Abstract: Components and assemblies for acquisition and analysis of data collected from sites such body surfaces, footwear and apparel, objects, accessories, and the like are directed to providing intermittent and/or continuous monitoring and reporting of conditions such as force, pressure, shear and other conditions, activity and/or environmental parameters at body locations and/or at an interface of a body location and an object. In one aspect, sensor assemblies comprise one or more sensor(s) and/or associated electronics associated with at least one non-conductive carrier layer. Electronic components including sensor acquisition systems (SAS) and dedicated electronics devices (DED) providing electronics components for signal conditioning, data collection, storage, analysis, feedback, communications and optional sensing capabilities are also described.

Abstract: Components and assemblies for acquisition and analysis of data collected from sites such body surfaces, footwear and apparel, objects, accessories, and the like are directed to providing intermittent and/or continuous monitoring and reporting of conditions such as force, pressure, shear and other conditions, activity and/or environmental parameters at body locations and/or at an interface of a body location and an object. In one aspect, sensor assemblies comprise one or more sensor(s) and/or associated electronics associated with at least one non-conductive carrier layer. Electronic components including sensor acquisition systems (SAS) and dedicated electronics devices (DED) providing electronics components for signal conditioning, data collection, storage, analysis, feedback, communications and optional sensing capabilities are also described.