Patents by Inventor Bo-Keun SHIM

Bo-Keun SHIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for testing a semiconductor package
    Patent number: 9244119
    Abstract: An apparatus for testing a semiconductor package including a shuttle, a socket and a pressing unit may be provided. The shuttle may include a pocket, which is configured to receive the semiconductor package and a printed circuit board (PCB). The PCB may be configured to make electrical contact with the semiconductor package. The socket may be arranged under the shuttle and include socket pins configured to make electrical contact with the PCB. The pressing unit may be arranged on the shuttle and may be movable in a vertical direction. The pressing unit may press on the shuttle toward the socket such that the semiconductor package may be electrically connected to the socket pins. Because the semiconductor package received in the shuttle may make contact with the socket at the testing region to test the semiconductor package, the semiconductor package may not fall off or may not be slanted.
    Type: Grant
    Filed: October 22, 2013
    Date of Patent: January 26, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Gui-Heum Choi, In-Sik Kim, Bo-Keun Shim, Sung-Jae Lim
  • APPARATUS FOR TESTING A SEMICONDUCTOR PACKAGE
    Publication number: 20140253168
    Abstract: An apparatus for testing a semiconductor package including a shuttle, a socket and a pressing unit may be provided. The shuttle may include a pocket, which is configured to receive the semiconductor package and a printed circuit board (PCB). The PCB may be configured to make electrical contact with the semiconductor package. The socket may be arranged under the shuttle and include socket pins configured to make electrical contact with the PCB. The pressing unit may be arranged on the shuttle and may be movable in a vertical direction. The pressing unit may press on the shuttle toward the socket such that the semiconductor package may be electrically connected to the socket pins. Because the semiconductor package received in the shuttle may make contact with the socket at the testing region to test the semiconductor package, the semiconductor package may not fall off or may not be slanted.
    Type: Application
    Filed: October 22, 2013
    Publication date: September 11, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Gui-Heum CHOI, In-Sik KIM, Bo-Keun SHIM, Sung-Jae LIM