Abstract: Various embodiments include field effect transistors (FETs) and methods of forming such FETs. One method includes: forming a first set of openings in a precursor structure having: a silicon substrate having a crystal direction, the silicon substrate substantially abutted by a first oxide; a silicon germanium (SiGe) layer overlying the silicon substrate; a silicon layer overlying the SiGe layer; a second oxide overlying the silicon layer; and a sacrificial layer overlying the second oxide, wherein the first set of openings each expose the silicon substrate; undercut etching the silicon substrate in a direction perpendicular to the crystal direction of the silicon substrate to form a trench corresponding with each of the first set of openings; passivating exposed surfaces of at least one of the SiGe layer or the silicon layer in the first set of openings; and at least partially filling each trench with a dielectric.

Abstract: Various embodiments include field effect transistors (FETs) and related integrated circuit (IC) layouts. One FET includes: a silicon substrate including a set of trenches; a first oxide abutting the silicon substrate; a silicon germanium (SiGe) layer overlying the silicon substrate; a silicon layer overlying the SiGe layer; a second oxide overlying the silicon layer, wherein the silicon layer includes a plurality of salicide regions; a gate structure overlying the second oxide between adjacent salicide regions; and a first contact contacting the gate structure; a second contact contacting one of the salicide regions; a third oxide partially filling the set of trenches and extending above the silicon layer overlying the SiGe layer; and an air gap in each of the set of trenches, the air gap surrounded by the third oxide.

Abstract: At least one isolation trench formed in a layer stack including substrate, channel, and upper gate layers define a channel in the channel layer. Lateral etching from the isolation trench(es) can form lateral cavities in the substrate and upper gate layer to substantially simultaneously form self-aligned lower and upper gates. The lower gate undercuts the channel, the upper gate is narrower than the channel, and a source and a drain can be formed on opposed ends of the channel. As a result, source-drain capacitance and gate-drain capacitance can be reduced, increasing speed of the resulting FET.

Abstract: At least one isolation trench formed in a layer stack including substrate, channel, and upper gate layers define a channel in the channel layer. Lateral etching from the isolation trench(es) can form lateral cavities in the substrate and upper gate layer to substantially simultaneously form self-aligned lower and upper gates. The lower gate undercuts the channel, the upper gate is narrower than the channel, and a source and a drain can be formed on opposed ends of the channel. As a result, source-drain capacitance and gate-drain capacitance can be reduced, increasing speed of the resulting FET.

Abstract: Various embodiments include field effect transistors (FETs) and related integrated circuit (IC) layouts. One FET includes: a silicon substrate including a set of trenches; a first oxide abutting the silicon substrate; a silicon germanium (SiGe) layer overlying the silicon substrate; a silicon layer overlying the SiGe layer; a second oxide overlying the silicon layer, wherein the silicon layer includes a plurality of salicide regions; a gate structure overlying the second oxide between adjacent salicide regions; and a first contact contacting the gate structure; a second contact contacting one of the salicide regions; a third oxide partially filling the set of trenches and extending above the silicon layer overlying the SiGe layer; and an air gap in each of the set of trenches, the air gap surrounded by the third oxide.

Abstract: At least one isolation trench formed in a layer stack including substrate, channel, and upper gate layers define a channel in the channel layer. Lateral etching from the isolation trench(es) can form lateral cavities in the substrate and upper gate layer to substantially simultaneously form self-aligned lower and upper gates. The lower gate undercuts the channel, the upper gate is narrower than the channel, and a source and a drain can be formed on opposed ends of the channel. As a result, source-drain capacitance and gate-drain capacitance can be reduced, increasing speed of the resulting FET.

Abstract: Various embodiments include field effect transistors (FETs) and methods of forming such FETs. One method includes: forming a first set of openings in a precursor structure having: a silicon substrate having a crystal direction, the silicon substrate substantially abutted by a first oxide; a silicon germanium (SiGe) layer overlying the silicon substrate; a silicon layer overlying the SiGe layer; a second oxide overlying the silicon layer; and a sacrificial layer overlying the second oxide, wherein the first set of openings each expose the silicon substrate; undercut etching the silicon substrate in a direction perpendicular to the crystal direction of the silicon substrate to form a trench corresponding with each of the first set of openings; passivating exposed surfaces of at least one of the SiGe layer or the silicon layer in the first set of openings; and at least partially filling each trench with a dielectric.

Abstract: A method and apparatus for displaying hierarchical navigation and editing a plurality of hierarchical levels of design of an integrated circuit includes opening a main editor screen, displaying a viewable scope of hierarchical levels of design in the main editor screen and using a computer to assign a side window adjacent to the main editor screen. The side-window displays information about schematics previously viewed including thumbnail views of most recently viewed levels of the plurality of hierarchical levels of design. Using the computer input device, the user scrolls through the main editor screen into a hierarchical level of design. The side window is populated with a schematic that was last viewed and a thumbnail view of the hierarchical level of design is surrounded by a highlighted border, enabling the user to view schematic elements underneath the hierarchical level of design and to see the thumbnail view of the top-level schematic.

Abstract: A computer program product stored on machine readable media including machine executable instructions for display a layout of a circuit design, includes instructions for: receiving designation of at least one design segment from a user; receiving designation of a degree of intensity for at least one of highlighting and dimming the design segments and on a display screen, highlighting the designated design segments and dimming remaining segments on the display. A system is also provided.

Abstract: A method and system for creating a worst case scenario model for a given integrated circuit. The method comprises the steps of sorting skew parameters of each device into groups; and assigning a positive or negative value for each one of the groups to represent the effect of the corresponding skew parameters on the functionality of the integrated circuit. The preferred embodiment of the invention provides some of the benefits of both conventional corner simulation and Monte Carlo simulation. This approach can be implemented with only a few additional simulation iterations, which mitigates the disadvantage of Monte Carlo simulations requiring many simulation iterations. Also, this approach allows a greater degree of flexibility with respect to determining a specific corner file definition, allowing the designer to explore a greater area of model parameter space to insure that the circuit will meet performance requirements over extremes of process technology variation.

Abstract: A method and system for creating a worst case scenario model for a given integrated circuit. The method comprises the steps of sorting skew parameters of each device into groups; and assigning a positive or negative value for each one of the groups to represent the effect of the corresponding skew parameters on the functionality of the integrated circuit. The preferred embodiment of the invention provides some of the benefits of both conventional corner simulation and Monte Carlo simulation. This approach can be implemented with only a few additional simulation iterations, which mitigates the disadvantage of Monte Carlo simulations requiring many simulation iterations. Also, this approach allows a greater degree of flexibility with respect to determining a specific corner file definition, allowing the designer to explore a greater area of model parameter space to insure that the circuit will meet performance requirements over extremes of process technology variation.