Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.

Abstract: Example test methods and apparatus are described. One example method includes receiving an uplink radio frequency signal by a test device from a terminal device, where the uplink radio frequency signal is generated by superimposing at least two test signals, and each of the at least two test signal corresponds to one communication protocol. The test device extracts the at least two test signals from the uplink radio frequency signal. The test device separately tests the at least two test signals, and obtains an uplink test result of the terminal device.

Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.

Abstract: A voltage-mode transmitter includes a serializer, a pre-driver circuit, a driver circuit, and a resistor calibration circuit. The serializer converts a data into a serial data. The pre-driver circuit drives the serial data. The driver circuit includes a slice, a replica slice, a reference voltage generation circuit, a first operational amplifier, and a second operational amplifier. The reference voltage generation circuit is coupled between a first system voltage and a second system voltage and includes a resistor. The resistor calibration circuit is configured to use a first current source and a reference resistor to generate a reference voltage, the first current source being a current source having been calibrated by a bandgap reference (BGR) circuit; to generate a target voltage by causing a current of a second current source to flow through the resistor; and to adjust the resistor according to the reference voltage and the target voltage.

Abstract: This application provides a radio resource measurement method and apparatus. The method includes: determining frequency domain resources of a narrowband on which an RSS pilot is located, where the RSS pilot occupies a part of the frequency domain resources of the narrowband; and determining, based on the frequency domain resource of the narrowband, a first radio resource measurement result corresponding to the RSS pilot. According to the method, UE can determine, based on the frequency domain resource of the narrowband occupied by the RSS pilot, the first radio resource measurement result corresponding to the RSS pilot.

Abstract: A keyboard device includes plural keycaps, a base plate, plural connecting elements and a circuit board. The plural connecting elements are connected with the respective keycaps and the base plate. The circuit board is located over the base plate. The circuit board includes plural membrane switches and plural first capacitance sensing units. When one of the first capacitance sensing units detects an approaching conductor or detects a motion of the conductor, a driving signal is generated or a control signal is outputted.

Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.

Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.

Abstract: A high-bandwidth package-on-package (HBPoP) structure includes a first package structure and a second package structure disposed over the first package structure. The first package structure includes a first package substrate, a semiconductor die, an interposer, and a molding material. The first package substrate is formed of a silicon and/or ceramic material. The semiconductor die is disposed over the first package substrate. The interposer is disposed over the semiconductor die and is formed of a silicon and/or ceramic material. The molding material is disposed between the first package substrate and the interposer and surrounds the semiconductor die.

Abstract: A semiconductor package includes a bottom substrate and a top substrate space apart from the bottom substrate such that the bottom substrate and the top substrate define a gap therebetween. A logic die is mounted on a top surface of the bottom substrate. The logic die has a thickness of 125-350 micrometers. A plurality of copper cored solder balls is disposed between the bottom substrate and the top substrate around the logic die to electrically connect the bottom substrate with the top substrate. A sealing resin fills into the gap between the bottom substrate and the top substrate and sealing the logic die and the plurality of copper cored solder balls in the gap.

Abstract: A semiconductor package structure includes a package substrate, a semiconductor die, an interposer, an adhesive layer, and a molding material. The semiconductor die is disposed over the package substrate. The interposer is disposed over the semiconductor die. The adhesive layer connects the semiconductor die and the interposer. The molding material surrounds the semiconductor die and the adhesive layer.

Abstract: A voltage-mode transmitter includes a serializer, a pre-driver circuit, a driver circuit, and a resistor calibration circuit. The serializer converts a data into a serial data. The pre-driver circuit drives the serial data. The driver circuit includes a slice, a replica slice, a reference voltage generation circuit, a first operational amplifier, and a second operational amplifier. The reference voltage generation circuit is coupled between a first system voltage and a second system voltage and includes a resistor. The resistor calibration circuit is configured to use a first current source and a reference resistor to generate a reference voltage, the first current source being a current source having been calibrated by a bandgap reference (BGR) circuit; to generate a target voltage by causing a current of a second current source to flow through the resistor; and to adjust the resistor according to the reference voltage and the target voltage.

Abstract: A semiconductor assembly package is provided. The semiconductor package assembly includes a system-on-chip (SOC) package, a memory package and a heat spreader. The SOC package includes a logic die and a first substrate. The logic die has pads on it. The first substrate is electrically connected to the logic die by the pads. The memory package includes a second substrate and a memory die. The second substrate has a top surface and a bottom surface. The memory die is mounted on the top surface of the second substrate and is electrically connected to the second substrate using bonding wires. The heat spreader is disposed between the SOC package and the memory package, wherein the heat spreader is in contact with a back surface of the logic die away from the pads.

Abstract: Example test methods and apparatus are described. One example method includes receiving an uplink radio frequency signal by a test device from a terminal device, where the uplink radio frequency signal is generated by superimposing at least two test signals, and each of the at least two test signal corresponds to one communication protocol. The test device extracts the at least two test signals from the uplink radio frequency signal. The test device separately tests the at least two test signals, and obtains an uplink test result of the terminal device.

Abstract: An electronic package is provided, in which at least one first electronic component is arranged on one surface of a circuit structure with circuit layers and a plurality of second electronic components are arranged on the other surface. The first electronic component can electrically bridge two of the plurality of second electronic components via the circuit layers to replace part of the circuit layers of the circuit structure, so that the circuit layers of the circuit structure can maintain a larger wiring specification and reduce the number of circuit layers, thereby improving the process yield.

Abstract: An electronic package is provided, in which at least one first electronic component is arranged on one surface of a circuit structure with circuit layers and a plurality of second electronic components are arranged on the other surface. The first electronic component can electrically bridge two of the plurality of second electronic components via the circuit layers to replace part of the circuit layers of the circuit structure, so that the circuit layers of the circuit structure can maintain a larger wiring specification and reduce the number of circuit layers, thereby improving the process yield.

Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.

Abstract: A method, device, and computer program storage product for generating a query to extract clinical features into a set of electronic medical record (EMR) tables based on clinical knowledge. A knowledge tree is constructed according to a set of clinical knowledge data. An EMR graph corresponding to a set of EMR tables is obtained. The EMR graph comprises at set of table nodes and a set of attribute nodes. The set of table nodes and the set of attribute nodes represent a structure of each EMR table in the set of EMR tables and a reference relationship among attributes of set of EMR tables. A plurality of sub-queries is generated based on the knowledge tree and the EMR graph. At least one query is generated by combining the plurality of sub-queries according to the knowledge tree.

Abstract: Provided is a substrate structure, including a substrate having at least one chamfer formed on a surface thereof, and a plurality of conductive bodies formed to the substrate. Therefore, a stress generated during the packaging process is alleviated through the chamfer, and the substrate structure is prevented from being cracked. An electronic package employing the substrate structure is also provided.