Patents by Inventor Bo Chen CHEN

Bo Chen CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220208581
    Abstract: The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.
    Type: Application
    Filed: March 21, 2022
    Publication date: June 30, 2022
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Bo Chen CHEN, Sheng-Wei Wu, Yung-Li Tsai
  • Patent number: 11282728
    Abstract: The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: March 22, 2022
    Inventors: Bo Chen Chen, Sheng-Wei Wu, Yung-Li Tsai
  • Publication number: 20220013592
    Abstract: A display panel includes a first substrate, pixel structures, a first common pad, a second substrate, a second common electrode, a display medium and a conductive particle. The pixel structures are disposed on an active area of the first substrate. The first common pad is disposed on a peripheral area of the first substrate, and is electrically connected to first common electrodes of the pixel structures. The second common electrode is disposed on the second substrate. The conductive particle is disposed on the first common pad, and is electrically connected to the first common pad and the second common electrode. The conductive particle includes a core and a conductive film disposed on a surface of the core, where the conductive film has a main portion and raised portions, and a film thickness of each of the raised portions is greater than a film thickness of the main portion.
    Type: Application
    Filed: April 9, 2021
    Publication date: January 13, 2022
    Applicant: Au Optronics Corporation
    Inventors: Bo-Chen Chen, Yun-Ru Cheng, Ya-Ling Hsu, Chia-Hsuan Pai, Cheng-Wei Huang, Wei-Shan Chao
  • Patent number: 10943804
    Abstract: The present disclosure describes a method for controlling a wet processing system includes dispensing one or more chemicals into a processing chamber according to one or more process parameters. The method also includes injecting one or more illumination markers into the processing chamber and obtaining images representing locations of the one or more illumination markers. The method further includes determining a trajectory of an illumination marker of the one or more illumination markers based on the images and determining whether the determined trajectory is outside a predetermined trajectory range. In response to the determined trajectory being outside the predetermined trajectory range, the method further includes adjusting the one or more process parameters.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: March 9, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Bo-Chen Chen, Sheng-Wei Wu, Yung-Li Tsai
  • Publication number: 20200058521
    Abstract: In an embodiment, a system includes: a pedestal configured to secure a wafer; a nozzle configured to deposit a cleaning solution on the wafer disposed on the pedestal during a cleaning session; and a plurality of contacts configured to secure the wafer to the pedestal while the cleaning solution is deposited on the wafer, wherein a first subset of the plurality of contacts is configured to contact the wafer at a first time interval and a second subset of the plurality of contacts is configured to contact the wafer at a second time interval.
    Type: Application
    Filed: August 13, 2019
    Publication date: February 20, 2020
    Inventors: Kun-Hsiung SHIH, Bo-Chen CHEN, Yung-Li TSAI, Chui-Ya PENG
  • Publication number: 20200055099
    Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.
    Type: Application
    Filed: August 6, 2019
    Publication date: February 20, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Bo Chen CHEN, Sheng-Wei WU, Yung-Li TSAI
  • Publication number: 20200006104
    Abstract: The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.
    Type: Application
    Filed: June 10, 2019
    Publication date: January 2, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Bo Chen Chen, Sheng-Wei Wu, Yung-Li Tsai
  • Publication number: 20200006101
    Abstract: The present disclosure describes a method for controlling a wet processing system includes dispensing one or more chemicals into a processing chamber according to one or more process parameters. The method also includes injecting one or more illumination markers into the processing chamber and obtaining images representing locations of the one or more illumination markers. The method further includes determining a trajectory of an illumination marker of the one or more illumination markers based on the images and determining whether the determined trajectory is outside a predetermined trajectory range. In response to the determined trajectory being outside the predetermined trajectory range, the method further includes adjusting the one or more process parameters.
    Type: Application
    Filed: June 27, 2019
    Publication date: January 2, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Bo Chen CHEN, Sheng-Wei Wu, Yung-Li Tsai