Patents by Inventor Biyang DING

Biyang DING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10811755
    Abstract: A microstrip capacitor structure includes a substrate having a first side and a second side opposite the first side wherein the first and second sides of the substrate are spaced apart in a vertical direction, first and second conductive microstrip transmission line segments on the first side of the substrate, a conductive ground plane on the second side of the substrate, first and second microstrip capacitor plates connected to respective ones of the first and second microstrip transmission line segments, wherein the first and second microstrip capacitor plates are separated by a dielectric gap, and a complementary resonator comprising a removed portion of the conductive ground plane that is aligned in the vertical direction with at least a portion of the dielectric gap.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: October 20, 2020
    Assignee: CommScope Technologies LLC
    Inventors: Huafeng Su, Biyang Ding, Yongqiang Wang, Yi Zhang
  • Publication number: 20190207289
    Abstract: A microstrip capacitor structure includes a substrate having a first side and a second side opposite the first side wherein the first and second sides of the substrate are spaced apart in a vertical direction, first and second conductive microstrip transmission line segments on the first side of the substrate, a conductive ground plane on the second side of the substrate, first and second microstrip capacitor plates connected to respective ones of the first and second microstrip transmission line segments, wherein the first and second microstrip capacitor plates are separated by a dielectric gap, and a complementary resonator comprising a removed portion of the conductive ground plane that is aligned in the vertical direction with at least a portion of the dielectric gap.
    Type: Application
    Filed: April 28, 2017
    Publication date: July 4, 2019
    Inventors: Huafeng SU, Biyang DING, Yongqiang WANG, Yi ZHANG