Patents by Inventor Bo Dan

Bo Dan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240373608
    Abstract: Provided is a conformal electromagnetic interference (EMI) shielding film including a thermal-forming film layer and an electrically conductive film layer. The thermal-forming film layer is configured to conformally coat over one or more electronic components mounted on a substrate with application of heat. The electrically conductive film layer is formed on an opposite side of the thermal-forming film layer from the substrate and has a plurality of voids that are configured to deform during the application of heat and allow the electrically conductive film layer to conform together with the thermal-forming film layer.
    Type: Application
    Filed: July 15, 2024
    Publication date: November 7, 2024
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Jaejin LEE, Bo DAN, Han LI
  • Publication number: 20240329010
    Abstract: A scanning assembly of an ultrasonic imaging device including: a scanning unit configured to send an ultrasonic signal to a subject to be scanned and/or receives an ultrasonic signal reflected by the subject to be scanned; and a transparent screen disposed on the scanning unit, the transparent screen being configured to display information while the subject is being scanned and/or provide for observation of the scanning unit through the transparent screen.
    Type: Application
    Filed: March 29, 2024
    Publication date: October 3, 2024
    Inventors: Zuhua Wang, Bo Dan, Xin Wang, Chunyan Qi, Hongyu Zhao
  • Publication number: 20240285254
    Abstract: A scanning assembly, including: a housing, wherein a lower portion of the housing comprises an opening, and the opening can be closed by tissue to be scanned; a pressure difference generating device, disposed on the housing and used to generate an air pressure difference between the interior and the exterior of the housing, the air pressure difference providing a first pressure for the tissue to be scanned, the weight of the scanning assembly providing a second pressure for the tissue to be scanned, the tissue to be scanned being compressed under the action of a compressive force, and the compressive force comprising the first pressure and the second pressure; and an ultrasonic transducer, disposed in the housing and used to perform ultrasound scanning on the compressed tissue to be scanned.
    Type: Application
    Filed: February 28, 2024
    Publication date: August 29, 2024
    Inventors: Hongyu Zhao, Bo Dan, Qiang Yao, Chunyan Qi, Kuo Wang, Xin Wang, Lu Jin
  • Patent number: 12069845
    Abstract: Provided is a conformal electromagnetic interference (EMI) shielding film including a thermal-forming film layer and an electrically conductive film layer. The thermal-forming film layer is configured to conformally coat over one or more electronic components mounted on a substrate with application of heat. The electrically conductive film layer is formed on an opposite side of the thermal-forming film layer from the substrate and has a plurality of voids that are configured to deform during the application of heat and allow the electrically conductive film layer to conform together with the thermal-forming film layer.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: August 20, 2024
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Jaejin Lee, Bo Dan, Han Li
  • Patent number: 12061503
    Abstract: Thermal management devices and systems, and corresponding methods of cooling an electronic device are described herein. A method for cooling an electronic device that includes a housing and a vent in the housing includes monitoring, by a sensor, an operating condition of the electronic device. The vent is opened or closed based on the monitored condition of the electronic device.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: August 13, 2024
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Bo Dan, James David Wahl, Chau Van Ho
  • Publication number: 20230345687
    Abstract: Provided is a conformal electromagnetic interference (EMI) shielding film including a thermal-forming film layer and an electrically conductive film layer. The thermal-forming film layer is configured to conformally coat over one or more electronic components mounted on a substrate with application of heat. The electrically conductive film layer is formed on an opposite side of the thermal-forming film layer from the substrate and has a plurality of voids that are configured to deform during the application of heat and allow the electrically conductive film layer to conform together with the thermal-forming film layer.
    Type: Application
    Filed: April 26, 2022
    Publication date: October 26, 2023
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Jaejin LEE, Bo DAN, Han LI
  • Patent number: 11740324
    Abstract: The disclosure discloses a channel combining and time-division processing circuit of a dual-plane pulse Doppler radar seeker. The circuit includes a time-division control circuit configured to receive a time-division control signal, control input of an elevation difference channel signal and an azimuth difference channel signal, combine the elevation difference channel signal and the azimuth difference channel signal and output a combined difference channel signal, and a hybrid bridge circuit configured to receive a sum channel signal, combine channels for the sum channel signal and the combined difference channel signal and output signals on a combined channel. With the circuit of the disclosure, signals received from a sum channel, an azimuth difference channel and an elevation difference channel can be combined into received signals from two channels for processing with one received signal processing channel hardware omitted.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: August 29, 2023
    Assignee: Naval Aeronautical University, People's Liberation Army
    Inventors: Weijian Song, Longjun Zhai, Shan Gao, Bo Dan, Jianhu Liang, Jianli Han
  • Publication number: 20230255592
    Abstract: Various methods and systems are provided for ultrasound imaging probe power management. In one embodiment, a power management system for an ultrasound imaging system includes a wireless charger and a mount configured to couple to a probe holder of the ultrasound imaging system. The probe may seat against the wireless charger for charging of a power source of the probe.
    Type: Application
    Filed: February 14, 2022
    Publication date: August 17, 2023
    Inventors: Lu Jin, Qiang Yao, Dae Young Kim, Bo Dan, Michael C. Macdonald, Robert A. Meurer, Todd E. Schueneman, Ross Christopher Stalter
  • Patent number: 11726529
    Abstract: A thermal management device with electromagnetic (EM) shielding includes a fin pack with a plurality of channels. The fin pack has an upper and lower surface. The fin pack has a pack length, pack height, and pack width. The fin pack has fins are oriented connecting the upper surface to the lower surface. The plurality of channels extends from a first end toward a second end. A first channel of the plurality of channels is adjacent the upper surface, and a second channel of the plurality of channels is adjacent the lower surface.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: August 15, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Bo Dan, Robert Ullman Myers, Aaron Ray Paff, Raghavendra S Kanivihalli, Eugene Lee
  • Patent number: 11712838
    Abstract: A method of manufacturing an impeller for a thermal management device includes partially curing a curable liquid in a curable liquid bath to form a first stage rotor, removing the first stage rotor from the curable liquid bath, the first stage rotor having excess curable liquid on a surface thereof, rotating the first stage rotor to displace the excess curable liquid radially outward from a rotational axis to compensate for imbalances in the first stage rotor, and fully curing the first stage rotor and at least a portion of the excess curable liquid to produce a second stage rotor that is more rotationally balanced than the first stage rotor.
    Type: Grant
    Filed: May 4, 2020
    Date of Patent: August 1, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Lincoln Matthew Ghioni, Robert Ullman Myers, Bo Dan, Andrew Douglas Delano
  • Publication number: 20230069725
    Abstract: A spherical joint includes a body portion and a blocking portion. The body portion includes a ball portion and a joint portion. The ball portion and the joint portion have an inner surface that links the two portions together in an axial direction and an outer surface opposite to the inner surface. The outer surface of the ball portion includes a spherical surface. The body portion further includes a first section and a second section. Each of the first section and the second section intersects with the inner surface and the outer surface such that the two sections together define a gap. The blocking portion is detachably connected to the body portion and shaped to match the gap, so that the blocking portion blocks the gap to form a hollow spherical joint structure. Further disclosed in the present application are a spherical joint assembly and an ultrasonic imaging device.
    Type: Application
    Filed: August 22, 2022
    Publication date: March 2, 2023
    Inventors: Sheng Xu, Hongyu Zhao, Qiang Yao, Liping Chen, Bing Li, Bo Dan
  • Publication number: 20230033190
    Abstract: The present application discloses a probe sterilization device including: a housing defining a cavity with an opening, the housing including a cover plate capable of covering the opening; a cover plate drive, capable of driving, in response to a cover plate drive control signal, the cover plate to move so as to open the opening; a support, arranged in the housing and capable of fixing the probe; an ultraviolet light source, arranged in the housing and capable of being turned on in response to a light source control signal; and a processor, electrically connected to the cover plate drive and capable of sending the cover plate drive control signal to the cover plate drive, and electrically connected to the ultraviolet light source and capable of sending the light source control signal to the ultraviolet light source. The present application further discloses a probe sterilization method and an ultrasonic imaging system.
    Type: Application
    Filed: July 20, 2022
    Publication date: February 2, 2023
    Inventors: Yalan Yang, Lionel Wodecki, Yang Zhou, Bo Dan, Hao Yin
  • Patent number: 11474577
    Abstract: Cooling of an electronic device that includes a first portion and a second portion is provided. The first portion and the second portion are rotatable relative to each other. A first sensor measures a first temperature at a first location within or on the electronic device continuously or intermittently. A second sensor measures a second temperature at a second location within or on the electronic device continuously or intermittently. A processor identifies a first state of the electronic device or a second state of the electronic device. The processor controls operation of the electronic device based on the first measured temperature and the second measured temperature when the electronic device is in the identified first state and controls the operation of the electronic device based on the first measured temperatures but not based on the second measured temperatures when the electronic device is in the identified second state.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: October 18, 2022
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Chau Van Ho, Bo Dan, Brandon Earl Gary, Gary Russell McClary
  • Publication number: 20220035415
    Abstract: A thermal management device with electromagnetic (EM) shielding includes a fin pack with a plurality of channels. The fin pack has an upper and lower surface. The fin pack has a pack length, pack height, and pack width. The fin pack has fins are oriented connecting the upper surface to the lower surface. The plurality of channels extends from a first end toward a second end. A first channel of the plurality of channels is adjacent the upper surface, and a second channel of the plurality of channels is adjacent the lower surface.
    Type: Application
    Filed: October 18, 2021
    Publication date: February 3, 2022
    Inventors: Bo Dan, Robert Ullman Myers, Aaron Ray Paff, Raghavendra S Kanivihalli, Eugene Lee
  • Publication number: 20220003836
    Abstract: The disclosure discloses a channel combining and time-division processing circuit of a dual-plane pulse Doppler radar seeker. The circuit includes a time-division control circuit configured to receive a time-division control signal, control input of an elevation difference channel signal and an azimuth difference channel signal, combine the elevation difference channel signal and the azimuth difference channel signal and output a combined difference channel signal, and a hybrid bridge circuit configured to receive a sum channel signal, combine channels for the sum channel signal and the combined difference channel signal and output signals on a combined channel. With the circuit of the disclosure, signals received from a sum channel, an azimuth difference channel and an elevation difference channel can be combined into received signals from two channels for processing with one received signal processing channel hardware omitted.
    Type: Application
    Filed: June 9, 2021
    Publication date: January 6, 2022
    Applicant: Naval Aeronautical University, People's Liberation Army
    Inventors: Weijian Song, Longjun Zhai, Shan Gao, Bo Dan, Jianhu Liang, Jianli Han
  • Patent number: 11201103
    Abstract: A vapor chamber device is provided. The vapor chamber device includes a heat-generating component, a first metallic layer deposited directly on the heat-generating component, and a second metallic layer deposited so as to contact the first metallic layer at a perimeter. The first and second metallic layers fully enclose an internal void formed therein.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: December 14, 2021
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Lincoln Matthew Ghioni, Brian J. Toleno, Sahar Vilan, Han Li, Bo Dan
  • Publication number: 20210333851
    Abstract: Thermal management devices and systems, and corresponding methods of cooling an electronic device are described herein. A method for cooling an electronic device that includes a housing and a vent in the housing includes monitoring, by a sensor, an operating condition of the electronic device. The vent is opened or closed based on the monitored condition of the electronic device.
    Type: Application
    Filed: July 9, 2021
    Publication date: October 28, 2021
    Inventors: Bo DAN, James David WAHL, Chau Van HO
  • Patent number: 11150700
    Abstract: A thermal management device with electromagnetic (EM) shielding includes a fin pack with a plurality of channels. The fin pack has an upper and lower surface. The fin pack has a pack length, pack height, and pack width. The fin pack has fins are oriented connecting the upper surface to the lower surface. The plurality of channels extends from a first end toward a second end. A first channel of the plurality of channels is adjacent the upper surface, and a second channel of the plurality of channels is adjacent the lower surface.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: October 19, 2021
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Bo Dan, Robert Ullman Myers, Aaron Ray Paff, Raghavendra S Kanivihalli, Eugene Lee
  • Patent number: 11089712
    Abstract: A device cooling system disclosed herein includes a ventilated shield can coupled to a printed circuit board assembly. The ventilated shield can includes a first side surface with input holes and a second side surface with output holes. The ventilated shield can is positioned related to a predefined airflow path such that the input holes and the output holes facilitate airflow along the predefined airflow path through the ventilated shield can in a direction substantially parallel to the PCBA while the shield can encases and shields at least one electrical component from RF radiation at a target shield frequency.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: August 10, 2021
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Tianyu Zhao, Eugene Lee, Bo Dan
  • Patent number: 11061451
    Abstract: Thermal management devices and systems, and corresponding methods of cooling an electronic device are described herein. A method for cooling an electronic device that includes a housing and a vent in the housing includes monitoring, by a sensor, an operating condition of the electronic device. The vent is opened or closed based on the monitored condition of the electronic device.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: July 13, 2021
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Bo Dan, James David Wahl, Chau Van Ho