Patents by Inventor Bo Tu

Bo Tu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250085001
    Abstract: Provided is a wall-mounted air conditioner, comprising a housing and a heat exchanger. An air duct is provided in the housing; the air duct comprises an air inlet and an air outlet; the air duct comprises an air inflow section and an air outflow section that are connected to each other; at least a portion of the air inlet is located on the front side of the housing; and the heat exchanger is disposed in the air duct. The air inflow section horizontally or obliquely extends forward from the air outflow section to form a first mounting space behind the air inflow section; and/or the portion of the air outflow section adjacent to the air outlet extends downward and forward from the remaining portion of the air outflow section to form a second mounting space behind the air outflow section.
    Type: Application
    Filed: February 11, 2022
    Publication date: March 13, 2025
    Inventors: Baisong ZHOU, Duode WU, Yuan YANG, Bo LI, Yongqiang WAN, Qiqin SU, Yunchong TU
  • Publication number: 20250080531
    Abstract: The present disclosure provides an identity authentication method, a personal security kernel node, a device, and a medium. The personal security kernel node is part of an identity authentication system, the identity authentication system further comprising a relying party node and a user identity credential certifier node. The method includes: obtaining an identity authentication assurance level corresponding to a service provided by a relying party; determining, according to the identity authentication assurance level, a user identity credential used by a user for the service; transmitting the user identity credential to a user identity credential certifier node through a relying party node, so that the user identity credential certifier node performs user identity credential authentication; and performing the service with the relying party node. According to the embodiments of the present disclosure, security of user identity assets can be improved during identity authentication.
    Type: Application
    Filed: November 14, 2024
    Publication date: March 6, 2025
    Inventors: Dongyan WANG, Maocal LI, Bo LI, Haitao TU
  • Patent number: 12095460
    Abstract: A configuration circuit of a flash FPGA for realizing external monitoring and configuration is provided. In the configuration circuit, a positive high-voltage output terminal of a positive high-voltage charge pump is connected to a positive high-voltage external monitoring port through a positive high-voltage bidirectional switch circuit, and the positive high-voltage output terminal of a positive high-voltage charge pump is further configured as a positive output end of a voltage supply circuit. A negative high-voltage output terminal of a negative high-voltage charge pump is connected to a negative high-voltage external monitoring port through a negative high-voltage bidirectional switch circuit, and the negative high-voltage output terminal of a negative high-voltage charge pump is further configured as a negative output end of the voltage supply circuit. Based on a received mode adjustment signal, a mode control circuit controls to enter an external monitoring mode or an external configuration mode.
    Type: Grant
    Filed: September 29, 2022
    Date of Patent: September 17, 2024
    Assignee: WUXI ESIONTECH CO., LTD.
    Inventors: Yueer Shan, Zhengzhou Cao, Wenhu Xie, Yanfei Zhang, Ting Jiang, Bo Tu
  • Publication number: 20230352096
    Abstract: A configuration control circuit of a flash-type FPGA capable of suppressing programming interference is provided. The configuration control circuit adds a programming selection circuit compared with a conventional configuration control circuit. When a programming operation is performed on a flash memory cell located in a target row and a target column, the programming selection circuit controls a path between a programming bit line (BL) voltage and a BL voltage obtaining terminal of the flash memory cell located in the target row and the target column to be turned on, and a path between the programming BL voltage and a BL voltage obtaining terminal of a flash memory cell located in another row and the target column to be turned off.
    Type: Application
    Filed: July 7, 2023
    Publication date: November 2, 2023
    Applicant: WUXI ESIONTECH CO., LTD.
    Inventors: Zhengzhou CAO, Yueer SHAN, Bo TU, Xiaofei HE, Yanfei ZHANG, Zhenkai JI
  • Publication number: 20230020524
    Abstract: A configuration circuit of a flash FPGA for realizing external monitoring and configuration is provided. In the configuration circuit, a positive high-voltage output terminal of a positive high-voltage charge pump is connected to a positive high-voltage external monitoring port through a positive high-voltage bidirectional switch circuit, and the positive high-voltage output terminal of a positive high-voltage charge pump is further configured as a positive output end of a voltage supply circuit. A negative high-voltage output terminal of a negative high-voltage charge pump is connected to a negative high-voltage external monitoring port through a negative high-voltage bidirectional switch circuit, and the negative high-voltage output terminal of a negative high-voltage charge pump is further configured as a negative output end of the voltage supply circuit. Based on a received mode adjustment signal, a mode control circuit controls to enter an external monitoring mode or an external configuration mode.
    Type: Application
    Filed: September 29, 2022
    Publication date: January 19, 2023
    Applicant: WUXI ESIONTECH CO., LTD.
    Inventors: Yueer SHAN, Zhengzhou CAO, Wenhu XIE, Yanfei ZHANG, Ting JIANG, Bo TU
  • Publication number: 20220085188
    Abstract: The present invention discloses a stacked semiconductor chip structure and its process wherein the stacked semiconductor chip structure comprises a substrate as well as P-type semiconductor layers and N-type semiconductor layers which are stacked one by one on the substrate, wherein the P-type semiconductor layers and the N-type semiconductor layers are arranged alternately, there are at least two P-type semiconductor layers and at least two N-type semiconductor layers. The present invention uses the chemical vapor deposition method to stack and form the P-type semiconductor layers and the N-type semiconductor layers, uses the physical etching and the plasma cleaning to form the conducting layers and thus avoids using the photo masks, the photo resist and the mask aligners for the manufacture of semiconductor chips, reduces the complexity of semiconductor chip processes and increases the yield of semiconductor chip products.
    Type: Application
    Filed: November 24, 2020
    Publication date: March 17, 2022
    Inventors: Bo TU, Hsiang-Yi CHENG
  • Patent number: 10665563
    Abstract: A semiconductor chip packaging structure without soldering wire and a packaging method thereof are disclosed. The semiconductor chip packaging structure comprises at least one packaging structure, and each packaging structure comprises a substrate, and a semiconductor chip is arranged on the substrate. Pins of the semiconductor chip are electrically connected to the conductive circuit formed by engraving or etching metal film or alloy film. The semiconductor chip packaging structure also comprises a packaging glue layer covering the semiconductor chip and the conductive circuit. The semiconductor chip packaging method includes steps of arranging a semiconductor chip on the substrate; forming a metal film or an alloy film around the semiconductor chip; etching the metal film or alloy film, to form the conductive circuit; and covering a packaging glue layer on the semiconductor chip and the conductive circuit. As a result, the production efficiency can be improved greatly.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: May 26, 2020
    Assignee: SHENZHEN JIEJIANDA INNOVATION TECHNOLOGY CO., LTD.
    Inventors: Bo Tu, Hsiang-Yi Cheng
  • Publication number: 20200105736
    Abstract: The invention discloses a three-dimensional stacked encapsulated LED display screen module and its encapsulation method thereof. The LED display screen module comprises a transparent screen substrate on the surface of the display screen, wherein a red LED layer, a green LED layer, a blue LED layer and an LED light emitting control device layer positioned on them are sequentially stacked in any order on the transparent screen substrate. The translucent screen substrate, the red light LED layer, the green light LED layer, the blue light LED layer and the LED light emitting control device layer are fixedly connected through shadowless adhesive layers. Conductive circuits formed by carving or etching metal films or alloy films are laid on various layers, and LEDs are arranged on different layers in a staggered manner.
    Type: Application
    Filed: September 23, 2019
    Publication date: April 2, 2020
    Inventors: Bo TU, Hsiang-Yi CHENG
  • Publication number: 20200091106
    Abstract: A semiconductor chip packaging structure without soldering wire and a packaging method thereof are disclosed. The semiconductor chip packaging structure comprises at least one packaging structure, and each packaging structure comprises a substrate, and a semiconductor chip is arranged on the substrate. Pins of the semiconductor chip are electrically connected to the conductive circuit formed by engraving or etching metal film or alloy film. The semiconductor chip packaging structure also comprises a packaging glue layer covering the semiconductor chip and the conductive circuit. The semiconductor chip packaging method includes steps of arranging a semiconductor chip on the substrate; forming a metal film or an alloy film around the semiconductor chip; etching the metal film or alloy film, to form the conductive circuit; and covering a packaging glue layer on the semiconductor chip and the conductive circuit. As a result, the production efficiency can be improved greatly.
    Type: Application
    Filed: September 18, 2018
    Publication date: March 19, 2020
    Inventors: BO TU, HSIANG-YI CHENG
  • Patent number: 8442324
    Abstract: A method and a system for displaying an image based on texts in the image are provided. The method of the invention for displaying the image includes: a text extracting step, extracting text regions in the image to be displayed; a text occupancy amount calculating step, calculating occupancy amount of the text in said image; a comparing step, comparing the calculated occupancy amount with a predetermined threshold; a display step, displaying the image in real size of the image if said occupancy amount exceeds said predetermined threshold. It is achieved to display the image to the user in a manner of satisfying the viewing aim of the user, and unnecessary load of the computer system is avoided.
    Type: Grant
    Filed: October 24, 2008
    Date of Patent: May 14, 2013
    Assignee: International Business Machines Corporation
    Inventors: Cary L. Bates, Bo Tu
  • Patent number: 7702372
    Abstract: A battery cover assembly (100) is for use in a portable electronic device. The battery cover includes a housing (10) and a battery cover (20). The housing has a first engaging portion (13) at one end thereof, and a holding portion (11) at an opposite end. The holding portion has an latch plate (1111). The battery cover has a second engaging portion (214) formed at one end thereof for engaging with the first engaging portion and defines a latch opening therein for engaging with the latch plate. The latch plate is integrated with the housing for being elastically deformed by an outside force so as to releasably lock with battery cover.
    Type: Grant
    Filed: April 26, 2006
    Date of Patent: April 20, 2010
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Yong-Bo Tu, Chia-Hua Chen
  • Patent number: 7661732
    Abstract: A switch assembly (40) and a portable electronic device (100) are provided. The portable electronic device includes a body section (20), a cover section (10) rotatably connecting to the body section, and the switch assembly. The switch assembly includes a first magnetic component (43), a second magnetic component (45), and a movable magnetic component (47). The first magnetic component is mounted on the cover section. The second magnetic component is mounted on the body section, and attracts to the first magnetic component to maintain the portable electronic device at a closed position. The movable magnetic component is movably mounted on the body section, and repels both to the first and second magnetic. The movable magnetic component provides a repulsive force to repel the cover rotates outwards from the body section, when the magnetic component is driven to move close to the first and second magnetic components.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: February 16, 2010
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Chih-Neng Hsu, Yong-Bo Tu
  • Publication number: 20090110287
    Abstract: A method and a system for displaying an image based on texts in the image are provided. The method of the invention for displaying the image includes: a text extracting step, extracting text regions in the image to be displayed; a text occupancy amount calculating step, calculating occupancy amount of the text in said image; a comparing step, comparing the calculated occupancy amount with a predetermined threshold; a display step, displaying the image in real size of the image if said occupancy amount exceeds said predetermined threshold. It is achieved to display the image to the user in a manner of satisfying the viewing aim of the user, and unnecessary load of the computer system is avoided.
    Type: Application
    Filed: October 24, 2008
    Publication date: April 30, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Cary L. Bates, Bo Tu
  • Publication number: 20080309098
    Abstract: A switch assembly (40) and a portable electronic device (100) are provided. The portable electronic device includes a body section (20), a cover section (10) rotatably connecting to the body section, and the switch assembly. The switch assembly includes a first magnetic component (43), a second magnetic component (45), and a movable magnetic component (47). The first magnetic component is mounted on the cover section. The second magnetic component is mounted on the body section, and attracts to the first magnetic component to maintain the portable electronic device at a closed position. The movable magnetic component is movably mounted on the body section, and repels both to the first and second magnetic. The movable magnetic component provides a repulsive force to repel the cover rotates outwards from the body section, when the magnetic component is driven to move close to the first and second magnetic components.
    Type: Application
    Filed: December 27, 2007
    Publication date: December 18, 2008
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., SUTECH TRADING LIMITED
    Inventors: CHIH-NENG HSU, YONG-BO TU
  • Publication number: 20070015477
    Abstract: A battery cover assembly (100) is for use in a portable electronic device. The battery cover includes a housing (10) and a battery cover (20). The housing has a first engaging portion (13) at one end thereof, and a holding portion (11) at an opposite end. The holding portion has an latch plate (1111). The battery cover has a second engaging portion (214) formed at one end thereof for engaging with the first engaging portion and defines a latch opening therein for engaging with the latch plate. The latch plate is integrated with the housing for being elastically deformed by an outside force so as to releasably lock with battery cover.
    Type: Application
    Filed: April 26, 2006
    Publication date: January 18, 2007
    Applicant: FIH CO., LTD
    Inventors: Yong-Bo Tu, Chia-Hua Chen