Abstract: An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.

Abstract: A light sensing module includes a substrate, a light sensing unit, a first light-transmissive component, and a light shielding layer. The light sensing unit is disposed on the substrate to sense an intensity of a working light beam, and has an upper light receiving surface and a lateral surface perpendicular to the upper light receiving surface. The first light-transmissive component covers the light sensing unit, and has a first refractive index between a refractive index of the light sensing unit and a refractive index of air. The light shielding layer surrounds the lateral surface and is covered by the first light-transmissive component.

Abstract: A light sensing module and an electronic device using the same are provided. The light sensing module includes a substrate, a light sensing unit, a first light-transmissive component and a blocking wall. The light sensing unit is disposed on the substrate to sense an intensity of a working light beam. The first light-transmissive component covers the light sensing unit, and has a first refractive index that is between a refractive index of the light sensing unit and a refractive index of air. The blocking wall is disposed on the substrate, and surrounds the light sensing unit and the first light-transmissive component.

Abstract: An optoelectronic package structure is provided. The optoelectronic package structure includes a carrier, a metal member, an insulating layer, an optoelectronic element, and an adhesive. The metal member is disposed on the carrier. The insulating layer is disposed on the metal member. The insulating layer has a plurality of grooves, and a carrying region is defined by the grooves. The optoelectronic element is disposed on the insulating layer. The adhesive is filled into the grooves and bonds the optoelectronic element onto the carrying region of the insulating layer.

Abstract: An optical sensor structure is provided. The optical sensor structure includes a substrate, a light sensing unit, a peripheral wall, and a reflective layer. The substrate includes a plurality of metal pads. The light sensing unit is disposed on the substrate and electrically connected to the plurality of metal pads. The peripheral wall is disposed on the substrate, and the peripheral wall and the substrate define an accommodating space. The metal pads and the light sensing unit are positioned in the accommodating space. The reflective layer is disposed in the accommodating space and surrounds the light sensing unit.

Abstract: An optical sensor structure is provided. The optical sensor structure includes a substrate, a light sensing unit, a peripheral wall, and a reflective layer. The substrate includes a plurality of metal pads. The light sensing unit is disposed on the substrate and electrically connected to the plurality of metal pads. The peripheral wall is disposed on the substrate, and the peripheral wall and the substrate define an accommodating space. The metal pads and the light sensing unit are positioned in the accommodating space. The reflective layer is disposed in the accommodating space and surrounds the light sensing unit.

Abstract: An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.

Abstract: An optical sensor module includes a first frame set, a second frame set and a housing which partially covers the first frame set and the second frame set. The first frame set has a first chip-mounting frame and a first wiring frame. The first chip-mounting frame has a first chip-mounting section, and a first conductive lead. At least one first indentation is formed on the first chip-mounting section. The second frame set has a second chip-mounting frame and a second wiring frame. The second chip-mounting frame has a second chip-mounting section and a second conductive lead. At least one second indentation is formed on the second chip-mounting section.

Abstract: A light sensing module and an electronic device using the same are provided. The light sensing module includes a substrate, a light sensing unit, a first light-transmissive component and a blocking wall. The light sensing unit is disposed on the substrate to sense an intensity of a working light beam. The first light-transmissive component covers the light sensing unit, and has a first refractive index that is between a refractive index of the light sensing unit and a refractive index of air. The blocking wall is disposed on the substrate, and surrounds the light sensing unit and the first light-transmissive component.

Abstract: An optical sensor module includes a first frame set, a second frame set and a housing which partially covers the first frame set and the second frame set. The first frame set has a first chip-mounting frame and a first wiring frame. The first chip-mounting frame has a first chip-mounting section, and a first conductive lead. At least one first indentation is formed on the first chip-mounting section. The second frame set has a second chip-mounting frame and a second wiring frame. The second chip-mounting frame has a second chip-mounting section and a second conductive lead. At least one second indentation is formed on the second chip-mounting section.