Abstract: An apparatus for measuring foot blood flow has a platform with a platform contact surface configured to receive a foot force from a user placing their foot on the contact surface. The apparatus also has a plurality of PPG sets (having at least one light source and at least one detector) extending through the platform contact surface, and a plurality of springs. Each PPG set is coupled with one or more of the springs to movably couple with the platform. In addition, each spring is biased to produce a biasing force via its coupled PPG set when the contact surface of the platform receives the foot. To maintain consistent pressure against the skin and good signal to noise ratio, each PPG set and its corresponding one or more springs are configured so that the biasing force has a magnitude that is substantially independent of the foot force magnitude.

Abstract: The present application provides tricyclic triazolo compounds that modulate the activity of diacylglycerol kinase (DGK), which are useful in the treatment of various diseases, including cancer.

Abstract: A micro LED display device includes a micro light emitting unit, a conductive structure and a substrate. The micro light emitting unit includes a plurality of micro light emitting elements, and each of the micro light emitting elements includes a semiconductor structure and an electrode structure. The semiconductor structure includes a first type semiconductor layer, a light emitting layer and a second type semiconductor layer. The electrode structure includes a first type electrode and a second type electrode. The conductive structure includes a first type conductive layer and a second type conductive layer. The first type conductive layer is electrically connected to the first type electrode, and the second type conductive layer is electrically connected to the second type electrode. The micro light emitting unit is disposed on the substrate, and the electrode structure is disposed toward the substrate and includes a gap therebetween.

Abstract: A semiconductor structure includes a substrate, a plurality of micro semiconductor devices and a fixing structure. The micro semiconductor devices are disposed on the substrate. The fixing structure is disposed between the substrate and the micro semiconductor devices. The fixing structure includes a plurality of conductive layers and a plurality of supporting layers. The conductive layers are disposed on the lower surfaces of the micro semiconductor devices. The supporting layers are connected to the conductive layers and the substrate. The material of each of the conductive layers is different from the material of each of the supporting layers.

Abstract: In one embodiment, a carrier device for a thermal pad of an information handling system includes: a first adhesive surface coupled to the thermal pad, the thermal pad coupled to a first surface of a first component of the information handling system, the thermal pad configured to absorb a heat generated by the first component; a thermal transfer window configured to permit the heat generated by the first component to transfer from the thermal pad to a second surface of a second component of the information handling system; and a second adhesive surface removably coupled to the second surface of the second component.

Abstract: A device and a method of flattening recycled carbon fiber material are provided. A main body is provided with two flat plates at an upper and a lower positions corresponding to each other and an ultrasonic unit is disposed on each of the flat plates. While in use, recycled carbon fiber material is placed at the lower flat plate and then at least one ultrasonic probe of the ultrasonic unit is driven to work and vibrate the recycled carbon fiber material into a flat and thin state. After the flattened recycled carbon fiber material being pressurized to form products required, the product has flat and smooth surfaces with special textures. A thickness of the product can be controlled and the product can be thinned according to users' needs, without surface treatment such as grinding, polishing, etc. Thereby production cost is reduced and yield rate of the products is improved.

Abstract: A method includes rotating a wafer, dispensing a liquid from a center of the wafer to a peripheral edge of the wafer to control a temperature of the wafer, and etching an etch layer of the wafer with an etchant during or after dispensing the liquid. The liquid is dispensed through a nozzle.

Abstract: A double screw cutter for recycled carbon fiber material and a method of cutting recycled carbon fiber material by using the same are provided. The double screw cutter includes a housing and counter-rotating twin screws. A cut channel is formed in the housing while a long-fiber feed inlet, a mid-fiber feed inlet, and a short-fiber feed inlet are disposed on an outer surface of the housing and all communicated with the cut channel. A discharge outlet is arranged at a rear end of the housing and communicated with the cut channel. The counter-rotating twin screws are mounted in the cut channel of the housing and provided with two screw rods rotated in opposite directions simultaneously. Thereby recycled carbon fiber with different lengths is cut into a preset length and thus the following processes and applications of the recycled carbon fiber become more convenient.

Abstract: This application discloses a filtering system, an air conditioning system that includes the filtering system, and a cleaning method for a filtering system. An example filtering system includes a total liquid inlet, a total liquid outlet, a first Y-shaped strainer, and a second Y-shaped strainer. The first Y-shaped strainer includes a first liquid flow port, a second liquid flow port, and a first drainage port. The first liquid flow port is connected to the total liquid inlet by using a first pipeline, the second liquid flow port is connected to the total liquid outlet by using a second pipeline, and the first drainage port is connected to a first waste liquid area by using a third pipeline. The second Y-shaped strainer includes a third liquid flow port, a fourth liquid flow port, and a second drainage port, the third liquid flow port is connected to the total liquid inlet by using a fourth pipeline.

Abstract: Embodiments of the present disclosure relates to a wet bench processing including an in-situ pre-treatment prior to performing the first set of wet bench operations. The pre-treatment may include a pre-clean operation and/or a pre-heat operation. The pre-treatment may be performed in one of the existing ONB tanks without requiring adding new tanks to an existing wet bench tool. The pre-clean operation removes particles from a batch of wafers to avoid or reduce cross-contamination and defect issues, thus improving the yield rate of the wet bench process. The pre-heat operation provides better control and stabilize the temperature in the CHB tank to stabilize the process, such as to stabilize an etch rate.

Abstract: A micro semiconductor structure includes a substrate, a dissociative layer, a protective layer and a micro semiconductor. The dissociative layer is located on one side of the substrate. The protective layer is located on at least one side of the substrate. The micro semiconductor is located on the side of the substrate. The transmittance of the protective layer for a light source with wavelength smaller than 360 nm is less than 20%.

Abstract: The present disclosure describes a semiconductor structure with a metal ion capture layer and a method for forming the structure. The method includes forming a first fin structure and a second fin structure on a substrate and forming a first gate structure over the first fin structure and a second gate structure over the second fin structure, where the first gate structure adjoins the second gate structure. The method further includes forming a dielectric layer on the first and second gate structures, removing a portion of the dielectric layer above an adjoining portion of the first and second gate structures to form an opening, and forming a metal ion capture layer in the opening.

Abstract: A method for fabricating a metal-insulator-metal (MIM) capacitor is provided. The MIM capacitor includes a substrate, a first metal layer, a deposition structure, a dielectric layer and a second metal layer. The first metal layer is disposed on the substate and has a planarized surface. The deposition structure is disposed on the first metal layer, and at least a portion of the deposition structure extends into the planarized surface, wherein the first metal layer and the deposition structure have the same material. The dielectric layer is disposed on the deposition structure. The second metal layer is disposed on the dielectric layer.

Abstract: The present disclosure provides a touch circuit, a touch panel and a display device. The touch circuit includes: a plurality of touch signal lines electrically connected with a control circuit, a voltage signal line for providing a preset voltage, and a plurality of switching circuits in one to one correspondence with the touch signal lines, wherein each switching circuit of the plurality of the switching circuits is electrically connected with the corresponding touch signal line and the voltage signal line, the switching circuit is configured to be in an off state under a condition that a voltage value on the corresponding touch signal line is within a preset range, and is also configured to be in an on state under a condition that the voltage value on the corresponding touch signal line is not within the preset range.

Abstract: A method includes rotating a wafer, dispensing a liquid from a center of the wafer to an edge of the wafer to control a temperature of the wafer, and etching an etch layer of the wafer with an etchant during or after dispensing the liquid. The liquid is dispensed through a nozzle.

Abstract: The present disclosure provides a charging management system and for a charging device includes a wired power supply module, a wireless power supply module, a CPU, and a charging IC, where the charging management system further includes a first power supply detection circuit, a second power supply detection circuit, and an interlock circuit, the interlock circuit is configured to prevent damage to the system caused by power supply inter-charging between the wired charging and the wireless charging, and by detecting whether the wired charging is in place by the power supply detection circuit, designing logic of the wired charging and the wireless charging, the system is prevented from pumping a high power at a moment of charging of a device, and stable charging of the device can be ensured. In addition, the circuit is simple, costs are low, a design concept is clear.

Abstract: A training method for a memory system is provided. The memory system includes a memory controller and a memory. The memory controller is connected with the memory. The training method includes the following steps. Firstly, the memory samples n command/address signals according to a first signal edge and a second signal edge of a clock signal to acquire a first sampled content and a second sampled content. The memory selectively outputting one of the first sampled content and the second sampled content through m data signals to the memory controller in response to a control signal. Moreover, m is larger than n and smaller than 2n.

Abstract: An electronic system is provided. A memory device includes a plurality of bank groups. A controller is coupled to the memory device and includes a request queue. The request queue is configured to store a plurality of requests. When the requests correspond to the different bank groups, the controller is configured to access data of the memory device according to a plurality of long burst commands corresponding to the requests. When the requests correspond to the same bank group, the controller is configured to access the data of the memory device according to a plurality of short burst commands corresponding to the requests. The short burst commands correspond to a short burst length, and the long burst commands correspond to a long burst length. The long burst length is twice the short burst length. The memory device is a low-power double data rate synchronous dynamic random access memory.

Abstract: The disclosure is related to systems and methods for data detection and device optimization. In one example, a device may include an interface circuit for data transmission, and an interface detection module adapted to determine a characteristic of a data transfer over the interface circuit. The device may implement an optimization profile for the device based upon the determined characteristic. Further, a device may be configured to measure a data transfer rate, determine an interface type based on the data transfer rate, and implement an optimization profile based on the interface type. The optimization profile may optimize a system for power consumption, performance, or other benefits.

Abstract: A portable information handling system having a portable housing with first and second housing portions rotationally coupled by a hinge having an adjustable torque and a sensor disposed at a front corner of a housing portion reduces torque provided by the hinge when in a closed position and an indication is sensed of an end user opening the housing portions. Reducing torque of the hinge that resists housing rotation from the closed position aids an end user in a single handed rotation of the housing to an open position by allowing the weight of the housing to be sufficient to hold the housing in place on a support surface while the housing rotates open.