Patents by Inventor Bo-Ju Su

Bo-Ju Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Case assembly for computer mainframe
    Patent number: 6370023
    Abstract: A case assembly for computer mainframe is constructed to include a rectangular hollow shell holding a motherboard, a power supply housing perpendicularly fastened to the rectangular hollow shell at one side of the motherboard and partially protruding over the open side of the rectangular hollow shell, the power supply housing holding an electric fan for dissipation of heat, and a board covered on the open side of the rectangular hollow shell and stopped against the power supply housing, the board having an air conduit adapted for guiding air from the electric fan to air vents on the peripheral wall of the rectangular hollow shell for quick dissipation of heat during the operation of the motherboard.
    Type: Grant
    Filed: July 21, 2000
    Date of Patent: April 9, 2002
    Assignee: Inventec Corporation
    Inventor: Bo-Ju Su