Patents by Inventor Bo Hsiang Huang

Bo Hsiang Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12269135
    Abstract: A work piece holder provided herein includes a support baffle and an elevating element. The support baffle extends along an arc path. The elevating element is disposed on the support baffle and is pivoted to be movable between an unlock status and a lock status.
    Type: Grant
    Filed: April 26, 2023
    Date of Patent: April 8, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsu Tung Yen, Ling-Sung Wang, Chen-Chieh Chiang, Kun-Ei Chen, Bo Hsiang Huang
  • Publication number: 20250076230
    Abstract: A system for monitoring a wafer carrier includes an overhead hoist transport (OHT) vehicle, a scanner, and a processer. The OHT vehicle is configured to transport the wafer carrier along a vertical direction. The scanner is disposed below the OHT vehicle, wherein the wafer carrier is transported vertically by the OHT vehicle to pass through the scanner, and the scanner at least scans a lower portion of the wafer carrier along a horizontal direction and an upper portion of the wafer carrier along the horizontal direction. The processor is coupled to the scanner, wherein the processer receives a scanning result from the scanner after the wafer carrier is scanned, and the scanning result includes information of a gas composition within the wafer carrier. A method of manufacturing a semiconductor structure including a scanning procedure is also provided.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 6, 2025
    Inventors: HSU TUNG YEN, LING-SUNG WANG, CHEN-CHIEH CHIANG, BO HSIANG HUANG
  • Publication number: 20250060686
    Abstract: Semiconductor device is provided. The semiconductor device includes a first pattern and a second pattern. The first pattern includes a first central part and a plurality of first noncentral parts surrounding the first central part and spaced apart from each other. The second pattern is at a second layer over the first layer of the substrate and at least partially overlapping the first pattern along a first direction passing through the first layer and the second layer. The plurality of first noncentral parts define a vortex arrangement.
    Type: Application
    Filed: August 18, 2023
    Publication date: February 20, 2025
    Inventors: HSU TUNG YEN, LING-SUNG WANG, CHEN-CHIEH CHIANG, BO HSIANG HUANG
  • Publication number: 20240404844
    Abstract: A method includes: placing a semiconductor wafer in a chamber during a semiconductor fabrication process; providing a semiconductor cleaning apparatus, the semiconductor cleaning apparatus comprising: a first inlet configured to receive a carrier gas; a gas passageway connected to the first inlet; a second inlet configured to receive one or more fluids; and a fluid passageway connected to the second inlet; delivering the carrier gas from the first inlet to the at least one gas passage branch through the gas passageway; spraying the carrier gas onto the semiconductor wafer; delivering the one or more fluids from the second inlet to the at least one fluid passage branch through the fluid passageway; and spraying the one or more fluids onto the semiconductor wafer.
    Type: Application
    Filed: July 31, 2024
    Publication date: December 5, 2024
    Inventors: Hsu Tung Yen, Chen-Chieh Chiang, Ling-Sung Wang, Che-Li Lin, Bo Hsiang Huang
  • Publication number: 20240387216
    Abstract: A container for receiving a semiconductor device is provided. In one embodiment, the container includes an interior space, a first light reflecting coating in the interior space, a light emitter configured to emit a light from an outside of the interior space into the interior space and toward the first light reflecting coating, and a detector configured to detect the light emitted from the light emitter and reflected by the first light reflecting coating.
    Type: Application
    Filed: May 18, 2023
    Publication date: November 21, 2024
    Inventors: HSU TUNG YEN, BO HSIANG HUANG, CHEN-CHIEH CHIANG, LING-SUNG WANG
  • Publication number: 20240359279
    Abstract: A work piece holder provided herein includes a support baffle and an elevating element. The support baffle extends along an arc path. The elevating clement is disposed on the support baffle and is pivoted to be movable between an unlock status and a lock status.
    Type: Application
    Filed: April 26, 2023
    Publication date: October 31, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsu Tung Yen, Ling-Sung Wang, Chen-Chieh Chiang, Kun-Ei Chen, Bo Hsiang Huang