Patents by Inventor Bo Ram I Jang

Bo Ram I Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light-emitting diode package and method for manufacturing same
    Patent number: 9450159
    Abstract: Disclosed are a light-emitting diode package and a method for manufacturing same. The method for manufacturing a light-emitting diode package comprises: preparing a package main body having a cavity and an air vent passageway which extends from the cavity; installing a light-emitting diode inside the cavity of the package main body; attaching a transparent member by means of an adhesive so as to cover the upper part of the cavity; and blocking the air vent passageway by forming a sealing member. As the air vent passageway is blocked after the transparent member is attached, the transparent member may be prevented from peeling off from the air pressure inside the cavity.
    Type: Grant
    Filed: October 9, 2012
    Date of Patent: September 20, 2016
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Hee Cheul Jung, Jung Hye Chae, Bo Ram I Jang, Jun Yong Park, Dae Woong Suh
  • Light-emitting diode package
    Patent number: 9324921
    Abstract: The present invention relates to a light-emitting diode package. According to the present invention, a light-emitting diode package comprises: a substrate for growth; a passivation layer formed on a surface of one side of the substrate for growth; and a package substrate having a main body portion and a wall portion, wherein the wall portion is formed on the main body portion. At least the space formed among the main body portion, the wall portion and the passivation layer is sealed from the outside.
    Type: Grant
    Filed: October 8, 2012
    Date of Patent: April 26, 2016
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Jun Yong Park, Daewoong Suh, Bo Ram I Jang, Hee Cheul Jung, Kyu Ho Lee, Chang Hoon Kim
  • LIGHT-EMITTING DIODE PACKAGE
    Publication number: 20150295139
    Abstract: The present invention relates to a light-emitting diode package. According to the present invention, a light-emitting diode package comprises: a substrate for growth; a passivation layer formed on a surface of one side of the substrate for growth; and a package substrate having a main body portion and a wall portion, wherein the wall portion is formed on the main body portion. At least the space formed among the main body portion, the wall portion and the passivation layer is sealed from the outside.
    Type: Application
    Filed: October 8, 2012
    Publication date: October 15, 2015
    Applicant: Seoul Viosys Co., Ltd.
    Inventors: Jun Yong Park, Daewoong Suh, Bo Ram I Jang, Hee Cheul Jung, Kyu Ho Lee, Chang Hoon Kim
  • LIGHT-EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING SAME
    Publication number: 20140284650
    Abstract: Disclosed are a light-emitting diode package and a method for manufacturing same. The method for manufacturing a light-emitting diode package comprises: preparing a package main body having a cavity and an air vent passageway which extends from the cavity; installing a light-emitting diode inside the cavity of the package main body; attaching a transparent member by means of an adhesive so as to cover the upper part of the cavity; and blocking the air vent passageway by forming a sealing member. As the air vent passageway is blocked after the transparent member is attached, the transparent member may be prevented from peeling off from the air pressure inside the cavity.
    Type: Application
    Filed: October 9, 2012
    Publication date: September 25, 2014
    Inventors: Hee Cheul Jung, Jung Hye Chae, Bo Ram I Jang, Jun Yong Park, Dae Woong Suh