Abstract: A wafer supporting mechanism and a method for wafer dicing are provided. The wafer supporting mechanism includes a base portion and a support portion. The base portion includes a first gas channel and a first outlet connected to the first gas channel. The support portion is connected to the base portion and including a second gas channel connected to the first gas channel. An accommodation space is defined by the base portion and the support portion.

Abstract: An encrypted hard disk device is provided, including a near-field communication (NFC) sensing module, a processor, a storage unit, and a power switch. The NFC sensing module is configured to read a user identification (UID) of at least one sensor element. The processor is electrically connected to the NFC sensing module and the storage unit. The processor receives the UID and generates a control signal when the UID is approved. The power switch is electrically connected to the processor and the storage unit and maintains a conducting state according to the control signal and supplies power to the storage unit for accessing the storage unit.

Abstract: A wafer supporting mechanism and a method for wafer dicing are provided. The wafer supporting mechanism includes a base portion and a support portion. The base portion includes a first gas channel and a first outlet connected to the first gas channel. The support portion is connected to the base portion and including a second gas channel connected to the first gas channel. An accommodation space is defined by the base portion and the support portion.

Abstract: Disclosed are a compound having a neuroprotective effect, a preparation method therefor and a use thereof. Specifically, the compound has the structure shown by formula I, the definition of each group and substituent being as described in the description. Further disclosed are a preparation method for the compound and a use thereof for neuroprotection.

Abstract: A wafer supporting mechanism and a method for wafer dicing are provided. The wafer supporting mechanism includes a base portion and a support portion. The base portion includes a first gas channel and a first outlet connected to the first gas channel. The support portion is connected to the base portion and including a second gas channel connected to the first gas channel. An accommodation space is defined by the base portion and the support portion.

Abstract: A method of manufacturing a semiconductor structure is provided. The method includes the following operations: providing a semiconductor substrate; performing a first cutting operation along a first set of cutting lines of the semiconductor substrate; and performing a second cutting operation along a second set of cutting lines of the semiconductor substrate later than performing the first cutting operation, wherein the second set of cutting lines are arranged interlacedly with the first set of cutting lines along a first direction.

Abstract: 2-aminopyrimidine compounds and pharmaceutical compositions and uses thereof are provided. Specifically, the 2-aminopyrimidine compounds have a structure as shown in formula I. The compounds are suitable for use in the fields of anti-virus and anti-infection, as well as treatment of diseases such as autoimmune diseases and tumors.

Abstract: The present invention relates to a combination of anti-human VEGFR-2 antibodies and human EGFR tyrosine kinase inhibitors for the treatment of T790M-positive EGFR-mutant non-small cell lung cancer.

Abstract: A tetrahydro-1H-benzazepine compound as a potassium channel modulator, a preparation method, and a medicament containing the compound are provided. Specifically, the compound has the structure shown by formula A, in which the definitions of each group and substituent are described in the description. A preparation method for the compound and its use as potassium channel modulator are also described.

Abstract: An encrypted hard disk device is provided, including a near-field communication (NFC) sensing module, a processor, a storage unit, and a power switch. The NFC sensing module is configured to read a user identification (UID) of at least one sensor element. The processor is electrically connected to the NFC sensing module and the storage unit. The processor receives the UID and generates a control signal when the UID is approved. The power switch is electrically connected to the processor and the storage unit and maintains a conducting state according to the control signal and supplies power to the storage unit for accessing the storage unit.

Abstract: A wafer supporting mechanism and a method for wafer dicing are provided. The wafer supporting mechanism includes a base portion and a support portion. The base portion includes a first gas channel and a first outlet connected to the first gas channel. The support portion is connected to the base portion and including a second gas channel connected to the first gas channel. An accommodation space is defined by the base portion and the support portion.

Abstract: A method of processing a semiconductor wafer is provided. The method includes providing a semiconductor wafer having a front side and a back side, the semiconductor wafer provided with a circuit layer at the front side and a patterned surface at the back side, forming a sacrificial layer on the back side, mounting a tape on the sacrificial layer, the sacrificial layer isolating the patterned surface from the tape, wherein adhesion strength between the sacrificial layer and the patterned surface is larger than that between the sacrificial layer and the tape, dicing the semiconductor wafer at the back side through the tape, defining individual chips on the semiconductor wafer, and expanding the tape to separate the chips from each other.

Abstract: An electronic device is provided. The electronic device includes a metal housing, an insulation element, and an antenna unit. The insulation element is disposed on the metal housing and includes a first heat dissipation hole. The antenna unit is disposed on the insulation element and includes a radiation portion and a feeding portion. The radiation portion is composed of a conductor. The feeding portion is electrically connected to the radiation portion and a grounding plane. In this way, according to the electronic device, space configuration inside the electronic device is saved and a shielding effect of the metal housing is prevented from affecting stability of sending and receiving a signal.

Abstract: Methods and systems for discovery of defects of interest (DOI) buried within three dimensional semiconductor structures and recipe optimization are described herein. The volume of a semiconductor wafer subject to defect discovery and verification is reduced by storing images associated with a subset of the total depth of the semiconductor structures under measurement. Image patches associated with defect locations at one or more focus planes or focus ranges are recorded. The number of optical modes under consideration is reduced based on any of a comparison of one or more measured wafer level defect signatures and one or more expected wafer level defect signatures, measured defect signal to noise ratio, and defects verified without de-processing. Furthermore, verified defects and recorded images are employed to train a nuisance filter and optimize the measurement recipe. The trained nuisance filter is applied to defect images to select the optimal optical mode for production.

Abstract: A method of processing a semiconductor wafer is provided. The method includes providing a semiconductor wafer having a front side and a back side, the semiconductor wafer provided with a circuit layer at the front side and a patterned surface at the back side, forming a sacrificial layer on the back side, mounting a tape on the sacrificial layer, the sacrificial layer isolating the patterned surface from the tape, wherein adhesion strength between the sacrificial layer and the patterned surface is larger than that between the sacrificial layer and the tape, dicing the semiconductor wafer at the back side through the tape, defining individual chips on the semiconductor wafer, and expanding the tape to separate the chips from each other.

Abstract: An electronic device is provided. The electronic device includes a metal housing, an insulation element, and an antenna unit. The insulation element is disposed on the metal housing and includes a first heat dissipation hole. The antenna unit is disposed on the insulation element and includes a radiation portion and a feeding portion. The radiation portion is composed of a conductor. The feeding portion is electrically connected to the radiation portion and a grounding plane. In this way, according to the electronic device, space configuration inside the electronic device is saved and a shielding effect of the metal housing is prevented from affecting stability of sending and receiving a signal.

Abstract: The present invention relates to a combination of anti-human VEGFR-2 antibodies and human EGFR tyrosine kinase inhibitors for the treatment of T790M-positive EGFR-mutant non-small cell lung cancer.

Abstract: A package structure for a backlight module includes a flexible base film, a plurality of pads, a light-emitting component, a patterned circuit layer. The flexible base film includes a plurality of conductive vias, a first surface, and a second surface opposite to the first surface. The conductive vias connect the first surface and the second surface. In addition, a material of the flexible base film includes polyimide and white fillings. The pads are disposed on the first surface. The conductive vias are connected to the pads. The light-emitting component is disposed on the pads and electrically connected to the pads. The patterned circuit layer is disposed on the second surface and electrically connected to the conductive vias.

Abstract: A package structure for a backlight module includes a flexible base film, a plurality of pads, a light-emitting component, a patterned circuit layer. The flexible base film includes a plurality of conductive vias, a first surface, and a second surface opposite to the first surface. The conductive vias connect the first surface and the second surface. In addition, a material of the flexible base film includes polyimide and white fillings. The pads are disposed on the first surface. The conductive vias are connected to the pads. The light-emitting component is disposed on the pads and electrically connected to the pads. The patterned circuit layer is disposed on the second surface and electrically connected to the conductive vias.

Abstract: A diamond wire saw includes a steel wire, a molded sleeve, and a plurality of diamond bead bearing units. The molded sleeve surrounds and is bonded to the steel wire. The diamond bead bearing units are disposed around and bonded to the molded sleeve. Each of the diamond bead bearing units includes a tubular body and a functional layer that covers the tubular body and that contains a plurality of abrasive diamond particles. The molded sleeve is made of polyether-type thermoplastic polyurethane, and has a Shore hardness of greater than or equal to 70 D.