Patents by Inventor Bo-Hyun Shin

Bo-Hyun Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11291623
    Abstract: The present disclosure relates to a cosmetic composition, and more specifically to a cosmetic composition for skin moisturization. The composition contains, as an active ingredient, a composite seawater extract obtained by mixing each of seawater extracts of Brussels sprouts, lima beans, and artichokes. The composite extract extracted from vegetables of Brussels sprouts, lima beans and artichokes by a natural method using seawater has excellent skin water loss-preventing and skin barrier-enhancing effects, and superior skin moisturizing ability. Therefore, the cosmetic composition containing the composite extract, as an active ingredient, can be advantageously used as a cosmetic material having excellent skin moisturizing ability.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: April 5, 2022
    Assignee: AMOREPACIFIC CORPORATION
    Inventors: Su Jeong Shin, Kil Sun Myoung, Bo Hyun Shin, Eun Soo Lee, Yu Jin Jin
  • Publication number: 20210212924
    Abstract: The present disclosure relates to a cosmetic composition, and more specifically to a cosmetic composition for skin moisturization. The composition contains, as an active ingredient, a composite seawater extract obtained by mixing each of seawater extracts of Brussels sprouts, lima beans, and artichokes. The composite extract extracted from vegetables of Brussels sprouts, lima beans and artichokes by a natural method using seawater has excellent skin water loss-preventing and skin barrier-enhancing effects, and superior skin moisturizing ability. Therefore, the cosmetic composition containing the composite extract, as an active ingredient, can be advantageously used as a cosmetic material having excellent skin moisturizing ability.
    Type: Application
    Filed: October 4, 2018
    Publication date: July 15, 2021
    Applicant: AMOREPACIFIC CORPORATION
    Inventors: Su Jeong SHIN, Kil Sun MYOUNG, Bo Hyun SHIN, Eun Soo LEE, Yu Jin JIN
  • Publication number: 20200368142
    Abstract: A cosmetic composition containing a mixture of Brassica oleracea var. acephala seawater extract, Nasturtium officinale seawater extract and Beta vulgaris Root seawater extract is disclosed. The cosmetic composition enhances the barrier function of the skin, improves skin moisturizing ability and promotes cell turnover. A use of the composition for improving skin condition and for the manufacture of cosmetics, which function to enhance the barrier function of the skin, improve skin moisturizing ability, and promote skin cell turnover is disclosed.
    Type: Application
    Filed: October 26, 2018
    Publication date: November 26, 2020
    Applicant: AMOREPACIFIC CORPORATION
    Inventors: Su Jeong SHIN, Kil Sun MYOUNG, Bo Hyun SHIN, Eun Soo LEE, Yu jin JIN
  • Publication number: 20190072962
    Abstract: The present invention relates to a drone for collecting and providing image data for bomb damage assessment and an air-to-ground weapon system equipped with the drone. The air-to-ground weapon system includes: a hitting means moving to a bombardment target to hit the bombardment target; and a drone detachably attached to the hitting means.
    Type: Application
    Filed: February 14, 2017
    Publication date: March 7, 2019
    Applicant: EXENS Co.,LTD.
    Inventor: Bo Hyun SHIN
  • Patent number: 7170313
    Abstract: Disclosed is a device for calibrating termination voltage of an on-die termination. The device for calibrating termination voltage of an on-die termination for a semiconductor memory device having a DLL device, comprises an on-die termination enable signal generating part for outputting an ODT enable signal for driving the on-die termination (ODT) when a signal DLL Reset EMRS is applied, a counter circuit of for outputting a plurality of counter signals, an on-die termination (ODT) including a variable resistor part controlled by the counter signals outputted from the counter circuit and outputting a variable termination voltage according to a resistance value of the variable resistor part, and a first control part for comparing a reference voltage with the termination voltage and outputting a control signal for controlling the counter circuit according to a comparison result.
    Type: Grant
    Filed: November 30, 2004
    Date of Patent: January 30, 2007
    Assignee: Hynix Semiconductor Inc.
    Inventor: Bo Hyun Shin
  • Patent number: 6947334
    Abstract: There is provided a synchronous memory device, in which a data input setup timing is calibrated. The synchronous memory device includes: a data input unit for calibrating a timing of data inputted in synchronization with a data strobe signal; and a first setup time control unit for detecting an input timing of an OCD control code data inputted to the data input unit in an OCD calibration mode, and for controlling a data output timing of the data input unit.
    Type: Grant
    Filed: June 28, 2004
    Date of Patent: September 20, 2005
    Assignee: Hynix Semiconductor, INC
    Inventor: Bo-Hyun Shin
  • Publication number: 20050141330
    Abstract: There is provided a synchronous memory device, in which a data input setup timing is calibrated. The synchronous memory device includes: a data input unit for calibrating a timing of data inputted in synchronization with a data strobe signal; and a first setup time control unit for detecting an input timing of an OCD control code data inputted to the data input unit in an OCD calibration mode, and for controlling a data output timing of the data input unit.
    Type: Application
    Filed: June 28, 2004
    Publication date: June 30, 2005
    Inventor: Bo-Hyun Shin
  • Patent number: 6104095
    Abstract: A printed circuit board (PCB) for use in chip-on-board (COB) packages reduces failures due to warping of the COB packages. The PCB includes a board body having a upper surface and a lower surface, a chip bonding area on the upper surface for attaching a semiconductor device, and a plurality of conductors in a circuit pattern on the upper surface outside the chip bonding area, for electrical connection to the semiconductor device using a plurality of bonding wires. An encapsulation region encloses the chip bonding area, the bonding wires, a portion of the plurality of conductors, and a portion of the upper surface. The board includes external contacts on the lower surface for electrical connections to an external electrical appliance, and via holes through the board body for electrically connecting the plurality of conductors in the circuit pattern to the external contacts.
    Type: Grant
    Filed: May 1, 1998
    Date of Patent: August 15, 2000
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Bo Hyun Shin, Min Cheol An
  • Patent number: 6028774
    Abstract: A base card improves the mounting reliability of a COB package particularly when the package has molding by-products such as epoxy burrs or molding flashes. The base card has a COB package receiving part made up of first and second sections. The receiving part is stepped so that the sections thereof have shapes that are complementary to that of and for receiving a peripheral portion of the printed circuit board of the COB package and the package body the COB package, respectively. The second section has a bevel at the transition of the first section into the second section. This bevel helps define a space in which the by-products are accommodated when the COB package is mounted to the base card. Further, the second section of the COB package receiving part may define an opening in the bottom surface of the base card.
    Type: Grant
    Filed: May 19, 1998
    Date of Patent: February 22, 2000
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Bo Hyun Shin, Jung Hwan Cuun, Min Cheol An