Patents by Inventor BO-WEI LI

BO-WEI LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8991314
    Abstract: A roller microcontact printing device and a printing method of the device are revealed. The roller microcontact printing device includes a transfer module with a transfer roller and a supply module. The supply module provides an isolating solution and a thin film material to the transfer module to form an isolation layer and a thin film layer in turn on the surface of the transfer roller. Then the thin film is transferred to a substrate by the transfer roller. The microcontact print device and method are used in a roll-to-roll printing process. Thus the production efficiency of the thin film layer on the substrate is improved and the cost is reduced.
    Type: Grant
    Filed: December 29, 2010
    Date of Patent: March 31, 2015
    Assignee: Metal Industries Research & Development Centre
    Inventors: Jung-Wei Cheng, Chang-Pen Chen, Jeng-Rong Ho, Bo-Wei Li, Yeh-Min Lin
  • Publication number: 20120145019
    Abstract: A roller microcontact printing device and a printing method of the device are revealed. The roller microcontact printing device includes a transfer module with a transfer roller and a supply module. The supply module provides an isolating solution and a thin film material to the transfer module to form an isolation layer and a thin film layer in turn on the surface of the transfer roller. Then the thin film is transferred to a substrate by the transfer roller. The microcontact print device and method are used in a roll-to-roll printing process. Thus the production efficiency of the thin film layer on the substrate is improved and the cost is reduced.
    Type: Application
    Filed: December 29, 2010
    Publication date: June 14, 2012
    Applicant: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
    Inventors: JUNG-WEI CHENG, CHANG-PEN CHEN, JENG-RONG HO, BO-WEI LI, YEH-MIN LIN