Patents by Inventor Bo-Chi Chou

Bo-Chi Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shock absorbent packaging structure
    Patent number: 7225925
    Abstract: A packaging structure for a container. The packaging structure includes a main frame including a first portion, a second portion and a connecting plate connecting the first and second portions, and a plurality of separators inserted in first and second grooves defined at the first and second portions respectively. The glass substrate is sealed in a loading slot formed by the separators.
    Type: Grant
    Filed: June 9, 2004
    Date of Patent: June 5, 2007
    Assignee: AU Optronics Corp.
    Inventors: Chiu-Chun Chen, Bo-Chi Chou, Wen-Yuan Chang
  • Shock absorbent packaging structure
    Publication number: 20050173294
    Abstract: A packaging structure for a container. The packaging structure comprises a main frame including a first portion, a second portion and a connecting plate connecting the first and second portions, and a plurality of separators inserted in first and second grooves defined at the first and second portions respectively. The glass substrate is sealed in a loading slot formed by the separators.
    Type: Application
    Filed: June 9, 2004
    Publication date: August 11, 2005
    Inventors: Chiu-Chun Chen, Bo-Chi Chou, Wen-Yuan Chang