Patents by Inventor Bo Hyun Chung

Bo Hyun Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fixing Structure of Electrode Terminal, and Battery, Battery Pack and Vehicle Including the Same
    Publication number: 20240322316
    Abstract: Disclosed is a fixing structure of an electrode terminal, and a battery, a battery pack and a vehicle including the same. The fixing structure of an electrode terminal includes a battery housing having an open end and a bottom portion in which a perforation hole is formed; an electrode terminal installed through the perforation hole not to contact an inner wall of the perforation hole; and a terminal gasket interposed between the electrode terminal and the perforation hole. A hot-melt layer is interposed at the interface between the electrode terminal and the terminal gasket or the interface between the terminal gasket and the battery housing.
    Type: Application
    Filed: July 21, 2023
    Publication date: September 26, 2024
    Applicant: LG Energy Solution, Ltd.
    Inventors: Jeong-Seop Oh, Bo-Hyun Kang, Do-Gyun Kim, Gu-Min Lim, Min-Ki Jo, Kwang Su Hwangbo, Seon-Min Lee, Gu-Jin Chung
  • Light emitting device package and backlight unit comprising the same
    Patent number: 9142747
    Abstract: Disclosed is a light emitting element package having excellent heat radiation performance and high luminance, and a backlight unit including the same. The light emitting element package includes a package including a lead frame, a light emitting element provided on the lead frame, and a molded material combined with the lead frame and having an opening for emitting light generated by the light emitting element, and a reflection structure having an opening corresponding to the opening of the molded material, and contacting the molded material.
    Type: Grant
    Filed: November 16, 2012
    Date of Patent: September 22, 2015
    Assignee: LUMENS CO., LTD.
    Inventors: Seung Hyun Oh, Pyoung Gug Kim, Seung Hoon Lee, Chun Ki Min, Jung A Lim, Jun Hyung Lim, Cheol Hun Jung, Bo Hyun Chung
  • LIGHT EMITTING DEVICE PACKAGE AND BACKLIGHT UNIT COMPRISING THE SAME
    Publication number: 20140328083
    Abstract: Disclosed is a light emitting element package having excellent heat radiation performance and high luminance, and a backlight unit including the same. The light emitting element package includes a package including a lead frame, a light emitting element provided on the lead frame, and a molded material combined with the lead frame and having an opening for emitting light generated by the light emitting element, and a reflection structure having an opening corresponding to the opening of the molded material, and contacting the molded material.
    Type: Application
    Filed: November 16, 2012
    Publication date: November 6, 2014
    Inventors: Seung Hyun Oh, Pyoung Gug Kim, Seung Hoon Lee, Chun Ki Min, Jung A Lim, Jun Hyung Lim, Cheol Hun Jung, Bo Hyun Chung
  • Light emitting device package and backlight unit comprising the same
    Patent number: RE47444
    Abstract: Disclosed is a light emitting element package having excellent heat radiation performance and high luminance, and a backlight unit including the same. The light emitting element package includes a package including a lead frame, a light emitting element provided on the lead frame, and a molded material combined with the lead frame and having an opening for emitting light generated by the light emitting element, and a reflection structure having an opening corresponding to the opening of the molded material, and contacting the molded material.
    Type: Grant
    Filed: May 5, 2016
    Date of Patent: June 18, 2019
    Assignee: LUMENS CO., LTD.
    Inventors: Seung Hyun Oh, Pyoung Gug Kim, Seung Hoon Lee, Chun Ki Min, Jung A Lim, Jun Hyung Lim, Cheol Hun Jung, Bo Hyun Chung
  • Light emitting device package and backlight unit comprising the same
    Patent number: RE48474
    Abstract: Disclosed is a light emitting element package having excellent heat radiation performance and high luminance, and a backlight unit including the same. The light emitting element package includes a package including a lead frame, a light emitting element provided on the lead frame, and a molded material combined with the lead frame and having an opening for emitting light generated by the light emitting element, and a reflection structure having an opening corresponding to the opening of the molded material, and contacting the molded material.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: March 16, 2021
    Assignee: LUMENS CO., LTD.
    Inventors: Seung Hyun Oh, Pyoung Gug Kim, Seung Hoon Lee, Chun Ki Min, Jung A Lim, Jun Hyung Lim, Cheol Hun Jung, Bo Hyun Chung