Patents by Inventor Bo-Ren CHI

Bo-Ren CHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Drying block structure and storage device
    Patent number: 11651982
    Abstract: A drying block structure is provided, including a main body and a protective layer. The main body has a honeycomb and substantially circular shape. The protective layer covers the main body and has a porous structure. The main body and the protective layer are integrally formed as one piece.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: May 16, 2023
    Assignee: WINBOND ELECTRONICS CORP.
    Inventors: Cheng-Gang Fu, Bo-Ren Chi, Tze-Ching Chuang, Te-Wei Chu
  • CHIP-ON-BOARD MODULE
    Publication number: 20230058607
    Abstract: A chip-on-board module is provided. The chip-on-board module includes a chip and a substrate. The chip includes a plurality of chip contacts. The substrate includes a plurality of first leads and a plurality of second leads. The first leads and the second leads are coupled to a portion of the chip contacts. The first leads are arranged along a first axis. The second leads are arranged along a second axis. A first axis included angle is formed between the first axis and the second axis, and the first axis included angle is between 100° and 170°.
    Type: Application
    Filed: August 12, 2022
    Publication date: February 23, 2023
    Applicant: Winbond Electronics Corp.
    Inventors: Yen-Ling CHOU, Bo-Ren CHI, Wei-Ting CHANG
  • DRYING BLOCK STRUCTURE AND STORAGE DEVICE
    Publication number: 20210111047
    Abstract: A drying block structure is provided, including a main body and a protective layer. The main body has a honeycomb and substantially circular shape. The protective layer covers the main body and has a porous structure. The main body and the protective layer are integrally formed as one piece.
    Type: Application
    Filed: October 11, 2019
    Publication date: April 15, 2021
    Inventors: Cheng-Gang FU, Bo-Ren CHI, Tze-Ching CHUANG, Te-Wei CHU