Patents by Inventor Bo Park

Bo Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting diode package and method of manufacturing the same
    Publication number: 20070096129
    Abstract: A light emitting diode (LED) package is provided. The LED package includes a printed circuit board (PCB), an electrode pad, an LED, a wire, and first and second moldings. The electrode pad and the LED are formed on the PCB. The wire electrically connects the LED with the electrode pad. The first molding is formed on the LED and the second molding is formed on the first molding.
    Type: Application
    Filed: October 25, 2006
    Publication date: May 3, 2007
    Inventor: Bo Park
  • Light emitting diode package
    Publication number: 20070085096
    Abstract: An LED package is provided. The LED package includes: at least one device having at least one LED; at least one resistor having a resistance component; a plurality of bonding pads formed spaced apart from each other on one side of the resistor and changing resistance of the resistor according to a wire bonding position; a conductive part having a current flowing path to electrically connect the device and the resistor; and a substrate having the device, the resistor, and the conductive part.
    Type: Application
    Filed: October 12, 2006
    Publication date: April 19, 2007
    Inventor: Bo Park