Patents by Inventor Bo-Siang Fang

Bo-Siang Fang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11747382
    Abstract: Testing equipment is used in an antenna testing process, and includes a testing head having a perforation, and a testing device having a cylinder. The cylinder is disposed in the perforation to act as a cavity for the antenna testing process. Therefore, only the cylinder needs to be replaced when the antenna testing process is performed on different devices under test, with the whole testing head intact.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: September 5, 2023
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Bo-Siang Fang, Kuang-Sheng Wang, Hsinjou Lin, Shao-Meng Sim, Mao-Hua Yeh
  • Patent number: 11223117
    Abstract: An electronic package includes: a carrier structure; a first electronic component disposed on the carrier structure; a first insulating layer formed on the carrier structure; a first antenna structure coupled to the first insulating layer and electrically connected to the first electronic component; and a second antenna structure embedded in the carrier structure. As such, the electronic package provides more antenna functions within a limited space so as to improve the signal quality and transmission rate of electronic products. An electronic device having the electronic package is also provided. The electronic device is applicable to an electronic product having an antenna function.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: January 11, 2022
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Bo-Siang Fang, Kuan-Ta Chen, Chia-Chu Lai, Ying-Wei Lu
  • Patent number: 11193972
    Abstract: An inspection equipment is used for inspecting an antenna, and includes a testing device having a first circuit structure, a carrier, a supporting part and a second circuit structure detachably stacked on one another sequentially. Therefore, the carrier, the first circuit structure, the second circuit structure or the supporting part can be detached when different devices under test are inspected, without replacing the whole testing device, thereby achieving effects of modular replacing and cost saving.
    Type: Grant
    Filed: January 6, 2020
    Date of Patent: December 7, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Bo-Siang Fang, Kuan-Ta Chen, Hsinjou Lin
  • Patent number: 11081776
    Abstract: An electronic package is provided. A functioning member having a concave portion and a second antenna portion is disposed on a carrier having a first antenna portion. The concave portion and the carrier form a functioning space. The first antenna portion and the second antenna portion are disposed in a projection space of the functioning space. The first antenna portion induces the second antenna portion.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: August 3, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Ying-Wei Lu, Bo-Siang Fang, Kuan-Ta Chen, Chia-Chu Lai
  • Publication number: 20210123962
    Abstract: Testing equipment is used in an antenna testing process, and includes a testing head having a perforation, and a testing device having a cylinder. The cylinder is disposed in the perforation to act as a cavity for the antenna testing process. Therefore, only the cylinder needs to be replaced when the antenna testing process is performed on different devices under test, with the whole testing head intact.
    Type: Application
    Filed: December 20, 2019
    Publication date: April 29, 2021
    Inventors: Bo-Siang Fang, Kuang-Sheng Wang, Hsinjou Lin, Shao-Meng Sim, Mao-Hua Yeh
  • Publication number: 20210072307
    Abstract: An inspection equipment is used for inspecting an antenna, and includes a testing device having a first circuit structure, a carrier, a supporting part and a second circuit structure detachably stacked on one another sequentially. Therefore, the carrier, the first circuit structure, the second circuit structure or the supporting part can be detached when different devices under test are inspected, without replacing the whole testing device, thereby achieving effects of modular replacing and cost saving.
    Type: Application
    Filed: January 6, 2020
    Publication date: March 11, 2021
    Inventors: Bo-Siang Fang, Kuan-Ta Chen, Hsinjou Lin
  • Patent number: 10903547
    Abstract: An electronic package includes an antenna structure and an adjustment structure arranged on a carrier structure. The antenna structure includes an antenna body and a feed line that are disposed on different layers and a conductive pillar that interconnects the layers to electrically connect the antenna body and the feed line. The adjustment structure extends from the feed line to improve the bandwidth of the antenna body.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: January 26, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Ying-Wei Lu, Bo-Siang Fang, Kuan-Ta Chen
  • Publication number: 20210013583
    Abstract: An electronic package is provided. A functioning member having a concave portion and a second antenna portion is disposed on a carrier having a first antenna portion. The concave portion and the carrier form a functioning space. The first antenna portion and the second antenna portion are disposed in a projection space of the functioning space. The first antenna portion induces the second antenna portion.
    Type: Application
    Filed: August 29, 2019
    Publication date: January 14, 2021
    Inventors: Ying-Wei Lu, Bo-Siang Fang, Kuan-Ta Chen, Chia-Chu Lai
  • Patent number: 10840581
    Abstract: An electronic package is provided with a first substrate having a first antenna portion that is stacked on a second substrate having a second antenna portion via an antenna component. During a packaging process, a gap between the first substrate and the second substrate is held constantly by the antenna component. At the same time, the antenna component is regarded as a third antenna portion of the electronic package. The performance of the antennae is not adversely affected by the antenna component despite the fact that the antenna component is in close proximity to the first and second antenna portions.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: November 17, 2020
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Bo-Siang Fang, Kuan-Ta Chen, Chia-Chu Lai
  • Patent number: 10840965
    Abstract: A testing system includes: a bilinear polarized antenna for receiving and dividing a circularly polarized radio wave associating with a horizontal and a vertical polarization path of an object-to-be-tested into a first and a second high frequency signal; a phase retarder for delaying a phase of the first high frequency signal by 90 degrees to form a first high frequency signal with a phase delay of 90 degrees; a power splitter for receiving or synthesizing the first high frequency signal with the phase delay of 90 degrees and the second high frequency signal; and a high frequency signal transceiver for measuring power of the first high frequency signal with the phase delay of 90 degrees and the second high frequency signal and determining states of the horizontal and vertical polarization paths of the object-to-be-tested based on the power. Therefore, the testing system can speed up testing of the object-to-be-tested.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: November 17, 2020
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Bo-Siang Fang, Kuan-Ta Chen, Ying-Wei Lu, Chia-Chu Lai, Cheng-Tsai Hsieh
  • Patent number: 10823776
    Abstract: A testing fixture used in an antenna testing process is provided. A cover unit having a second antenna portion is arranged on a base unit configured for an electronic structure having a first antenna portion to be placed thereon. The cover unit includes a non-metal interposing portion configured for pressing the electronic structure to separate the second antenna portion from the first antenna portion. Therefore, when the antenna testing process is performed on the electronic structure, a metal shielding effect is avoided, and an over the air testing environment is provided.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: November 3, 2020
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Bo-Siang Fang, Cheng-Tsai Hsieh, Kuan-Ta Chen, Ying-Wei Lu
  • Publication number: 20200304165
    Abstract: A testing system includes: a bilinear polarized antenna for receiving and dividing a circularly polarized radio wave associating with a horizontal and a vertical polarization path of an object-to-be-tested into a first and a second high frequency signal; a phase retarder for delaying a phase of the first high frequency signal by 90 degrees to form a first high frequency signal with a phase delay of 90 degrees; a power splitter for receiving or synthesizing the first high frequency signal with the phase delay of 90 degrees and the second high frequency signal; and a high frequency signal transceiver for measuring power of the first high frequency signal with the phase delay of 90 degrees and the second high frequency signal and determining states of the horizontal and vertical polarization paths of the object-to-be-tested based on the power. Therefore, the testing system can speed up testing of the object-to-be-tested.
    Type: Application
    Filed: April 8, 2020
    Publication date: September 24, 2020
    Inventors: Bo-Siang Fang, Kuan-Ta Chen, Ying-Wei Lu, Chia-Chu Lai, Cheng-Tsai Hsieh
  • Patent number: 10659097
    Abstract: A testing system includes: a bilinear polarized antenna for receiving and dividing a circularly polarized radio wave associating with a horizontal and a vertical polarization path of an object-to-be-tested into a first and a second high frequency signal; a phase retarder for delaying a phase of the first high frequency signal by 90 degrees to form a first high frequency signal with a phase delay of 90 degrees; a power splitter for receiving or synthesizing the first high frequency signal with the phase delay of 90 degrees and the second high frequency signal; and a high frequency signal transceiver for measuring power of the first high frequency signal with the phase delay of 90 degrees and the second high frequency signal and determining states of the horizontal and vertical polarization paths of the object-to-be-tested based on the power. Therefore, the testing system can speed up testing of the object-to-be-tested.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: May 19, 2020
    Inventors: Bo-Siang Fang, Kuan-Ta Chen, Ying-Wei Lu, Chia-Chu Lai, Cheng-Tsai Hsieh
  • Publication number: 20200072886
    Abstract: A testing fixture used in an antenna testing process is provided. A cover unit having a second antenna portion is arranged on a base unit configured for an electronic structure having a first antenna portion to be placed thereon. The cover unit includes a non-metal interposing portion configured for pressing the electronic structure to separate the second antenna portion from the first antenna portion. Therefore, when the antenna testing process is performed on the electronic structure, a metal shielding effect is avoided, and an over the air testing environment is provided.
    Type: Application
    Filed: May 9, 2019
    Publication date: March 5, 2020
    Inventors: Bo-Siang Fang, Cheng-Tsai Hsieh, Kuan-Ta Chen, Ying-Wei Lu
  • Publication number: 20200052393
    Abstract: An electronic package is provided with a first substrate having a first antenna portion that is stacked on a second substrate having a second antenna portion via an antenna component. During a packaging process, a gap between the first substrate and the second substrate is held constantly by the antenna component. At the same time, the antenna component is regarded as a third antenna portion of the electronic package. The performance of the antennae is not adversely affected by the antenna component despite the fact that the antenna component is in close proximity to the first and second antenna portions.
    Type: Application
    Filed: December 26, 2018
    Publication date: February 13, 2020
    Inventors: Bo-Siang Fang, Kuan-Ta Chen, Chia-Chu Lai
  • Publication number: 20190363423
    Abstract: An electronic package includes an antenna structure and an adjustment structure arranged on a carrier structure. The antenna structure includes an antenna body and a feed line that are disposed on different layers and a conductive pillar that interconnects the layers to electrically connect the antenna body and the feed line. The adjustment structure extends from the feed line to improve the bandwidth of the antenna body.
    Type: Application
    Filed: November 15, 2018
    Publication date: November 28, 2019
    Inventors: Ying-Wei Lu, Bo-Siang Fang, Kuan-Ta Chen
  • Publication number: 20190319347
    Abstract: An electronic package includes: a carrier structure; a first electronic component disposed on the carrier structure; a first insulating layer formed on the carrier structure; a first antenna structure coupled to the first insulating layer and electrically connected to the first electronic component; and a second antenna structure embedded in the carrier structure. As such, the electronic package provides more antenna functions within a limited space so as to improve the signal quality and transmission rate of electronic products. An electronic device having the electronic package is also provided. The electronic device is applicable to an electronic product having an antenna function.
    Type: Application
    Filed: July 24, 2018
    Publication date: October 17, 2019
    Inventors: Bo-Siang Fang, Kuan-Ta Chen, Chia-Chu Lai, Ying-Wei Lu
  • Publication number: 20190139913
    Abstract: An electronic package and a method for fabricating the same are provided. The method includes disposing an antenna substrate on a package structure through a plurality of conductive elements. The antenna substrate has an antenna layer and the package structure has an electronic component. As such, an antenna length can be designed according to the requirement of antenna operation, without increasing the area of the package structure.
    Type: Application
    Filed: May 2, 2018
    Publication date: May 9, 2019
    Inventors: Bo-Siang Fang, Kuan-Ta Chen, Ying-Wei Lu