Patents by Inventor Bo-sun KIM

Bo-sun KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11968312
    Abstract: Disclosed herein are an apparatus and method for processing vehicle data security based on a cloud.
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: April 23, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Sang-Woo Lee, Dae-Won Kim, Jin-Yong Lee, Boo-Sun Jeon, Bo-Heung Chung, Hong-Il Ju, Joong-Yong Choi
  • Publication number: 20230082802
    Abstract: An apparatus for processing a substrate includes a reaction tube, a side cover, a heater, a first gas supplier, a second gas supplier and a controller. The reaction tube is configured to receive a substrate boat in which a plurality of the substrate is received to process the substrate. The side cover is configured to receive the reaction tube. The heater lines the interior of the side cover. The first gas supplier is provided to an upper portion of the side cover to supply a cooling gas at a first supplying rate to a space between the side cover and the reaction tube. The second gas supplier is provided to a lower portion of the side cover to supply the cooling gas at a second supplying rate different from the first supplying rate to the space between the side cover and the reaction tube. The controller controls the reaction tube.
    Type: Application
    Filed: November 18, 2022
    Publication date: March 16, 2023
    Applicants: SK hynix Inc., EUGENE TECHNOLOGY CO., LTD.
    Inventors: Min Jin JUNG, Tae Hwan KIM, Min Woong KANG, Hyun Jun YOO, Sung Ho KANG, Song Hwan PARK, Bo Sun KIM, Hong Won LEE, Joo Hyun CHO, Yong Tak JIN
  • Publication number: 20210253918
    Abstract: The present disclosure provides a resin composition, and a protective sheet of a display device that includes the resin composition. The resin composition includes alkyl acrylate, polyethylene glycol alkyl ether methacrylate, hydroxyalkyl acrylate, perfluorinated alkyl (meth)acrylate, and silicone (meth)acrylate.
    Type: Application
    Filed: December 8, 2020
    Publication date: August 19, 2021
    Inventors: SUNG KIM, BO SUN KIM, WOOK HYUNG LEE, NAMHEE PARK, HYUNG-DON NA, SUNGYOUL CHO
  • Publication number: 20200392619
    Abstract: An apparatus for processing a substrate includes a reaction tube, a side cover, a heater, a first gas supplier, a second gas supplier and a controller. The reaction tube is configured to receive a substrate boat in which a plurality of the substrate is received to process the substrate. The side cover is configured to receive the reaction tube. The heater lines the interior of the side cover. The first gas supplier is provided to an upper portion of the side cover to supply a cooling gas at a first supplying rate to a space between the side cover and the reaction tube. The second gas supplier is provided to a lower portion of the side cover to supply the cooling gas at a second supplying rate different from the first supplying rate to the space between the side cover and the reaction tube. The controller controls the reaction tube.
    Type: Application
    Filed: December 2, 2019
    Publication date: December 17, 2020
    Applicants: SK hynix Inc., EUGENE TECHNOLOGY CO., LTD.
    Inventors: Min Jin JUNG, Tae Hwan KIM, Min Woong KANG, Hyun Jun YOO, Sung Ho KANG, Song Hwan PARK, Bo Sun KIM, Hong Won LEE, Joo Hyun CHO, Yong Tak JIN
  • Patent number: 10427944
    Abstract: A composition for forming a silica based layer, the composition including a silicon-containing polymer having polydispersity ranging from about 3.0 to about 30 and a solvent, and having viscosity ranging from about 1.30 centipoise (cps) to about 1.80 cps at 25° C. Also, a silica based layer is formed of the composition, and an electronic device includes the silica based layer.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: October 1, 2019
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Jun-Young Jang, Taek-Soo Kwak, Woo-Han Kim, Hui-Chan Yun, Jin-Hee Bae, Bo-Sun Kim, Yoong-Hee Na, Sae-Mi Park, Han-Song Lee, Wan-Hee Lim
  • Patent number: 10093830
    Abstract: A composition for forming a silica based layer includes a silicon-containing compound including polysilazane, polysiloxazane, or a combination thereof and one or more kinds of solvent, and having a turbidity increasing rate of less than or equal to about 0.13.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: October 9, 2018
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Wan-Hee Lim, Taek-Soo Kwak, Han-Song Lee, Eun-Su Park, Sun-Hae Kang, Bo-Sun Kim, Sang-Kyun Kim, Sae-Mi Park, Jin-Hee Bae, Jin-Woo Seo, Jun-Young Jang, Youn-Jin Cho, Kwen-Woo Han, Byeong-Gyu Hwang
  • Patent number: 10020185
    Abstract: A composition for forming a silica layer including a silicon-containing polymer having a weight average molecular weight of about 20,000 to about 70,000 and a polydispersity index of about 5.0 to about 17.0 and a solvent; a silica layer manufactured using the same; and an electronic device including the silica layer.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: July 10, 2018
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Hui-Chan Yun, Woo-Han Kim, Sang-Ran Koh, Taek-Soo Kwak, Bo-Sun Kim, Jin-Gyo Kim, Yoong-Hee Na, Kun-Bae Noh, Sae-Mi Park, Jin-Hee Bae, Jun Sakong, Eun-Seon Lee, Wan-Hee Lim, Jun-Young Jang, Il Jung, Byeong-Gyu Hwang
  • Patent number: 9902873
    Abstract: A composition for forming a silica based layer and a method for manufacturing a silica based layer, the composition including a silicon-containing compound, the silicon-containing compound including a hydrogenated polysilazane moiety, a hydrogenated polysiloxazane moiety, or a combination thereof, and a solvent, wherein a number of particles of the silicon-containing compound in the composition and having a particle diameter of about 0.2 ?m to about 1 ?m is less than or equal to about 10/ml.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: February 27, 2018
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Jin-Hee Bae, Taek-Soo Kwak, Han-Song Lee, Youn-Jin Cho, Byeong-Gyu Hwang, Bo-Sun Kim, Sae-Mi Park, Eun-Su Park, Jin-Woo Seo, Wan-Hee Lim, Jun-Young Jang, Kwen-Woo Han
  • Patent number: 9890255
    Abstract: Disclosed is modified hydrogenated polysiloxazane prepared by reacting hydrogenated polysiloxazane with a silane compound selected from polysilane, polycyclosilane, and a silane oligomer. The modified hydrogenated polysiloxazane has a small mole ratio of nitrogen atoms relative to silicon atoms and may remarkably deteriorate a film shrinkage ratio when included in a composition for forming a silica-based insulation layer to form a silica-based insulation layer.
    Type: Grant
    Filed: July 15, 2013
    Date of Patent: February 13, 2018
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Hyun-Ji Song, Eun-Su Park, Sang-Hak Lim, Taek-Soo Kwak, Go-Un Kim, Mi-Young Kim, Bo-Sun Kim, Bong-Hwan Kim, Yoong-Hee Na, Jin-Hee Bae, Jin-Woo Seo, Hui-Chan Yun, Han-Song Lee, Jong-Dae Jeon, Kwen-Woo Han, Seung-Hee Hong, Byeong-Gyu Hwang
  • Publication number: 20160177133
    Abstract: A composition for forming a silica based layer includes a silicon-containing compound including polysilazane, polysiloxazane, or a combination thereof and one or more kinds of solvent, and having a turbidity increasing rate of less than or equal to about 0.13.
    Type: Application
    Filed: September 1, 2015
    Publication date: June 23, 2016
    Inventors: Wan-Hee Lim, Taek-Soo Kwak, Han-Song Lee, Eun-Su Park, Sun-Hae Kang, Bo-Sun Kim, Sang-Kyun Kim, Sae-Mi Park, Jin-Hee Bae, Jin-Woo Seo, Jun-Young Jang, Youn-Jin Cho, Kwen-Woo Han, Byeong-Gyu Hwang
  • Publication number: 20160176718
    Abstract: A composition for forming a silica based layer, the composition including a silicon-containing polymer having polydispersity ranging from about 3.0 to about 30 and a solvent, and having viscosity ranging from about 1.30 centipoise (cps) to about 1.80 cps at 25° C. Also, a silica based layer is formed of the composition, and an electronic device includes the silica based layer.
    Type: Application
    Filed: August 28, 2015
    Publication date: June 23, 2016
    Inventors: Jun-Young Jang, Taek-Soo Kwak, Woo-Han Kim, Hui-Chan Yun, Jin-Hee Bae, Bo-Sun Kim, Yoong-Hee Na, Sae-Mi Park, Han-Song Lee, Wan-Hee Lim
  • Patent number: 9312122
    Abstract: A rinse liquid for an insulation layer, the rinse liquid including a solvent represented by the following Chemical Formula 1:
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: April 12, 2016
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Jin-Hee Bae, Han-Song Lee, Wan-Hee Lim, Go-Un Kim, Taek-Soo Kwak, Bo-Sun Kim, Sang-Kyun Kim, Yoong-Hee Na, Eun-Su Park, Jin-Woo Seo, Hyun-Ji Song, Youn-Jin Cho, Kwen-Woo Han, Byeong-Gyu Hwang
  • Publication number: 20160099145
    Abstract: A composition for forming a silica layer including a silicon-containing polymer having a weight average molecular weight of about 20,000 to about 70,000 and a polydispersity index of about 5.0 to about 17.0 and a solvent; a silica layer manufactured using the same; and an electronic device including the silica layer.
    Type: Application
    Filed: May 22, 2015
    Publication date: April 7, 2016
    Inventors: Hui-Chan Yun, Woo-Han Kim, Sang-Ran Koh, Taek-Soo Kwak, Bo-Sun Kim, Jin-Gyo Kim, Yoong-Hee Na, Kun-Bae Noh, Sae-Mi Park, Jin-Hee Bae, Jun Sakong, Eun-Seon Lee, Wan-Hee Lim, Jun-Young Jang, Il Jung, Byeong-Gyu Hwang
  • Patent number: 9240443
    Abstract: A method of preparing a gap filler agent includes adding a halosilane to a basic solvent, and, to the basic solvent and the halosilane, adding ammonia in an amount of about 50 to about 70 parts by weight based on 100 parts by weight of the halosilane at a rate of about 1 g/hr to about 15 g/hr.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: January 19, 2016
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Jin-Hee Bae, Han-Song Lee, Taek-Soo Kwak, Go-Un Kim, Bo-Sun Kim, Sang-Kyun Kim, Yoong-Hee Na, Eun-Su Park, Jin-Woo Seo, Hyun-Ji Song, Sang-Hak Lim, Wan-Hee Lim, Seung-Hee Hong, Byeong-Gyu Hwang
  • Publication number: 20150337168
    Abstract: A composition for forming a silica based layer and a method for manufacturing a silica based layer, the composition including a silicon-containing compound, the silicon-containing compound including a hydrogenated polysilazane moiety, a hydrogenated polysiloxazane moiety, or a combination thereof, and a solvent, wherein a number of particles of the silicon-containing compound in the composition and having a particle diameter of about 0.2 ?m to about 1 ?m is less than or equal to about 10/ml.
    Type: Application
    Filed: December 5, 2014
    Publication date: November 26, 2015
    Inventors: Jin-Hee BAE, Taek-Soo KWAK, Han-Song LEE, Youn-Jin CHO, Byeong-Gyu HWANG, Bo-Sun KIM, Sae-Mi PARK, Eun-Su PARK, Jin-Woo SEO, Wan-Hee LIM, Jun-Young JANG, Kwen-Woo HAN
  • Publication number: 20150225508
    Abstract: Disclosed is modified hydrogenated polysiloxazane prepared by reacting hydrogenated polysiloxazane with a silane compound selected from polysilane, polycyclosilane, and a silane oligomer. The modified hydrogenated polysiloxazane has a small mole ratio of nitrogen atoms relative to silicon atoms and may remarkably deteriorate a film shrinkage ratio when included in a composition for forming a silica-based insulation layer to form a silica-based insulation layer.
    Type: Application
    Filed: July 15, 2013
    Publication date: August 13, 2015
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Hyun-Ji Song, Eun-Su Park, Sang-Hak Lim, Taek-Soo Kwak, Go-Un Kim, Mi-Young Kim, Bo-Sun Kim, Bong-Hwan Kim, Yoong-Hee Na, Jin-Hee Bae, Jin-Woo Seo, Hui-Chan Yun, Han-Song Lee, Jong-Dae Jeon, Kwen-Woo Han, Seung-Hee Hong, Byeong-Gyu Hwang
  • Publication number: 20150093545
    Abstract: A composition for a silica based layer, a silica based layer, and a method of manufacturing a silica based layer, the composition including a solvent; and a silicon-containing polymer, the silicon-containing polymer having a weight average molecular weight of about 20,000 to about 160,000.
    Type: Application
    Filed: September 17, 2014
    Publication date: April 2, 2015
    Inventors: Kwen-Woo HAN, Taek-Soo KWAK, Bo-Sun KIM, Eun-Su PARK, Jin-Hee BAE, Jin-Woo SEO, Han-Song LEE, Wan-Hee LIM, Byeong-Gyu HWANG, Sang-Kyun KIM, Youn-Jin CHO
  • Publication number: 20140315367
    Abstract: A rinse liquid for an insulation layer, the rinse liquid including a solvent represented by the following Chemical Formula 1:
    Type: Application
    Filed: November 26, 2013
    Publication date: October 23, 2014
    Inventors: Jin-Hee BAE, Han-Song LEE, Wan-Hee LIM, Go-Un KIM, Taek-Soo KWAK, Bo-Sun KIM, Sang-Kyun KIM, Yoong-Hee NA, Eun-Su PARK, Jin-Woo SEO, Hyun-Ji SONG, Youn-Jin CHO, Kwen-Woo HAN, Byeong-Gyu HWANG
  • Publication number: 20140187017
    Abstract: A method of preparing a gap filler agent includes adding a halosilane to a basic solvent, and, to the basic solvent and the halosilane, adding ammonia in an amount of about 50 to about 70 parts by weight based on 100 parts by weight of the halosilane at a rate of about 1 g/hr to about 15 g/hr.
    Type: Application
    Filed: December 31, 2013
    Publication date: July 3, 2014
    Inventors: Jin-Hee BAE, Han-Song LEE, Taek-Soo KWAK, Go-Un KIM, Bo-Sun KIM, Sang-Kyun KIM, Yoong-Hee NA, Eun-Su PARK, Jin-Woo SEO, Hyun-Ji SONG, Sang-Hak LIM, Wan-Hee LIM, Seung-Hee HONG, Byeong-Gyu HWANG
  • Publication number: 20140068458
    Abstract: The present disclosure relates to a message context management method and a terminal performing the method. The message context management method based on an attached file includes: downloading, by a terminal from a host device, messages and attachments to one or more of the messages; generating a message context related to each of the messages and the respective attachments; and displaying the message context related to a file selected from the attachments.
    Type: Application
    Filed: September 4, 2013
    Publication date: March 6, 2014
    Applicant: Pantech Co., Ltd.
    Inventor: Bo Sun KIM