Abstract: A device and a method for influencing a dynamic property of at least one movably mounted body of two bodies coupled mechanically at least via a variably adjustable stiffness along a first force path. The invention includes a damping element with constant damping properties directly or indirectly coupled in series with the variably adjustable stiffness along the first force path Both bodies are mechanically directly or indirectly coupled via a second force path running parallel to the first force path along which at least one adjustable stiffness is incorporated. The damping property of the damping element and the adjustable stiffnesses are coordinated and configured so that a damping property assigned to the device for mechanical coupling can be varied exclusively by the adjustable stiffnesses.

Abstract: A method for cleaving wafers comprising the following steps: providing a slice of a crystalline material with at least a first plane side, providing at least one stressing means to be attached to said slice, wherein said at least one stressing means is at least in parts made of a material with a coefficient of thermal expansion different from that of the slice, attaching said stressing means to said first plane side of said slice to form a stack, inducing a thermal shear stress to said slice by applying a temperature change to said stack.

Abstract: A device and a method for influencing a dynamic property of at least one movably mounted body of two bodies coupled mechanically at least via a variably adjustable stiffness along a first force path. The invention includes a damping element with constant damping properties directly or indirectly coupled in series with the variably adjustable stiffness along the first force path Both bodies are mechanically directly or indirectly coupled via a second force path running parallel to the first force path along which at least one adjustable stiffness is incorporated. The damping property of the damping element and the adjustable stiffnesses are coordinated and configured so that a damping property assigned to the device for mechanical coupling can be varied exclusively by the adjustable stiffnesses.

Abstract: A method of fabricating a passivated contact for a photovoltaic cell includes depositing a tunneling oxide layer on a first face of a substrate. An amorphous silicon layer is then deposited on top of the tunneling oxide layer. An aluminum layer is screen printed on top of the amorphous silicon layer. The aluminum layer is configured to serve as a crystallization catalyst for the amorphous silicon layer. The amorphous silicon layer and the aluminum layer are then heated to a crystallization temperature that is configured to cause the amorphous silicon to crystallize and to sinter the aluminum layer.

Abstract: Various embodiments provide a solar cell. The solar cell includes a substrate having a front side and a rear side. At least the front side receives light. The solar cell further includes a multiplicity of rear side solder pad regions at least partially arranged over the rear side, and a plurality of partial solder pads formed in each rear side solder pad region of the multiplicity of rear side solder pad regions. Each partial solder pad includes a first metal. The partial solder pads in a respective rear side solder pad region are separated from each other. The solar cell further includes a rear side metallization formed at the rear side of the substrate partly overlapping the partial solder pads, the rear side metallization including a second metal different from the first metal.

Abstract: Apparatus and method for a production of silicon ingots, such as crucible-less production of silicon ingots, where a support with a seed layer and a liquid layer is gradually lowered in a temperature field with a vertical gradient to solidify the liquid layer in a controlled way.

Abstract: Various embodiments provide a solar cell. The solar cell includes a substrate having a front side and a rear side. At least the front side receives light. The solar cell further includes a multiplicity of rear side solder pad regions at least partially arranged over the rear side, and a plurality of partial solder pads formed in each rear side solder pad region of the multiplicity of rear side solder pad regions. Each partial solder pad includes a first metal. The partial solder pads in a respective rear side solder pad region are separated from each other. The solar cell further includes a rear side metallization formed at the rear side of the substrate partly overlapping the partial solder pads, the rear side metallization including a second metal different from the first metal.

Abstract: A method for cleaving wafers comprising the following steps: providing a slice of a crystalline material with at least a first plane side, providing at least one stressing means to be attached to said slice, wherein said at least one stressing means is at least in parts made of a material with a coefficient of thermal expansion different from that of the slice, attaching said stressing means to said first plane side of said slice to form a stack, inducing a thermal shear stress to said slice by applying a temperature change to said stack.

Abstract: A crucible for producing a silicon block comprises a crucible wall surrounding an interior and an opening for filling silicon melt into the interior, wherein the crucible wall comprises at least one doping means for providing dopant for the silicon melt.