Abstract: The present invention relates to a release layer for a metal foil with carrier and a metal foil with carrier including the release layer. The release layer is designed for easy removal of the carrier and includes one or more nitrogenous heterocyclic compounds and one or more inorganic compounds containing at least one metal selected from the group consisting of nickel, molybdenum, cobalt, phosphorus, manganese, and iron.

Abstract: A light emitting device includes a substrate including an entire top surface that is flat; a light emitting diode on the substrate; a lead frame formed on the flat top surface of the substrate, the lead frame electrically connected to the light emitting diode; a dam member disposed on the lead frame and being adjacent to the light emitting diode, the dam member having a circular configuration which has an opening; a first member disposed on the light emitting diode, the first member including a fluorescent substance to convert a light emission spectrum of light from the light emitting diode; a second member disposed in the opening of the dam member, a circumference of the second member being defined by the dam member and contacting an inner vertical side surface of the dam member, wherein the second member excludes the fluorescent substance; and a lens disposed on the second member.

Abstract: A light emitting device includes a substrate including an entire top surface that is flat; a light emitting diode on the substrate; a lead frame formed on the flat top surface of the substrate, the lead frame electrically connected to the light emitting diode; a dam member disposed on the lead frame and being adjacent to the light emitting diode, the dam member having a circular configuration which has an opening; a first member disposed on the light emitting diode, the first member including a fluorescent substance to convert a light emission spectrum of light from the light emitting diode; a second member disposed in the opening of the dam member, a circumference of the second member being defined by the dam member and contacting an inner vertical side surface of the dam member, wherein the second member excludes the fluorescent substance; and a lens disposed on the second member.

Abstract: A light emitting device including a substrate including an entire top surface that is flat, a light emitting diode on the substrate, a lead frame disposed on the flat top surface of the substrate, the lead frame electrically connected to the light emitting diode, a dam member disposed on the substrate and being adjacent to the light emitting diode, the dam member having a circular configuration which has an opening, a first member disposed on the light emitting diode, the first member including a fluorescent substance to convert a light emission spectrum of light from the light emitting diode, a second member disposed in the opening of the dam member, a circumference of the second member being defined by the dam member and a lens disposed on the second member is provided.

Abstract: Disclosed are a light emitting device and a method for manufacturing the same. The light emitting device includes a substrate having a lead frame, a light emitting diode mounted on the substrate, a mold member formed on the substrate and the light emitting diode, and a reflecting member having an opening portion at one side thereof and being inclined at an outer portion of the mold member.

Abstract: Provided is a package of a light emitting diode. The package according to an embodiment includes a package of a light emitting diode, the package comprising: a base layer including an entire top surface that is substantially flat; a light emitting diode chip on the base layer; a lead frame electrically connected to the light emitting diode chip; and a reflective coating layer comprising titanium oxide, wherein a top surface of the reflective coating layer is substantially parallel to a top surface of the base layer, and wherein ends of the reflective coating layer and base layer are aligned with each other.

Abstract: According to an embodiment, a light emitting apparatus includes a substrate; at least two distinct electrodes on the substrate, wherein the at least two distinct electrodes are spaced from each other; a light emitting device on one of the at least two distinct electrodes; lenses including a first lens and a second lens on the substrate, wherein the second lens is disposed on the first lens, wherein an outermost portion of the second lens is spaced from the substrate; and a supporting unit configured to directly contact the second lens, wherein the supporting unit is formed of a non-conductivity material.

Abstract: A light emitting diode (LED) package is provided. According to an embodiment, a light emitting apparatus includes a substrate; at least two distinct electrodes on the substrate; a light emitting device on one of the at least two distinct electrodes, wherein the at least two distinct electrodes are electrically separated from each other and spaced from each other; a guide unit on the substrate and around the light emitting device, wherein the guide unit includes an inner side surface, an outer side surface, a top surface and a bottom surface; and lenses including a first lens and a second lens on the substrate, wherein at least one of the lenses includes a convex shape and a portion of the at least one of the lenses is located higher than the top surface of the guide unit.

Abstract: A light emitting diode (LED) package is provided. The LED package includes a printed circuit board (PCB), an electrode pad, an LED, a wire, and first and second moldings. The electrode pad and the LED are formed on the PCB. The wire electrically connects the LED with the electrode pad. The first molding is formed on the LED and the second molding is formed on the first molding.

Abstract: A light emitting device including a substrate including an entire top surface that is flat, a light emitting diode on the substrate, a lead frame disposed on the flat top surface of the substrate, the lead frame electrically connected to the light emitting diode, a dam member disposed on the substrate and being adjacent to the light emitting diode, the dam member having a circular configuration which has an opening, a first member disposed on the light emitting diode, the first member including a fluorescent substance to convert a light emission spectrum of light from the light emitting diode, a second member disposed in the opening of the dam member, a circumference of the second member being defined by the dam member and a lens disposed on the second member is provided.

Abstract: A light emitting device comprises a substrate including a top surface that is flat, a light emitting diode on the substrate, a lead frame formed on the flat top surface of the substrate. The lead frame includes a circuit with a predetermined pattern to electrically connect to the light emitting diode. A dam part is formed on the substrate and is adjacent to the light emitting diode. A first member is formed on the light emitting diode, the first member including a fluorescent substance to convert a light emission spectrum of light from the light emitting diode. A second member is surrounded by the dam part and is formed on the substrate adjacent to the first member, and a lens covers the first member, the second member and the light emitting diode.

Abstract: Provided is a package of a light emitting diode. The package according to an embodiment includes a package of a light emitting diode, the package comprising: a base layer including an entire top surface that is substantially flat; a light emitting diode chip on the base layer; a lead frame electrically connected to the light emitting diode chip; and a reflective coating layer comprising titanium oxide, wherein a top surface of the reflective coating layer is substantially parallel to a top surface of the base layer, and wherein ends of the reflective coating layer and base layer are aligned with each other.

Abstract: Provided is a package of a light emitting diode. The package according to an embodiment includes a package of a light emitting diode, the package comprising: a base layer including an entire top surface that is substantially flat; a light emitting diode chip on the base layer; a lead frame electrically connected to the light emitting diode chip; and a reflective coating layer comprising titanium oxide, wherein a top surface of the reflective coating layer is substantially parallel to a top surface of the base layer, and wherein ends of the reflective coating layer and base layer are aligned with each other.

Abstract: Disclosed are a light emitting device and a method for manufacturing the same. The light emitting device includes a substrate having a lead frame, a light emitting diode mounted on the substrate, a mold member formed on the substrate and the light emitting diode, and a reflecting member having an opening portion at one side thereof and being inclined at an outer portion of the mold member.

Abstract: Provided is a package of a light emitting diode. The package according to an embodiment includes a base layer, a light emitting diode chip on the base layer, a lead frame electrically connected to the light emitting diode chip, a reflective coating layer directly on the lead frame, and a molding material covering the light emitting diode chip in a predetermined shape.

Abstract: Disclosed are a light emitting device and a method for manufacturing the same. The light emitting device includes a substrate having a lead frame, a light emitting diode mounted on the substrate, a mold member formed on the substrate and the light emitting diode, and a reflecting member having an opening portion at one side thereof and being inclined at an outer portion of the mold member.

Abstract: Provided is a package of a light emitting diode. The package according to an embodiment includes a package of a light emitting diode, the package comprising: a base layer including an entire top surface that is substantially flat; a light emitting diode chip on the base layer; a lead frame electrically connected to the light emitting diode chip; and a reflective coating layer comprising titanium oxide, wherein a top surface of the reflective coating layer is substantially parallel to a top surface of the base layer, and wherein ends of the reflective coating layer and base layer are aligned with each other.

Abstract: Provided is a package of a light emitting diode. The package according to an embodiment includes a base layer, a light emitting diode chip on the base layer, a lead frame electrically connected to the light emitting diode chip, a reflective coating layer directly on the lead frame, and a molding material covering the light emitting diode chip in a predetermined shape.

Abstract: Provided is a package of a light emitting diode. The package includes a metal plate, a light-emitting diode chip, an insulating layer, a lead frame, a reflective coating layer, and a molding material. The light-emitting diode chip is surface-mounted on the metal plate, and the insulating layer is formed on the metal plate and is separated from the light-emitting diode chip. The lead frame is provided on the insulating layer, the reflective coating layer is formed on the lead frame, and the molding material molds the light-emitting diode chip in a predetermined shape.

Abstract: Provided is a package of a light emitting diode. The package according to an embodiment includes a base layer, a light emitting diode chip on the base layer, a lead frame electrically connected to the light emitting diode chip, a reflective coating layer directly on the lead frame, and a molding material covering the light emitting diode chip in a predetermined shape.