Abstract: The present invention relates to a leveler capable of efficiently filling the inside of via holes formed during the manufacturing process of a printed circuit board, and an electroplating composition comprising the same. When via holes on a substrate are filled with the electroplating composition according to the present invention, the via holes can be filled in a relatively short time while minimizing the formation of dimples or voids.

Abstract: The present invention relates to a leveling agent and an electrolytic composition comprising the same. When the via hole in the substrate is filled with the electrolytic composition according to the present invention, the via hole can be filled within a relatively short time while minimizing the formation of dimples or voids.

Abstract: The present invention relates to a release layer for a metal foil with carrier and a metal foil with carrier including the release layer. The release layer is designed for easy removal of the carrier and includes one or more nitrogenous heterocyclic compounds and one or more inorganic compounds containing at least one metal selected from the group consisting of nickel, molybdenum, cobalt, phosphorus, manganese, and iron.

Abstract: The present invention relates to a leveling agent and an electrolytic composition comprising the same. When the via hole in the substrate is filled with the electrolytic composition according to the present invention, the via hole can be filled within a relatively short time while minimizing the formation of dimples or voids.

Abstract: The present invention relates to a metal foil having a rough surface, a carrier-attached metal foil including the metal foil, and a printed circuit board manufactured using the metal foil. The rough surface is naturally formed during formation of the metal foil. The formation of the rough surface allows the metal foil to have a high adhesive strength to an insulating resin substrate and enables the manufacture of a printed circuit board with improved efficiency.

Abstract: The present invention relates to a surface modifier for electrolytic nickel plating including at least one carboxyl group-containing compound and a nickel electroplating solution including the surface modifier. The use of the nickel electroplating solution according to the present invention enables efficient formation of a plated nickel layer with high surface roughness and mattness even without performing strong electrolysis, unlike in the prior art.

Abstract: The present invention relates to a carrier foil-attached metal foil including a release layer having a specific composition and structure, a method of manufacturing the carrier foil-attached metal foil, and a laminate for forming a printed circuit board including the carrier foil-attached metal foil. The laminate for forming a printed circuit board according to the present invention comprises the carrier foil-attached metal foil, so that a defect rate can be minimized.

Abstract: Provided is a plating lamination technology for providing a highly adhesive inner layer of a printed circuit board. The plating lamination technology is effective in providing an electroless plated laminate, including a non-etched/low-roughness pretreated laminate or a low-roughness copper foil, and a printed circuit board including the plated laminate.

Abstract: Provided is a plating lamination technology for providing a highly adhesive inner layer of a printed circuit board. The plating lamination technology is effective in providing an electroless plated laminate, including a non-etched/low-roughness pretreated laminate or a low-roughness copper foil, and a printed circuit board including the plated laminate.

Abstract: The present invention relates to a liquid additive for etching silicon nitride and silicon oxide layers, a metal ink including the same for forming silicon solar cell electrodes and a method for manufacturing silicon solar cell electrodes. More particularly, it relates to a liquid additive including metal nitrate, metal acetate, or hydrates thereof and a metal ink for forming silicon solar cell electrodes, mixed with the liquid additive and a metal. Further, it relates to a method for manufacturing silicon solar cell electrodes comprising a one-step non-contact printing for etching of a silicon nitride layer or silicon oxide layer and forming electrodes.

Abstract: The present invention relates to a liquid additive for etching silicon nitride and silicon oxide layers, a metal ink including the same for forming silicon solar cell electrodes and a method for manufacturing silicon solar cell electrodes. More particularly, it relates to a liquid additive including metal nitrate, metal acetate, or hydrates thereof and a metal ink for forming silicon solar cell electrodes, mixed with the liquid additive and a metal. Further, it relates to a method for manufacturing silicon solar cell electrodes comprising a one-step non-contact printing for etching of a silicon nitride layer or silicon oxide layer and forming electrodes.