Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: A paper transmitting device including a feed wheel and a cleaning member is provided. The feed wheel is rotatably disposed for driving a document to move. The cleaning member is disposed on one side of the feed wheel, and has a fabric and porous structure and a woolen friction surface, so that the cleaning member contacts the feed wheel to clean the feed wheel.

Abstract: A office machine including a data carrier transferring passage and a transmission assembly disposed in the data carrier transferring passage is provided. The transmission assembly includes a shaft disposed along a pivoting axial and a transferring roller pivoted with the shaft, wherein the transferring roller rotates along the pivoting axial. The transferring roller includes a body and multiple grooves. The body has a transferring surface and two supporting surfaces. The two supporting surfaces are connected with two sides of the transferring surface and pivoted with the shaft. The grooves are arranged on the transferring surface, wherein each groove has two end portions. At least one of the two end portions is not connected to the supporting surfaces.