Patents by Inventor Bo-Wei Chu

Bo-Wei Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250044840
    Abstract: An information handling system housing includes an interior frame that integrates removeable slot adapters and a garage to hold the slot adapters once separate from the frame. In one example embodiment, a slot adapter has plural support structures and screw openings with an offset bottom surface alignment pin so that insertion into openings in different device slots will support different types of devices, such as solid state drives (SSDs) and wireless network interface controllers.
    Type: Application
    Filed: July 31, 2023
    Publication date: February 6, 2025
    Applicant: Dell Products L.P.
    Inventors: Jing-Tang Wu, Bo-Wei Chu, Hui-Huan Chien
  • Publication number: 20250044839
    Abstract: An information handling system housing includes an interior frame that integrates removeable slot adapters and a garage to hold the slot adapters once separate from the frame. In one example embodiment, a slot adapter has plural support structures and screw openings with an offset bottom surface alignment pin so that insertion into openings in different device slots will support different types of devices, such as solid state drives (SSDs) and wireless network interface controllers.
    Type: Application
    Filed: July 31, 2023
    Publication date: February 6, 2025
    Applicant: Dell Products L.P.
    Inventors: Jing-Tang Wu, Bo-Wei Chu, Hui-Huan Chien
  • Patent number: 12182649
    Abstract: An information handling system has a SIM card slot that accepts a micro SIM card and also accepts a nano SIM card when inserted in an adapter having an outer perimeter of a micro SIM card. The adapter holds contact pads of the nano SIM card in alignment with spring contacts of SIM card socket. When the adapter is inserted into the SIM card socket without a nano SIM card, a contact cover coupled to an eject member has an opening through which spring contacts extend against contact pads, and when the eject member is pressed inward to eject the SIM card adapter, the contact cover moves inward to press down on the spring contacts so that the SIM card adapter is kept clear of the spring contact through ejection.
    Type: Grant
    Filed: February 24, 2023
    Date of Patent: December 31, 2024
    Assignee: Dell Products L.P.
    Inventors: Chia-Ting Hu, Chun-Po Chen, Bo-Wei Chu
  • Publication number: 20240357281
    Abstract: An embedded-damper speaker for an information handling system includes a top speaker housing, a bottom speaker housing, and a damper. The bottom speaker housing is in physical communication with the top speaker housing. The damper is secured in between the top and bottom speaker housings. The damper reduces acoustic resonance between the embedded-damper speaker and the information handling system.
    Type: Application
    Filed: April 19, 2023
    Publication date: October 24, 2024
    Inventors: Jing-Tang Wu, Bo-Wei Chu
  • Publication number: 20240289565
    Abstract: An information handling system has a SIM card slot that accepts a micro SIM card and also accepts a nano SIM card when inserted in an adapter having an outer perimeter of a micro SIM card. The adapter holds contact pads of the nano SIM card in alignment with spring contacts of SIM card socket. When the adapter is inserted into the SIM card socket without a nano SIM card, a contact cover coupled to an eject member has an opening through which spring contacts extend against contact pads, and when the eject member is pressed inward to eject the SIM card adapter, the contact cover moves inward to press down on the spring contacts so that the SIM card adapter is kept clear of the spring contact through ejection.
    Type: Application
    Filed: February 24, 2023
    Publication date: August 29, 2024
    Applicant: Dell Products L.P.
    Inventors: Chia-Ting Hu, Chun-Po Chen, Bo-Wei Chu
  • Patent number: 12026019
    Abstract: A portable information handling system having a portable housing with first and second housing portions rotationally coupled by a hinge having an adjustable torque and a sensor disposed at a front corner of a housing portion reduces torque provided by the hinge when in a closed position and an indication is sensed of an end user opening the housing portions. Reducing torque of the hinge that resists housing rotation from the closed position aids an end user in a single handed rotation of the housing to an open position by allowing the weight of the housing to be sufficient to hold the housing in place on a support surface while the housing rotates open.
    Type: Grant
    Filed: February 25, 2022
    Date of Patent: July 2, 2024
    Assignee: Dell Products L.P.
    Inventors: Kuan-Hua Chiou, Chunpo Chen, Wen-Hsing Lin, Chia-Ting Hu, Yu-Chun Hsieh, Bo-Wei Chu, Jou-Yen Lu
  • Patent number: 11832378
    Abstract: In one embodiment, a carrier device for a thermal pad of an information handling system includes: a first adhesive surface coupled to the thermal pad, the thermal pad coupled to a first surface of a first component of the information handling system, the thermal pad configured to absorb a heat generated by the first component; a thermal transfer window configured to permit the heat generated by the first component to transfer from the thermal pad to a second surface of a second component of the information handling system; and a second adhesive surface removably coupled to the second surface of the second component.
    Type: Grant
    Filed: November 8, 2021
    Date of Patent: November 28, 2023
    Assignee: Dell Products L.P.
    Inventors: Jieh-I Taur, Bo-Wei Chu, Li-Chung Liu, Hui-Huan Chien
  • Publication number: 20230273648
    Abstract: A portable information handling system having a portable housing with first and second housing portions rotationally coupled by a hinge having an adjustable torque and a sensor disposed at a front corner of a housing portion reduces torque provided by the hinge when in a closed position and an indication is sensed of an end user opening the housing portions. Reducing torque of the hinge that resists housing rotation from the closed position aids an end user in a single handed rotation of the housing to an open position by allowing the weight of the housing to be sufficient to hold the housing in place on a support surface while the housing rotates open.
    Type: Application
    Filed: February 25, 2022
    Publication date: August 31, 2023
    Applicant: Dell Products L.P.
    Inventors: Kuan-Hua Chiou, Chunpo Chen, Wen-Hsing Lin, Chia-Ting Hu, Yu-Chun Hsieh, Bo-Wei Chu, Jou-Yen Lu
  • Publication number: 20230143361
    Abstract: In one embodiment, a carrier device for a thermal pad of an information handling system includes: a first adhesive surface coupled to the thermal pad, the thermal pad coupled to a first surface of a first component of the information handling system, the thermal pad configured to absorb a heat generated by the first component; a thermal transfer window configured to permit the heat generated by the first component to transfer from the thermal pad to a second surface of a second component of the information handling system; and a second adhesive surface removably coupled to the second surface of the second component.
    Type: Application
    Filed: November 8, 2021
    Publication date: May 11, 2023
    Inventors: Jieh-I Taur, Bo-Wei Chu, Li-Chung Liu, Hui-Huan Chien
  • Publication number: 20100053001
    Abstract: An antenna connecting module includes a printed circuit board, a metal pad, and an antenna. An opening is formed on the printed circuit board. The metal pad is electrically connected to the printed circuit board and is disposed on a side of the opening. The antenna includes a feeding part. The feeding part is disposed in the opening and contacts the metal pad.
    Type: Application
    Filed: June 8, 2009
    Publication date: March 4, 2010
    Inventors: Yao-Ju Lu, Hsi-Yung Liu, Bo-Wei Chu
  • Patent number: 6737577
    Abstract: A housing opening structure is disclosed, which has a pivoting board pivoted on a housing, a sliding board slidably mounted on the pivoting board, and a top cover fixed on the sliding board. When a technician wants to detach the top cover, due to sliding between the sliding board and the pivoting board, the top cover slides a predetermined distance and rotates to a predetermined angle relative to the housing by the pivoting board, and a stopping member stops a stop section of the pivoting board so that the top cover is stopped instead of falling. When the technician wants to close the top cover, an operating part of the stopping member can be pushed to make the stopping member slide from the back face of the housing to the front face, so the stopping end of the stopping member leaves the stop section of the pivoting board and the pivoting board starts to rotate closed.
    Type: Grant
    Filed: June 10, 2003
    Date of Patent: May 18, 2004
    Assignee: Tatung Co., LTD
    Inventors: Wen-Sheng Liao, Bo-Wei Chu