Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.

Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.

Abstract: When an optical storage drive executes a control procedure or operation, a method of handling an interrupt request includes utilizing the optical storage drive to receive an interrupt request from a control circuit; checking whether the interrupt request is a read command; if the interrupt request is a read command, checking whether data indicated by the read command is in a buffer; and if the indicated data in the buffer, transferring the corresponding data to the control circuit from the buffer to respond to the interrupt request.

Abstract: When an optical storage drive executes a control procedure or operation, a method of handling an interrupt request includes utilizing the optical storage drive to receive an interrupt request from a control circuit; checking whether the interrupt request is a read command; if the interrupt request is a read command, checking whether data indicated by the read command is in a buffer; and if the indicated data in the buffer, transferring the corresponding data to the control circuit from the buffer to respond to the interrupt request.