Abstract: A method for manufacturing a magnetic field sensor chip with an integrated back-bias magnet is described. A substrate with a first substrate surface and an opposite second substrate surface is provided, wherein at least one magnetic field sensor is arranged in a first substrate surface. A cavity is structured into the second substrate surface. The method involves generating the integrated back-bias magnet within the first cavity by introducing loose powder comprising a magnetic material into the first cavity and agglomerating the powder to a mechanically firm magnetic body structure by means of atomic layer deposition. According to the method, the step of generating the back-bias magnet is carried out temporally after the step of arranging the magnetic field sensor.

Abstract: An apparatus includes a substrate and a heat source structure connected to the substrate and configured to provide a heat quantity. Furthermore, a porous body including connected particles is provided, wherein gaps between the particles form fluidically connected cavities. The porous body is configured to at least partially receive the heat quantity of the heat source structure.