Abstract: Provided is a conformal electromagnetic interference (EMI) shielding film including a thermal-forming film layer and an electrically conductive film layer. The thermal-forming film layer is configured to conformally coat over one or more electronic components mounted on a substrate with application of heat. The electrically conductive film layer is formed on an opposite side of the thermal-forming film layer from the substrate and has a plurality of voids that are configured to deform during the application of heat and allow the electrically conductive film layer to conform together with the thermal-forming film layer.

Abstract: The disclosure discloses a channel combining and time-division processing circuit of a dual-plane pulse Doppler radar seeker. The circuit includes a time-division control circuit configured to receive a time-division control signal, control input of an elevation difference channel signal and an azimuth difference channel signal, combine the elevation difference channel signal and the azimuth difference channel signal and output a combined difference channel signal, and a hybrid bridge circuit configured to receive a sum channel signal, combine channels for the sum channel signal and the combined difference channel signal and output signals on a combined channel. With the circuit of the disclosure, signals received from a sum channel, an azimuth difference channel and an elevation difference channel can be combined into received signals from two channels for processing with one received signal processing channel hardware omitted.

Abstract: Various methods and systems are provided for ultrasound imaging probe power management. In one embodiment, a power management system for an ultrasound imaging system includes a wireless charger and a mount configured to couple to a probe holder of the ultrasound imaging system. The probe may seat against the wireless charger for charging of a power source of the probe.

Abstract: A thermal management device with electromagnetic (EM) shielding includes a fin pack with a plurality of channels. The fin pack has an upper and lower surface. The fin pack has a pack length, pack height, and pack width. The fin pack has fins are oriented connecting the upper surface to the lower surface. The plurality of channels extends from a first end toward a second end. A first channel of the plurality of channels is adjacent the upper surface, and a second channel of the plurality of channels is adjacent the lower surface.

Abstract: A method of manufacturing an impeller for a thermal management device includes partially curing a curable liquid in a curable liquid bath to form a first stage rotor, removing the first stage rotor from the curable liquid bath, the first stage rotor having excess curable liquid on a surface thereof, rotating the first stage rotor to displace the excess curable liquid radially outward from a rotational axis to compensate for imbalances in the first stage rotor, and fully curing the first stage rotor and at least a portion of the excess curable liquid to produce a second stage rotor that is more rotationally balanced than the first stage rotor.

Abstract: A spherical joint includes a body portion and a blocking portion. The body portion includes a ball portion and a joint portion. The ball portion and the joint portion have an inner surface that links the two portions together in an axial direction and an outer surface opposite to the inner surface. The outer surface of the ball portion includes a spherical surface. The body portion further includes a first section and a second section. Each of the first section and the second section intersects with the inner surface and the outer surface such that the two sections together define a gap. The blocking portion is detachably connected to the body portion and shaped to match the gap, so that the blocking portion blocks the gap to form a hollow spherical joint structure. Further disclosed in the present application are a spherical joint assembly and an ultrasonic imaging device.

Abstract: The present application discloses a probe sterilization device including: a housing defining a cavity with an opening, the housing including a cover plate capable of covering the opening; a cover plate drive, capable of driving, in response to a cover plate drive control signal, the cover plate to move so as to open the opening; a support, arranged in the housing and capable of fixing the probe; an ultraviolet light source, arranged in the housing and capable of being turned on in response to a light source control signal; and a processor, electrically connected to the cover plate drive and capable of sending the cover plate drive control signal to the cover plate drive, and electrically connected to the ultraviolet light source and capable of sending the light source control signal to the ultraviolet light source. The present application further discloses a probe sterilization method and an ultrasonic imaging system.

Abstract: Cooling of an electronic device that includes a first portion and a second portion is provided. The first portion and the second portion are rotatable relative to each other. A first sensor measures a first temperature at a first location within or on the electronic device continuously or intermittently. A second sensor measures a second temperature at a second location within or on the electronic device continuously or intermittently. A processor identifies a first state of the electronic device or a second state of the electronic device. The processor controls operation of the electronic device based on the first measured temperature and the second measured temperature when the electronic device is in the identified first state and controls the operation of the electronic device based on the first measured temperatures but not based on the second measured temperatures when the electronic device is in the identified second state.

Abstract: A thermal management device with electromagnetic (EM) shielding includes a fin pack with a plurality of channels. The fin pack has an upper and lower surface. The fin pack has a pack length, pack height, and pack width. The fin pack has fins are oriented connecting the upper surface to the lower surface. The plurality of channels extends from a first end toward a second end. A first channel of the plurality of channels is adjacent the upper surface, and a second channel of the plurality of channels is adjacent the lower surface.

Abstract: The disclosure discloses a channel combining and time-division processing circuit of a dual-plane pulse Doppler radar seeker. The circuit includes a time-division control circuit configured to receive a time-division control signal, control input of an elevation difference channel signal and an azimuth difference channel signal, combine the elevation difference channel signal and the azimuth difference channel signal and output a combined difference channel signal, and a hybrid bridge circuit configured to receive a sum channel signal, combine channels for the sum channel signal and the combined difference channel signal and output signals on a combined channel. With the circuit of the disclosure, signals received from a sum channel, an azimuth difference channel and an elevation difference channel can be combined into received signals from two channels for processing with one received signal processing channel hardware omitted.

Abstract: A vapor chamber device is provided. The vapor chamber device includes a heat-generating component, a first metallic layer deposited directly on the heat-generating component, and a second metallic layer deposited so as to contact the first metallic layer at a perimeter. The first and second metallic layers fully enclose an internal void formed therein.

Abstract: Thermal management devices and systems, and corresponding methods of cooling an electronic device are described herein. A method for cooling an electronic device that includes a housing and a vent in the housing includes monitoring, by a sensor, an operating condition of the electronic device. The vent is opened or closed based on the monitored condition of the electronic device.

Abstract: A thermal management device with electromagnetic (EM) shielding includes a fin pack with a plurality of channels. The fin pack has an upper and lower surface. The fin pack has a pack length, pack height, and pack width. The fin pack has fins are oriented connecting the upper surface to the lower surface. The plurality of channels extends from a first end toward a second end. A first channel of the plurality of channels is adjacent the upper surface, and a second channel of the plurality of channels is adjacent the lower surface.

Abstract: A device cooling system disclosed herein includes a ventilated shield can coupled to a printed circuit board assembly. The ventilated shield can includes a first side surface with input holes and a second side surface with output holes. The ventilated shield can is positioned related to a predefined airflow path such that the input holes and the output holes facilitate airflow along the predefined airflow path through the ventilated shield can in a direction substantially parallel to the PCBA while the shield can encases and shields at least one electrical component from RF radiation at a target shield frequency.

Abstract: Thermal management devices and systems, and corresponding methods of cooling an electronic device are described herein. A method for cooling an electronic device that includes a housing and a vent in the housing includes monitoring, by a sensor, an operating condition of the electronic device. The vent is opened or closed based on the monitored condition of the electronic device.

Abstract: A method of manufacturing an impeller for a thermal management device includes partially curing a curable liquid in a curable liquid bath to form a first stage rotor, removing the first stage rotor from the curable liquid bath, the first stage rotor having excess curable liquid on a surface thereof, rotating the first stage rotor to displace the excess curable liquid radially outward from a rotational axis to compensate for imbalances in the first stage rotor, and fully curing the first stage rotor and at least a portion of the excess curable liquid to produce a second stage rotor that is more rotationally balanced than the first stage rotor.

Abstract: A vapor chamber device is provided. The vapor chamber device includes a heat-generating component, a first metallic layer deposited directly on the heat-generating component, and a second metallic layer deposited so as to contact the first metallic layer at a perimeter. The first and second metallic layers fully enclose an internal void formed therein.

Abstract: Cooling of an electronic device that includes a first portion and a second portion is provided. The first portion and the second portion are rotatable relative to each other. A first sensor measures a first temperature at a first location within or on the electronic device continuously or intermittently. A second sensor measures a second temperature at a second location within or on the electronic device continuously or intermittently. A processor identifies a first state of the electronic device or a second state of the electronic device. The processor controls operation of the electronic device based on the first measured temperature and the second measured temperature when the electronic device is in the identified first state and controls the operation of the electronic device based on the first measured temperatures but not based on the second measured temperatures when the electronic device is in the identified second state.

Abstract: A device cooling system disclosed herein includes a ventilated shield can coupled to a printed circuit board assembly. The ventilated shield can includes a first side surface with input holes and a second side surface with output holes. The ventilated shield can is positioned related to a predefined airflow path such that the input holes and the output holes facilitate airflow along the predefined airflow path through the ventilated shield can in a direction substantially parallel to the PCBA while the shield can encases and shields at least one electrical component from RF radiation at a target shield frequency.

Abstract: Cooling of a computing device is described herein. The computing device includes a plurality of fans, a plurality of sensors, and a processor in communication with the plurality of fans and the plurality of sensors. Each sensor of the plurality of sensors is associated with at least one fan of the plurality of fans and is operable to determine a temperature. The processor is configured to determine, for each sensor of the plurality of sensors, a difference between the determined temperature and a predetermined temperature corresponding to the sensor. The processor is also configured to compared the determined differences. The processor is configured to increase a speed of at least a first fan of the plurality of fans based on the comparison, and determine which fan of the plurality of fans to decrease fan speed based on the increased speed of the first fan.