Abstract: A light emitting apparatus is provided that includes a substrate, a light emitting device, a first light transmitting layer, and a first reflector. The light emitting device may be disposed on the substrate, and may emit light. The first light transmitting layer may be disposed on the substrate to cover the light emitting device, and may be formed of a material that transmit light emitted from the light emitting device. The first reflector may be disposed on at least a region of an upper surface of the first light transmitting layer, and may reflect at least a portion of light. In addition, the side surface of the first light transmitting layer includes an inclined surface.

Abstract: A light emitting apparatus is disclosed. The light emitting apparatus includes a substrate and a light emitting region disposed on the substrate and including a first light emitter and a second light emitter. The light emitted from the first light emitter has a first spectrum, light emitted from the second light emitter has a second spectrum, The first light emitter includes a first light emitting device emitting light having a first peak wavelength and a first wavelength converter emitting a first light. The second light emitter includes a second light emitting device emitting the second spectrum. The first spectrum and the second spectrum has at least one different peak wavelength. and The light of the light emitting region has a third spectrum that is mixture of the first spectrum and the second spectrum.

Abstract: A light emitting apparatus includes a base substrate, at least a light emitting source disposed on the base substrate, and a multi-refractive layer refracting light emitted from the light emitting source, where the multi-refractive layer includes a first refractive layer and a second refractive layer disposed outside the first refractive layer, the first refractive layer having a lower index of refraction than the second refractive layer.

Abstract: A light emitting package is provided to include a substrate on which a circuit pattern is formed, a first optic layer, a light controller, and a second optic layer. The first optic layer may be arranged on the substrate to be electrically connected to the circuit pattern and generate and emit light. The light controller may cover a side surface of the first optic layer and may reflect light emitted from the side surface of the first optic layer. In addition, the second optic layer may cover the first optic layer and the light controller and be disposed on the substrate. The second optic layer may include a securing region secured on the substrate and a light emitting region disposed over the securing region. Light emitted from the first optic layer may be emitted to the outside of the second optic layer through the second optic layer.

Abstract: Disclosed are a light-emitting diode package and a method for manufacturing same. The method for manufacturing a light-emitting diode package comprises: preparing a package main body having a cavity and an air vent passageway which extends from the cavity; installing a light-emitting diode inside the cavity of the package main body; attaching a transparent member by means of an adhesive so as to cover the upper part of the cavity; and blocking the air vent passageway by forming a sealing member. As the air vent passageway is blocked after the transparent member is attached, the transparent member may be prevented from peeling off from the air pressure inside the cavity.

Abstract: The present invention relates to a light-emitting diode package. According to the present invention, a light-emitting diode package comprises: a substrate for growth; a passivation layer formed on a surface of one side of the substrate for growth; and a package substrate having a main body portion and a wall portion, wherein the wall portion is formed on the main body portion. At least the space formed among the main body portion, the wall portion and the passivation layer is sealed from the outside.

Abstract: The present invention relates to a light-emitting diode package. According to the present invention, a light-emitting diode package comprises: a substrate for growth; a passivation layer formed on a surface of one side of the substrate for growth; and a package substrate having a main body portion and a wall portion, wherein the wall portion is formed on the main body portion. At least the space formed among the main body portion, the wall portion and the passivation layer is sealed from the outside.

Abstract: Disclosed are a light-emitting diode package and a method for manufacturing same. The method for manufacturing a light-emitting diode package comprises: preparing a package main body having a cavity and an air vent passageway which extends from the cavity; installing a light-emitting diode inside the cavity of the package main body; attaching a transparent member by means of an adhesive so as to cover the upper part of the cavity; and blocking the air vent passageway by forming a sealing member. As the air vent passageway is blocked after the transparent member is attached, the transparent member may be prevented from peeling off from the air pressure inside the cavity.