Patents by Inventor Bo KONG

Bo KONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11968513
    Abstract: The application discloses a vibration sounding device including a housing body with a containment cavity, a sounding unit placed in the containment cavity, a weight, a drive coil and a spring plate. The spring plate includes a first fixed section for fixed connection with the weight and a second fixed section for fixed connection with the housing body. The first fixed section and the second fixed section are fixed by laser spot welding. Compared with the prior art, the first fixed section and the second fixed section are fixed by laser spot welding, which can improve the bonding strength between the first fixed section and the second fixed section, and ensures the strength of the spring plate when the vibration sounding device is working.
    Type: Grant
    Filed: June 6, 2022
    Date of Patent: April 23, 2024
    Assignee: AAC Microtech (Changzhou) Co., Ltd.
    Inventors: Bo Xiao, Chenliang Kong, Tong Zhang, Ronglin Linghu
  • Patent number: 11968515
    Abstract: The present invention provides a multifunctional sounding device including a housing, a first vibration system, a second vibration system, a magnetic circuit system, an elastic component and a flexible circuit board. The elastic component includes a deformation part fixed to the second vibration system and an installation part extended from both ends of the deformation part and fixed to the housing. The second vibration system is suspended in the containment cavity through the elastic component. The flexible circuit board is connected with the elastic component, so that the vibration of the flexible circuit board is coupled with the vibration of the elastic component. Therefore, the damping of the elastic component is reduced, the force received by the elastic component during vibration is reduced, and the service life of the elastic component is extended.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: April 23, 2024
    Assignee: AAC Microtech (Changzhou) Co., Ltd.
    Inventors: Bo Xiao, Chenliang Kong, Tong Zhang, Ronglin Linghu
  • Patent number: 11968514
    Abstract: The application relates to a vibration sounding device including: a housing body with a containment cavity and a sounding unit arranged in the containment cavity. The sounding unit includes a vibration system and a magnetic circuit system. The magnetic circuit system includes a main magnet and a secondary magnet assembly. The vibration sounding device also includes an elastic assembly, a weight assembly, and a drive coil. The second direction is perpendicular to the first direction. By virtue of the configuration, it is beneficial to simplify the forming process of the weight assembly, reduce the production cost, and also facilitate the replacement of the drive coil.
    Type: Grant
    Filed: June 6, 2022
    Date of Patent: April 23, 2024
    Assignee: AAC Microtech (Changzhou) Co., Ltd.
    Inventors: Bo Xiao, Chenliang Kong, Tong Zhang, Ronglin Linghu
  • Publication number: 20240127770
    Abstract: Embodiments include methods and devices for per layer motion adaptive over-drive strength control for a display panel. Various embodiments may include determining motion information associated with a frame layer, determining an over-drive strength factor for the frame layer based at least in part on the motion information associated with the frame layer, and determining whether the over-drive strength factor is associated with computing a content difference. Various embodiments may include, in response to determining that the over-drive strength factor is associated with computing a content difference, performing fragment shading on the framebuffer object for the frame layer to generate an over-drive compensated framebuffer object for the frame layer based at least in part on the over-drive strength factor, and outputting the over-drive compensated framebuffer object for the frame layer to a default framebuffer for rendering on the display panel.
    Type: Application
    Filed: April 20, 2021
    Publication date: April 18, 2024
    Inventors: Nan ZHANG, Bo DU, Ya KONG, Yongjun XU
  • Patent number: 11953235
    Abstract: A low-heat-loss operation method of a line-focusing heat collection system and the line-focusing heat collection system are provided. The method includes the following steps. Solar energy is utilized to preheat a collector tube in an empty tube state, so that the collector tube is in a preheating mode. After a set preheating temperature is reached, a heat transfer working medium is injected into the collector tube. In the injection process of the heat transfer working medium, an injection section of the collector tube is converted into a focusing mode from a preheating mode. After heat collection is finished, the circulation of the heat transfer working medium is stopped, and the focusing mode of the collector tube is kept. In the drainage process of the heat transfer working medium, an emptying section of the collector tube is converted into a light heat-tracing mode from a focusing mode.
    Type: Grant
    Filed: August 31, 2023
    Date of Patent: April 9, 2024
    Assignees: Lanzhou Dacheng Technology Co., Ltd., Dunhuang Dacheng Shengneng Technology Co., Ltd.
    Inventors: Duowang Fan, Duojin Fan, Linggang Kong, Wenye Qi, Yulei Fan, Xiaoming Yao, Zhiyong Zhang, Bo Li, Fujun Zhao, Zhilin Liu, Guodong Wang, Wen Li, Chongchong Zhang
  • Publication number: 20240113242
    Abstract: The photovoltaic module includes multiple cell sheets arranged in an array including multiple rows and multiple columns, where each of the multiple rows of cell sheets is arranged at intervals along a first direction, each of the multiple columns of cell sheets is arranged at intervals along a second direction, and each of the multiple cell sheets has a first surface and a second surface. The photovoltaic module further includes a first flexible cover layer located on a side of the first surface of each of the multiple cell sheets, and a second flexible cover layer located on a side of the second surface of each of the multiple cell sheets. The photovoltaic module is configured to be folded along a gap between two adjacent rows of cell sheets or along a gap between two adjacent columns of cell sheets with the folding angle of 0 degree to 180 degrees.
    Type: Application
    Filed: July 21, 2023
    Publication date: April 4, 2024
    Inventors: Ning LI, Pengjun XIAO, Zhigang DAI, Sen YANG, Weichong KONG, Bo LI, Jiaxiang YIN, Chunhua TAO
  • Patent number: 11950046
    Abstract: The present invention provides a multifunctional sounding device including a housing, a first vibration system, a second vibration system, a magnetic circuit system, an elastic component and a flexible circuit board. The elastic component includes a deformation part fixed to the second vibration system and an installation part extended from both ends of the deformation part and fixed to the housing. The second vibration system is suspended in the containment cavity through the elastic component. The flexible circuit board is connected with the elastic component, so that the vibration of the flexible circuit board is coupled with the vibration of the elastic component. Therefore, the damping of the elastic component is reduced, the force received by the elastic component during vibration is reduced, and the service life of the elastic component is extended.
    Type: Grant
    Filed: June 6, 2022
    Date of Patent: April 2, 2024
    Assignee: AAC Microtech (Changzhou) Co., Ltd.
    Inventors: Bo Xiao, Chenliang Kong, Tong Zhang, Ronglin Linghu
  • Publication number: 20240091170
    Abstract: Provided are catechol nanoparticles, catechol protein nanoparticles, and a preparation method and use thereof. The method includes: adding a tannin compound-containing natural herb medicine into water to obtain a mixture, and subjecting the mixture to heating reflux extraction to obtain a herb medicine extract and subjecting the herb medicine extract to fractionation to obtain the catechol nanoparticles.
    Type: Application
    Filed: August 1, 2023
    Publication date: March 21, 2024
    Applicant: Shihezi University
    Inventors: Bo HAN, Jingmin Fan, Hang Yu, Rui Xue, Jiawei Guan, Yu Xu, Linyun He, Ji Liu, Chengyu Jiang, Xin Lu, Xiangze Kong, Wei Yu, Wen Chen
  • Patent number: 11917750
    Abstract: A shielding structure for a system-in-package includes a substrate having stacked first ground planes in the substrate, a second ground plane on a surface of the substrate, and a ground pad arranged along an edge of the substrate disposed on the second ground plane. In addition, ground holes disposed in the substrate electrically couple the adjacent ground planes. The ground holes are arranged in a ring around a board body and spacing between the adjacent ground holes is less than a specified distance in an arrangement that defines a Faraday cage. A device is disposed on the opposing surface of the substrate and a package layer is disposed on the device.
    Type: Grant
    Filed: February 17, 2020
    Date of Patent: February 27, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Huijuan Wang, Jinsen Cai, Bin Hu, Bo Kong, Tian Zhao
  • Publication number: 20240058864
    Abstract: The broad applicability of at least certain aspects of the present invention derives from the ability to determine the critical location where secondary satellite formation occurs for any atomization system or design and allows for the rapid assessment of the effectiveness of various satellite reduction strategies, including but not limited to several embodiments detailed herein. Aspects of this invention can be utilized during initial atomization system design in order to evaluate effective chamber geometries and enabling strategies which reduce/eliminate satelliting, or can be retrofit to existing systems and allows for economic evaluation of effectiveness based off of initial capital expenditures versus increased operating requirements/expenses.
    Type: Application
    Filed: September 12, 2023
    Publication date: February 22, 2024
    Inventors: Iver E. Anderson, Jordan A. Tiarks, Timothy E. Prost, Bo Kong, Emma H. White, Trevor M. Riedemann, Eric J. Deaton, Ross Anderson, David Byrd, Franz Hugolino Hernandez Gaitan
  • Patent number: 11904571
    Abstract: A composite material structure includes a first metal member and a second metal member bonding to the first metal member. A bonding surface is formed therebetween. A first hole is through the first metal member. A circular bonding line is formed at a junction of a wall of the first hole and the bonding surface. A sleeve protrudes from the second metal member into the first hole, and covers the bonding line. A groove indents from the first metal member. The groove has a bottom surface located in the same plane with a top surface of the sleeve. A processing method of the composite material structure is also provided. The sleeve covers the bonding line between the first metal member and the second metal member, which allows the composite material structure to provide an improved sealing performance.
    Type: Grant
    Filed: December 19, 2022
    Date of Patent: February 20, 2024
    Assignee: Fulian Yuzhan Precision Technology Co., Ltd.
    Inventors: Min Yan, Jiang-Bo Kong, Jie Wang, Shao-Wen Liu, Lei Zhu
  • Publication number: 20230345848
    Abstract: A resistive random access memory includes a first dielectric layer, a bottom electrode on the first dielectric layer, a variable-resistance layer on the bottom electrode and having a U-shaped cross-sectional profile, a top electrode on the variable-resistance layer and filling a recess in the variable-resistance layer, a second dielectric layer on the first dielectric layer and around the variable-resistance layer and the bottom electrode, and a spacer on the bottom electrode and inserting between the variable-resistance layer and the second dielectric layer.
    Type: Application
    Filed: July 5, 2023
    Publication date: October 26, 2023
    Applicant: United Semiconductor (Xiamen) Co., Ltd.
    Inventors: Dejin KONG, Jinjian OUYANG, Xiang Bo KONG, Wen Yi TAN
  • Patent number: 11780012
    Abstract: The broad applicability of at least certain aspects of the present invention derives from the ability to determine the critical location where secondary satellite formation occurs for any atomization system or design and allows for the rapid assessment of the effectiveness of various satellite reduction strategies, including but not limited to several embodiments detailed herein. Aspects of this invention can be utilized during initial atomization system design in order to evaluate effective chamber geometries and enabling strategies which reduce/eliminate satelliting, or can be retrofit to existing systems and allows for economic evaluation of effectiveness based off of initial capital expenditures versus increased operating requirements/expenses.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: October 10, 2023
    Assignee: Iowa State University Research Foundation, Inc.
    Inventors: Iver E. Anderson, Jordan A. Tiarks, Timothy E. Prost, Bo Kong, Emma H. White, Trevor M. Riedemann, Eric J. Deaton, Ross Anderson, David Byrd, Franz Hugolino Hernandez Gaitan
  • Patent number: 11737381
    Abstract: A resistive random access memory includes a bottom electrode, a variable-resistance layer on the bottom electrode and having a U-shaped cross-sectional profile, and a top electrode on the variable-resistance layer and filling a recess in the variable-resistance layer.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: August 22, 2023
    Assignee: United Semiconductor (Xiamen) Co., Ltd.
    Inventors: Dejin Kong, Jinjian Ouyang, Xiang Bo Kong, Wen Yi Tan
  • Publication number: 20230202140
    Abstract: A composite material structure includes a first metal member and a second metal member bonding to the first metal member. A bonding surface is formed therebetween. A first hole is through the first metal member. A circular bonding line is formed at a junction of a wall of the first hole and the bonding surface. A sleeve protrudes from the second metal member into the first hole, and covers the bonding line. A groove indents from the first metal member. The groove has a bottom surface located in the same plane with a top surface of the sleeve. A processing method of the composite material structure is also provided. The sleeve covers the bonding line between the first metal member and the second metal member, which allows the composite material structure to provide an improved sealing performance.
    Type: Application
    Filed: December 19, 2022
    Publication date: June 29, 2023
    Inventors: MIN YAN, JIANG-BO KONG, JIE WANG, SHAO-WEN LIU, LEI ZHU
  • Publication number: 20230028649
    Abstract: The present disclosure provides a device and methods for determining the original stratum direction of a core. The device includes a confining pressure pump, a resistance meter, and a core holder composed of upper and lower portions. The present disclosure further provides three methods for determining the original stratum direction of the core. The three methods respectively use the device to measure resistance values at different positions of the core, and compare a test result with an imaging result of resistivity imaging logging data to determine the rock direction of the core in a stratum.
    Type: Application
    Filed: September 23, 2022
    Publication date: January 26, 2023
    Inventors: Jiahuan HE, Lurui DANG, Keming ZHOU, Cheng LEI, Mei HUANG, Jintao ZHANG, Bo KONG
  • Publication number: 20220416159
    Abstract: A resistive memory device includes a stacked structure and a copper via conductor structure. The stacked structure includes a first electrode, a second electrode, and a variable resistance layer. The second electrode is disposed above the first electrode in a vertical direction, and the variable resistance layer is disposed between the first electrode and the second electrode in the vertical direction. The copper via conductor structure is disposed under the stacked structure. The first electrode includes a tantalum nitride layer directly connected with the copper via conductor structure.
    Type: Application
    Filed: July 29, 2021
    Publication date: December 29, 2022
    Applicant: United Semiconductor (Xiamen) Co., Ltd.
    Inventors: Shuzhi Zou, DEJIN KONG, Xiang Bo Kong, Chin-Chun Huang, WEN YI TAN
  • Publication number: 20220336740
    Abstract: A resistive random access memory includes a bottom electrode, a variable-resistance layer on the bottom electrode and having a U-shaped cross-sectional profile, and a top electrode on the variable-resistance layer and filling a recess in the variable-resistance layer.
    Type: Application
    Filed: May 21, 2021
    Publication date: October 20, 2022
    Inventors: DEJIN KONG, JINJIAN OUYANG, Xiang Bo Kong, WEN YI TAN
  • Publication number: 20220219142
    Abstract: The present invention discloses a polymeric lanthanum nanocomposite, and a preparation method and application thereof and relates to the field of environmental functional materials. The preparation method includes the following steps: (1) mixing lanthanum chloride heptahydrate with concentrated hydrochloric acid and dissolving the mixture in alcohol, adding a resin polymer, and stirring at room temperature; (2) draining the resin after the stirring for use; (3) adding the resin to a precipitant solution, and stirring at room temperature and then filtering out the resin; and (4) washing the resin with water until the resin is neutral, adding a NaCl solution, stirring and then filtering out the resin, and drying to obtain the polymeric lanthanum nanocomposite. The prepared polymeric lanthanum nanocomposites have a relatively more uniform distribution, and show a higher phosphorus adsorption rate.
    Type: Application
    Filed: September 9, 2020
    Publication date: July 14, 2022
    Inventors: Yanyang ZHANG, Bo KONG, Bingcai PAN, Xiang GAO
  • Publication number: 20220141950
    Abstract: A shielding structure for a system-in-package includes a substrate having stacked first ground planes in the substrate, a second ground plane on a surface of the substrate, and a ground pad arranged along an edge of the substrate disposed on the second ground plane. In addition, ground holes disposed in the substrate electrically couple the adjacent ground planes. The ground holes are arranged in a ring around a board body and spacing between the adjacent ground holes is less than a specified distance in an arrangement that defines a Faraday cage. A device is disposed on the opposing surface of the substrate and a package layer is disposed on the device.
    Type: Application
    Filed: February 17, 2020
    Publication date: May 5, 2022
    Inventors: Huijuan Wang, Jinsen Cai, Bin Hu, Bo Kong, Tian Zhao