Abstract: A configuration control circuit of a flash-type FPGA capable of suppressing programming interference is provided. The configuration control circuit adds a programming selection circuit compared with a conventional configuration control circuit. When a programming operation is performed on a flash memory cell located in a target row and a target column, the programming selection circuit controls a path between a programming bit line (BL) voltage and a BL voltage obtaining terminal of the flash memory cell located in the target row and the target column to be turned on, and a path between the programming BL voltage and a BL voltage obtaining terminal of a flash memory cell located in another row and the target column to be turned off.

Abstract: A configuration circuit of a flash FPGA for realizing external monitoring and configuration is provided. In the configuration circuit, a positive high-voltage output terminal of a positive high-voltage charge pump is connected to a positive high-voltage external monitoring port through a positive high-voltage bidirectional switch circuit, and the positive high-voltage output terminal of a positive high-voltage charge pump is further configured as a positive output end of a voltage supply circuit. A negative high-voltage output terminal of a negative high-voltage charge pump is connected to a negative high-voltage external monitoring port through a negative high-voltage bidirectional switch circuit, and the negative high-voltage output terminal of a negative high-voltage charge pump is further configured as a negative output end of the voltage supply circuit. Based on a received mode adjustment signal, a mode control circuit controls to enter an external monitoring mode or an external configuration mode.

Abstract: A configuration control circuit of a flash-type FPGA capable of suppressing programming interference is provided. The configuration control circuit adds a programming selection circuit compared with a conventional configuration control circuit. When a programming operation is performed on a flash memory cell located in a target row and a target column, the programming selection circuit controls a path between a programming bit line (BL) voltage and a BL voltage obtaining terminal of the flash memory cell located in the target row and the target column to be turned on, and a path between the programming BL voltage and a BL voltage obtaining terminal of a flash memory cell located in another row and the target column to be turned off.

Abstract: A configuration circuit of a flash FPGA for realizing external monitoring and configuration is provided. In the configuration circuit, a positive high-voltage output terminal of a positive high-voltage charge pump is connected to a positive high-voltage external monitoring port through a positive high-voltage bidirectional switch circuit, and the positive high-voltage output terminal of a positive high-voltage charge pump is further configured as a positive output end of a voltage supply circuit. A negative high-voltage output terminal of a negative high-voltage charge pump is connected to a negative high-voltage external monitoring port through a negative high-voltage bidirectional switch circuit, and the negative high-voltage output terminal of a negative high-voltage charge pump is further configured as a negative output end of the voltage supply circuit. Based on a received mode adjustment signal, a mode control circuit controls to enter an external monitoring mode or an external configuration mode.

Abstract: The present invention discloses a stacked semiconductor chip structure and its process wherein the stacked semiconductor chip structure comprises a substrate as well as P-type semiconductor layers and N-type semiconductor layers which are stacked one by one on the substrate, wherein the P-type semiconductor layers and the N-type semiconductor layers are arranged alternately, there are at least two P-type semiconductor layers and at least two N-type semiconductor layers. The present invention uses the chemical vapor deposition method to stack and form the P-type semiconductor layers and the N-type semiconductor layers, uses the physical etching and the plasma cleaning to form the conducting layers and thus avoids using the photo masks, the photo resist and the mask aligners for the manufacture of semiconductor chips, reduces the complexity of semiconductor chip processes and increases the yield of semiconductor chip products.

Abstract: A semiconductor chip packaging structure without soldering wire and a packaging method thereof are disclosed. The semiconductor chip packaging structure comprises at least one packaging structure, and each packaging structure comprises a substrate, and a semiconductor chip is arranged on the substrate. Pins of the semiconductor chip are electrically connected to the conductive circuit formed by engraving or etching metal film or alloy film. The semiconductor chip packaging structure also comprises a packaging glue layer covering the semiconductor chip and the conductive circuit. The semiconductor chip packaging method includes steps of arranging a semiconductor chip on the substrate; forming a metal film or an alloy film around the semiconductor chip; etching the metal film or alloy film, to form the conductive circuit; and covering a packaging glue layer on the semiconductor chip and the conductive circuit. As a result, the production efficiency can be improved greatly.

Abstract: The invention discloses a three-dimensional stacked encapsulated LED display screen module and its encapsulation method thereof. The LED display screen module comprises a transparent screen substrate on the surface of the display screen, wherein a red LED layer, a green LED layer, a blue LED layer and an LED light emitting control device layer positioned on them are sequentially stacked in any order on the transparent screen substrate. The translucent screen substrate, the red light LED layer, the green light LED layer, the blue light LED layer and the LED light emitting control device layer are fixedly connected through shadowless adhesive layers. Conductive circuits formed by carving or etching metal films or alloy films are laid on various layers, and LEDs are arranged on different layers in a staggered manner.

Abstract: A semiconductor chip packaging structure without soldering wire and a packaging method thereof are disclosed. The semiconductor chip packaging structure comprises at least one packaging structure, and each packaging structure comprises a substrate, and a semiconductor chip is arranged on the substrate. Pins of the semiconductor chip are electrically connected to the conductive circuit formed by engraving or etching metal film or alloy film. The semiconductor chip packaging structure also comprises a packaging glue layer covering the semiconductor chip and the conductive circuit. The semiconductor chip packaging method includes steps of arranging a semiconductor chip on the substrate; forming a metal film or an alloy film around the semiconductor chip; etching the metal film or alloy film, to form the conductive circuit; and covering a packaging glue layer on the semiconductor chip and the conductive circuit. As a result, the production efficiency can be improved greatly.

Abstract: A method and a system for displaying an image based on texts in the image are provided. The method of the invention for displaying the image includes: a text extracting step, extracting text regions in the image to be displayed; a text occupancy amount calculating step, calculating occupancy amount of the text in said image; a comparing step, comparing the calculated occupancy amount with a predetermined threshold; a display step, displaying the image in real size of the image if said occupancy amount exceeds said predetermined threshold. It is achieved to display the image to the user in a manner of satisfying the viewing aim of the user, and unnecessary load of the computer system is avoided.

Abstract: A method and a system for displaying an image based on texts in the image are provided. The method of the invention for displaying the image includes: a text extracting step, extracting text regions in the image to be displayed; a text occupancy amount calculating step, calculating occupancy amount of the text in said image; a comparing step, comparing the calculated occupancy amount with a predetermined threshold; a display step, displaying the image in real size of the image if said occupancy amount exceeds said predetermined threshold. It is achieved to display the image to the user in a manner of satisfying the viewing aim of the user, and unnecessary load of the computer system is avoided.