Patents by Inventor Blerand Qeriqi

Blerand Qeriqi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for thermally correcting data obtained through strain gauges mounted to a surface
    Patent number: 11029224
    Abstract: An instrumentation system for use with a component formed from a first material having non-uniform coefficients of thermal expansion includes a first sensing system configured to be mounted to the component to sense temperature and mechanical forces on the component, and a thermally compensating coupon configured to be mounted to the component adjacent the first sensing system. The thermally compensating coupon is formed from a second material having non-uniform coefficients of thermal expansion that are substantially identical to the non-uniform coefficients of thermal expansion of the first material. A thermally compensating sensing system is mounted to the thermally compensating coupon and connected to the first sensing system.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: June 8, 2021
    Assignee: LOCKHEED MARTIN CORPORATION
    Inventors: Allen S. Carnicke, Elias John Ervin, Blerand Qeriqi
  • METHOD FOR THERMALLY CORRECTING DATA OBTAINED THROUGH STRAIN GAUGES MOUNTED TO A SURFACE
    Publication number: 20200386633
    Abstract: An instrumentation system for use with a component formed from a first material having non-uniform coefficients of thermal expansion includes a first sensing system configured to be mounted to the component to sense temperature and mechanical forces on the component, and a thermally compensating coupon configured to be mounted to the component adjacent the first sensing system. The thermally compensating coupon is formed from a second material having non-uniform coefficients of thermal expansion that are substantially identical to the non-uniform coefficients of thermal expansion of the first material. A thermally compensating sensing system is mounted to the thermally compensating coupon and connected to the first sensing system.
    Type: Application
    Filed: June 4, 2019
    Publication date: December 10, 2020
    Inventors: Allen S. Carnicke, Elias John Ervin, Blerand Qeriqi