Abstract: In a dual band capable voltage controlled oscillator VCO circuit comprising two voltage controlled oscillator units VCO1, VCO2, the voltage controlled oscillator units VCO1, VCO2 are synchronized and connected via at least two coupled transmission lines TL1, TL2, the transmission lines (TL1, TL2) are arranged to operate according to one of two modes to enable varying a combined inductance of the synchronized oscillator units VCO1, VCO2 and the oscillation frequency for the voltage controlled oscillator circuit VCO.

Abstract: The invention relates to an electrical transmission arrangement comprising a first strip-line conductor which has its main extension in a first direction in a first plane in the transmission arrangement and comprises a conductor, an upper ground plane which is situated at an upper distance from the conductor and a lower ground plane which is situated at a lower distance from the conductor, and a second strip-line conductor which has its main extension in a second direction in a second plane in the transmission arrangement and comprises a conductor, an upper ground plane which is situated at an upper distance from the conductor and a lower ground plane which is situated at a lower distance from the conductor, where the ground planes are separated from their respective conductors and from one another by a dielectric material, in which transmission arrangement the lower ground plane of the first strip-line conductors coincides with the upper ground plane of the second strip-line conductors at at least one point.

Abstract: The present invention relates to an arrangement in a multilayered electronic circuit. In a transition between two planar transmission lines, a compensating element is used to keep the average capacitance per length unit more constant during the transition. A via conductor the passes near an edge of a planar conductor pattern, the via conductor and the planar conductor having a mutual capacitive coupling within a predetermined range. A compensating conductor is formed between the planar conductor and the via conductor, which conductor is connected to the planar conductor by a compensating via. If the segment of the via conductor which belongs to the same via hole pattern as the compensating via is displaced, the compensating via is also displaced. The compensating planar pattern is then disconnected from the planar conductor. This improves yield in a given multilayer process.

Abstract: The invention relates to an electrical transmission arrangement comprising a first section of a conductor with a main extension in a first and a second plane, and a first section of a ground plane which extends essentially in parallel with the first conductor section on a first side thereof, at a certain first distance therefrom and has a main extension in the same two planes as the first conductor section, which first conductor section and first ground plane section together are included in a microstrip arrangement, and a second section of the same conductor, a second and a third ground plane section, where the second and third ground plane sections extend essentially in parallel with the second conductor section on a first and, respectively, second side thereof at a second and, respectively, third distance therefrom, where the second conductor section and the second and third ground plane sections are included in a strip-line arrangement, in which transmission arrangement the conductor sections are separate

Abstract: The present invention relates to a multilayer printed circuit board arrangement which results in better matching between a stripline (9) and a microstrip (4) in a cavity (6). The solution comprises the use of an asymmetric stripline (9) where the electric field is tied primarily to the lower earth plane (10). This results in good matching at the transition to the microstrip (4), whose field is tied to the lower earth plane (10).

Abstract: A hybrid circuit and a process for the manufacturing of a hybrid circuit (11) have been provided, the circuit comprising a component (2) such as a monolithic integrated circuit, MIC, and a substrate (1), being arranged on a common carrier plate (6), the substrate and component having respective terminals (3, 3′, 4, 4′, 4″). The hybrid circuit furthermore comprises a pad (7, 7′, 7″, 12, 13) mounted on the substrate terminal (3, 3′), whereby the pad is extending over the edge of the substrate terminal and facing the terminal (4, 4′, 4″) of the component, and at least one bonding element (8, 8′, 8″) or other connecting element being provided between the terminal (4) of the component and the pad (7, 7′, 7″, 12, 13). The connection according to the invention provides for a very low impedance value, which can be produced accurately, reliably and economically.

Abstract: The present invention relates to an arrangement in multilayer printed circuit boards, with the aim of improving matching in transitions between symmetric striplines (3) and asymmetric striplines (4). The requirement of a coverpad (6) for contact between the via (5) and the asymmetric stripline (4) for dimension reasons among other things, results in matching problems. In order to avoid this problem, the earth plane (7, 10) nearest the transition is moved away in the proximity of the via (5).