Patents by Inventor Bo-Hua CHENG

Bo-Hua CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DIAMOND WIRE SAW
    Publication number: 20180326617
    Abstract: A diamond wire saw includes a steel wire, a molded sleeve, and a plurality of diamond bead bearing units. The molded sleeve surrounds and is bonded to the steel wire. The diamond bead bearing units are disposed around and bonded to the molded sleeve. Each of the diamond bead bearing units includes a tubular body and a functional layer that covers the tubular body and that contains a plurality of abrasive diamond particles. The molded sleeve is made of polyether-type thermoplastic polyurethane, and has a Shore hardness of greater than or equal to 70 D.
    Type: Application
    Filed: May 12, 2017
    Publication date: November 15, 2018
    Applicant: STONE & RESOURCE INDUSTRY R&D CENTER
    Inventors: Chih-Chen KUO, Ching-Fang CHEN, Bo-Hong WU, Chao-Hung LEE, Bo-Hua CHENG