Patents by Inventor Bo Tu
Bo Tu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250085001Abstract: Provided is a wall-mounted air conditioner, comprising a housing and a heat exchanger. An air duct is provided in the housing; the air duct comprises an air inlet and an air outlet; the air duct comprises an air inflow section and an air outflow section that are connected to each other; at least a portion of the air inlet is located on the front side of the housing; and the heat exchanger is disposed in the air duct. The air inflow section horizontally or obliquely extends forward from the air outflow section to form a first mounting space behind the air inflow section; and/or the portion of the air outflow section adjacent to the air outlet extends downward and forward from the remaining portion of the air outflow section to form a second mounting space behind the air outflow section.Type: ApplicationFiled: February 11, 2022Publication date: March 13, 2025Inventors: Baisong ZHOU, Duode WU, Yuan YANG, Bo LI, Yongqiang WAN, Qiqin SU, Yunchong TU
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Publication number: 20250080531Abstract: The present disclosure provides an identity authentication method, a personal security kernel node, a device, and a medium. The personal security kernel node is part of an identity authentication system, the identity authentication system further comprising a relying party node and a user identity credential certifier node. The method includes: obtaining an identity authentication assurance level corresponding to a service provided by a relying party; determining, according to the identity authentication assurance level, a user identity credential used by a user for the service; transmitting the user identity credential to a user identity credential certifier node through a relying party node, so that the user identity credential certifier node performs user identity credential authentication; and performing the service with the relying party node. According to the embodiments of the present disclosure, security of user identity assets can be improved during identity authentication.Type: ApplicationFiled: November 14, 2024Publication date: March 6, 2025Inventors: Dongyan WANG, Maocal LI, Bo LI, Haitao TU
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Patent number: 12095460Abstract: A configuration circuit of a flash FPGA for realizing external monitoring and configuration is provided. In the configuration circuit, a positive high-voltage output terminal of a positive high-voltage charge pump is connected to a positive high-voltage external monitoring port through a positive high-voltage bidirectional switch circuit, and the positive high-voltage output terminal of a positive high-voltage charge pump is further configured as a positive output end of a voltage supply circuit. A negative high-voltage output terminal of a negative high-voltage charge pump is connected to a negative high-voltage external monitoring port through a negative high-voltage bidirectional switch circuit, and the negative high-voltage output terminal of a negative high-voltage charge pump is further configured as a negative output end of the voltage supply circuit. Based on a received mode adjustment signal, a mode control circuit controls to enter an external monitoring mode or an external configuration mode.Type: GrantFiled: September 29, 2022Date of Patent: September 17, 2024Assignee: WUXI ESIONTECH CO., LTD.Inventors: Yueer Shan, Zhengzhou Cao, Wenhu Xie, Yanfei Zhang, Ting Jiang, Bo Tu
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Publication number: 20230352096Abstract: A configuration control circuit of a flash-type FPGA capable of suppressing programming interference is provided. The configuration control circuit adds a programming selection circuit compared with a conventional configuration control circuit. When a programming operation is performed on a flash memory cell located in a target row and a target column, the programming selection circuit controls a path between a programming bit line (BL) voltage and a BL voltage obtaining terminal of the flash memory cell located in the target row and the target column to be turned on, and a path between the programming BL voltage and a BL voltage obtaining terminal of a flash memory cell located in another row and the target column to be turned off.Type: ApplicationFiled: July 7, 2023Publication date: November 2, 2023Applicant: WUXI ESIONTECH CO., LTD.Inventors: Zhengzhou CAO, Yueer SHAN, Bo TU, Xiaofei HE, Yanfei ZHANG, Zhenkai JI
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Publication number: 20230020524Abstract: A configuration circuit of a flash FPGA for realizing external monitoring and configuration is provided. In the configuration circuit, a positive high-voltage output terminal of a positive high-voltage charge pump is connected to a positive high-voltage external monitoring port through a positive high-voltage bidirectional switch circuit, and the positive high-voltage output terminal of a positive high-voltage charge pump is further configured as a positive output end of a voltage supply circuit. A negative high-voltage output terminal of a negative high-voltage charge pump is connected to a negative high-voltage external monitoring port through a negative high-voltage bidirectional switch circuit, and the negative high-voltage output terminal of a negative high-voltage charge pump is further configured as a negative output end of the voltage supply circuit. Based on a received mode adjustment signal, a mode control circuit controls to enter an external monitoring mode or an external configuration mode.Type: ApplicationFiled: September 29, 2022Publication date: January 19, 2023Applicant: WUXI ESIONTECH CO., LTD.Inventors: Yueer SHAN, Zhengzhou CAO, Wenhu XIE, Yanfei ZHANG, Ting JIANG, Bo TU
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Publication number: 20220085188Abstract: The present invention discloses a stacked semiconductor chip structure and its process wherein the stacked semiconductor chip structure comprises a substrate as well as P-type semiconductor layers and N-type semiconductor layers which are stacked one by one on the substrate, wherein the P-type semiconductor layers and the N-type semiconductor layers are arranged alternately, there are at least two P-type semiconductor layers and at least two N-type semiconductor layers. The present invention uses the chemical vapor deposition method to stack and form the P-type semiconductor layers and the N-type semiconductor layers, uses the physical etching and the plasma cleaning to form the conducting layers and thus avoids using the photo masks, the photo resist and the mask aligners for the manufacture of semiconductor chips, reduces the complexity of semiconductor chip processes and increases the yield of semiconductor chip products.Type: ApplicationFiled: November 24, 2020Publication date: March 17, 2022Inventors: Bo TU, Hsiang-Yi CHENG
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Patent number: 10665563Abstract: A semiconductor chip packaging structure without soldering wire and a packaging method thereof are disclosed. The semiconductor chip packaging structure comprises at least one packaging structure, and each packaging structure comprises a substrate, and a semiconductor chip is arranged on the substrate. Pins of the semiconductor chip are electrically connected to the conductive circuit formed by engraving or etching metal film or alloy film. The semiconductor chip packaging structure also comprises a packaging glue layer covering the semiconductor chip and the conductive circuit. The semiconductor chip packaging method includes steps of arranging a semiconductor chip on the substrate; forming a metal film or an alloy film around the semiconductor chip; etching the metal film or alloy film, to form the conductive circuit; and covering a packaging glue layer on the semiconductor chip and the conductive circuit. As a result, the production efficiency can be improved greatly.Type: GrantFiled: September 18, 2018Date of Patent: May 26, 2020Assignee: SHENZHEN JIEJIANDA INNOVATION TECHNOLOGY CO., LTD.Inventors: Bo Tu, Hsiang-Yi Cheng
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Publication number: 20200105736Abstract: The invention discloses a three-dimensional stacked encapsulated LED display screen module and its encapsulation method thereof. The LED display screen module comprises a transparent screen substrate on the surface of the display screen, wherein a red LED layer, a green LED layer, a blue LED layer and an LED light emitting control device layer positioned on them are sequentially stacked in any order on the transparent screen substrate. The translucent screen substrate, the red light LED layer, the green light LED layer, the blue light LED layer and the LED light emitting control device layer are fixedly connected through shadowless adhesive layers. Conductive circuits formed by carving or etching metal films or alloy films are laid on various layers, and LEDs are arranged on different layers in a staggered manner.Type: ApplicationFiled: September 23, 2019Publication date: April 2, 2020Inventors: Bo TU, Hsiang-Yi CHENG
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Publication number: 20200091106Abstract: A semiconductor chip packaging structure without soldering wire and a packaging method thereof are disclosed. The semiconductor chip packaging structure comprises at least one packaging structure, and each packaging structure comprises a substrate, and a semiconductor chip is arranged on the substrate. Pins of the semiconductor chip are electrically connected to the conductive circuit formed by engraving or etching metal film or alloy film. The semiconductor chip packaging structure also comprises a packaging glue layer covering the semiconductor chip and the conductive circuit. The semiconductor chip packaging method includes steps of arranging a semiconductor chip on the substrate; forming a metal film or an alloy film around the semiconductor chip; etching the metal film or alloy film, to form the conductive circuit; and covering a packaging glue layer on the semiconductor chip and the conductive circuit. As a result, the production efficiency can be improved greatly.Type: ApplicationFiled: September 18, 2018Publication date: March 19, 2020Inventors: BO TU, HSIANG-YI CHENG
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Patent number: 8442324Abstract: A method and a system for displaying an image based on texts in the image are provided. The method of the invention for displaying the image includes: a text extracting step, extracting text regions in the image to be displayed; a text occupancy amount calculating step, calculating occupancy amount of the text in said image; a comparing step, comparing the calculated occupancy amount with a predetermined threshold; a display step, displaying the image in real size of the image if said occupancy amount exceeds said predetermined threshold. It is achieved to display the image to the user in a manner of satisfying the viewing aim of the user, and unnecessary load of the computer system is avoided.Type: GrantFiled: October 24, 2008Date of Patent: May 14, 2013Assignee: International Business Machines CorporationInventors: Cary L. Bates, Bo Tu
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Patent number: 7702372Abstract: A battery cover assembly (100) is for use in a portable electronic device. The battery cover includes a housing (10) and a battery cover (20). The housing has a first engaging portion (13) at one end thereof, and a holding portion (11) at an opposite end. The holding portion has an latch plate (1111). The battery cover has a second engaging portion (214) formed at one end thereof for engaging with the first engaging portion and defines a latch opening therein for engaging with the latch plate. The latch plate is integrated with the housing for being elastically deformed by an outside force so as to releasably lock with battery cover.Type: GrantFiled: April 26, 2006Date of Patent: April 20, 2010Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) LimitedInventors: Yong-Bo Tu, Chia-Hua Chen
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Patent number: 7661732Abstract: A switch assembly (40) and a portable electronic device (100) are provided. The portable electronic device includes a body section (20), a cover section (10) rotatably connecting to the body section, and the switch assembly. The switch assembly includes a first magnetic component (43), a second magnetic component (45), and a movable magnetic component (47). The first magnetic component is mounted on the cover section. The second magnetic component is mounted on the body section, and attracts to the first magnetic component to maintain the portable electronic device at a closed position. The movable magnetic component is movably mounted on the body section, and repels both to the first and second magnetic. The movable magnetic component provides a repulsive force to repel the cover rotates outwards from the body section, when the magnetic component is driven to move close to the first and second magnetic components.Type: GrantFiled: December 27, 2007Date of Patent: February 16, 2010Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) LimitedInventors: Chih-Neng Hsu, Yong-Bo Tu
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Publication number: 20090110287Abstract: A method and a system for displaying an image based on texts in the image are provided. The method of the invention for displaying the image includes: a text extracting step, extracting text regions in the image to be displayed; a text occupancy amount calculating step, calculating occupancy amount of the text in said image; a comparing step, comparing the calculated occupancy amount with a predetermined threshold; a display step, displaying the image in real size of the image if said occupancy amount exceeds said predetermined threshold. It is achieved to display the image to the user in a manner of satisfying the viewing aim of the user, and unnecessary load of the computer system is avoided.Type: ApplicationFiled: October 24, 2008Publication date: April 30, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Cary L. Bates, Bo Tu
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Publication number: 20080309098Abstract: A switch assembly (40) and a portable electronic device (100) are provided. The portable electronic device includes a body section (20), a cover section (10) rotatably connecting to the body section, and the switch assembly. The switch assembly includes a first magnetic component (43), a second magnetic component (45), and a movable magnetic component (47). The first magnetic component is mounted on the cover section. The second magnetic component is mounted on the body section, and attracts to the first magnetic component to maintain the portable electronic device at a closed position. The movable magnetic component is movably mounted on the body section, and repels both to the first and second magnetic. The movable magnetic component provides a repulsive force to repel the cover rotates outwards from the body section, when the magnetic component is driven to move close to the first and second magnetic components.Type: ApplicationFiled: December 27, 2007Publication date: December 18, 2008Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., SUTECH TRADING LIMITEDInventors: CHIH-NENG HSU, YONG-BO TU
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Publication number: 20070015477Abstract: A battery cover assembly (100) is for use in a portable electronic device. The battery cover includes a housing (10) and a battery cover (20). The housing has a first engaging portion (13) at one end thereof, and a holding portion (11) at an opposite end. The holding portion has an latch plate (1111). The battery cover has a second engaging portion (214) formed at one end thereof for engaging with the first engaging portion and defines a latch opening therein for engaging with the latch plate. The latch plate is integrated with the housing for being elastically deformed by an outside force so as to releasably lock with battery cover.Type: ApplicationFiled: April 26, 2006Publication date: January 18, 2007Applicant: FIH CO., LTDInventors: Yong-Bo Tu, Chia-Hua Chen