranged in a plane perpendicular to the cross-sectional area, the surrounding line comprising a first line portion, which is adjacent the cross-sectional area, and a second line portion, which is opposite the first line portion. Furthermore, the module comprises a component, which is positioned in such a way that a first distance between the component and the first line portion is greater than a second distance between the component and the second line portion.

Abstract: A chip module and to a chip card with a chip module which can be bent in such a way that a cross-sectional area runs along the greatest curvature of the bending line and parallel to one side of the chip module or the chip card. The module comprises contact areas within a surrounding line which are arranged in a plane perpendicular to the cross-sectional area, the surrounding line comprising a first line portion, which is adjacent the cross-sectional area, and a second line portion, which is opposite the first line portion. Furthermore, the module comprises a component, which is positioned in such a way that a first distance between the component and the first line portion is greater than a second distance between the component and the second line portion.