Abstract: Disclosed is a high-strength free-cutting leadless copper alloy with excellent machinability and corrosion-resistance. The free-cutting leadless copper alloy contains 58 to 70 wt % of copper (Cu), 0.5 to 2.0 wt % of tin (Sn), 0.1 to 2.0 wt % of silicon (Si), a balance amount of zinc (Zn), and inevitable impurities but does not contain lead.

Abstract: Disclosed is a high-strength free-cutting leadless copper alloy with excellent machinability and corrosion-resistance. The free-cutting leadless copper alloy contains 58 to 70 wt % of copper (Cu), 0.5 to 2.0 wt % of tin (Sn), 0.1 to 2.0 wt % of silicon (Si), a balance amount of zinc (Zn), and inevitable impurities but does not contain lead.

Abstract: The present invention relates to a copper alloy material for continuous casting mold and a process for producing the same. In more detail, the present invention relates to a copper alloy material for continuous casting mold, which consists of 0.05 wt % to 0.6 wt % of Cr, 0.01 wt % to 0.5 wt % of Ag, 0.005 wt % to 0.10 wt % of P, and a balance of Cu and unavoidable impurities; and a process for producing the same. The copper alloy material can further include less than 0.1 wt % of at least one of elements selected from a group consisting of Sn, Ti, Mg, Mn, Fe, Co, Al, Si, Mo, Zr and W.

Abstract: The present invention relates to a method of manufacturing a high purity copper (Cu) powder material useable in fabricating a sputtering target material for electronic industrial applications, for example a penetrator liner. The foregoing method has a configuration of using an apparatus composed of a raw material feeder, a plasma torch and a reactor to prepare a metal powder, and includes steps of passing a Cu powder having an average particle diameter of 30 to 450 ?m through the thermal plasma torch at an introduction rate of 2 to 30 kg/hr, to thereby fabricate a Cu powder having an average particle diameter of 5 to 300 ?m.

Abstract: A copper alloy includes Si to facilitate deoxidation, and can be easily manufactured even when including elements such as Cr or Sn. The copper alloy has high conductivity and high workability without negatively affecting the tensile strength. The copper alloy contains 0.2 to 0.4 wt % of Cr, 0.05 to 0.15 wt % of Sn, 0.05 to 0.15 wt % of Zn, 0.01 to 0.30 wt % of Mg, 0.03 to 0.07 wt % of Si, with the remainder being Cu and inevitable impurities. A method for manufacturing the copper alloy includes obtaining a molten metal having the described composition; obtaining an ingot; heating the ingot at a temperature of 900-1000° C. to perform a hot rolling process; cold rolling; performing a first aging process at a temperature of 400-500° C. for 2 to 8 hours; cold rolling; and performing a second aging process at a temperature of 370-450° C. for 2 to 8 hours.

Abstract: The present invention relates to a copper alloy having particular benefits for electronic parts and a method for making the same. The alloy having the composition of 0.05 wt % of Fe, 0.025˜0.15 wt % P, 0.01˜0.25 wt % Cr, 0.01˜0.15 wt %, Si 0.01˜0.25 wt % Mg, and the balance of Cu and minor impurities. The method of making the copper alloy includes: forming the molten alloy, casting to obtain an ingot, hot rolling the ingot at 850˜1,000° C., cooling, cold rolling the hot rolled product (after cooling the same), annealing the cold rolled product at 400˜600° C. for 1˜10 hours, intermediate rolling the annealed product with a reduction ratio of 30˜70%, heat treating the intermediate rolled product at 500˜800° C. for 30˜600 seconds, and finishing rolling the heat treated product with a reduction ratio of 20˜40%.

Abstract: A copper alloy includes Si to facilitate deoxidation, and can be easily manufactured even when including elements such as Cr or Sn. The copper alloy has high conductivity and high workability without negatively affecting the tensile strength. The copper alloy consists of 0.2 to 0.4 wt % of Cr, 0.05 to 0.15 wt % of Sn, 0.05 to 0.15 wt % of Zn, 0.01 to 0.30 wt % of Mg, 0.03 to 0.07 wt % of Si, with the remainder being Cu and inevitable impurities. A method for manufacturing the copper alloy includes obtaining a molten metal having the described composition; obtaining an ingot; heating the ingot at a temperature of 900-1000° C. to perform a hot rolling process; cold rolling; performing a first aging process at a temperature of 400-500° C. for 2 to 8 hours; cold rolling; and performing a second aging process at a temperature of 370-450° C. for 2 to 8 hours.

Abstract: The present invention relates to a method of manufacturing a high purity copper (Cu) powder material useable in fabricating a sputtering target material for electronic industrial applications, for example a penetrator liner. The foregoing method has a configuration of using an apparatus composed of a raw material feeder, a plasma torch and a reactor to prepare a metal powder, and includes steps of passing a Cu powder having an average particle diameter of 30 to 450 ?m through the thermal plasma torch at an introduction rate of 2 to 30 kg/hr. to thereby fabricate a Cu powder having an average particle diameter of 5 to 300 ?m.