Patents by Inventor Bo-Cheng Kung

Bo-Cheng Kung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9876193
    Abstract: A thin-film device may include a carrier, a release layer, a stacking structure, and a flexible substrate. The release layer may be overlaid on the carrier, and the stacking structure is overlaid on the release layer. The stacking structure may include a first protective layer and a second protective layer, wherein the refractive index of the first protective layer exceeds that of the second protective layer. The flexible substrate may be overlaid on the release layer.
    Type: Grant
    Filed: October 16, 2013
    Date of Patent: January 23, 2018
    Assignee: Industrial Technology Research Institute
    Inventors: Jing-Yi Yan, Chen-Yu Chiang, Wen-Tung Wang, Bo-Cheng Kung, Hung-Chien Lin, Liang-Hsiang Chen
  • Publication number: 20140349091
    Abstract: A thin-film device may include a carrier, a release layer, a stacking structure, and a flexible substrate. The release layer may be overlaid on the carrier, and the stacking structure is overlaid on the release layer. The stacking structure may include a first protective layer and a second protective layer, wherein the refractive index of the first protective layer exceeds that of the second protective layer. The flexible substrate may be overlaid on the release layer.
    Type: Application
    Filed: October 16, 2013
    Publication date: November 27, 2014
    Applicant: Industrial Technology Research Institute
    Inventors: Jing-Yi Yan, Chen-Yu Chiang, Wen-Tung Wang, Bo-Cheng Kung, Hung-Chien Lin, Liang-Hsiang Chen