Abstract: A vertically integrated micro-bolometer includes an integrated circuit chip, an infrared sensing film, and a metal bonding layer. The integrated circuit chip includes a silicon substrate, a circuit element, and a dielectric layer disposed on the silicon substrate. The infrared sensing film includes a top absorbing layer, a sensing layer, and a bottom absorbing layer. The sensing layer is disposed between the top absorbing layer and the bottom absorbing layer. Materials of the top absorbing layer, the sensing layer, and the bottom absorbing layer are materials compatible with a semiconductor manufacturing process. The metal bonding layer connects the dielectric layer on the silicon substrate in the integrated circuit chip and the bottom absorbing layer of the infrared sensing film to form a vertically integrated micro-bolometer. In one embodiment, the infrared sensing film is divided into a central sensing film, a surrounding sensing film, and a plurality of connecting portions by a plurality of slots.

Abstract: A display panel includes a driving backplane, a light emitting component, a reflective structure and a bridging component. The driving backplane has a first pad and a second pad separated from each other. The light emitting component has a first electrode and a second electrode. The first electrode is electrically connected to the first pad of the driving backplane, and the first electrode is located between the second electrode and the first pad of the driving backplane. The reflective structure is disposed on the driving backplane and located at a periphery of the light emitting component. The bridging component is disposed on the light emitting component. One end of the bridging component is electrically connected to the second electrode. The bridging component passes across at least one portion of the reflective structure. The other end of the bridging component is electrically connected to the second pad of the driving backplane.

Abstract: A source driving circuit of a display includes a gamma resistor strings, a digital to analog (DAC) circuit, and an output buffer circuit. The output buffer circuit includes input stage module, gain stage module, and output stage module. The input stage module includes main input stage unit and auxiliary input stage unit. Sizes of elements in main input stage unit are larger than sizes of elements in the auxiliary input stage unit, smaller sizes presenting smaller parasitic capacitances. During the switching period, the auxiliary input stage unit, gain stage module, and output stage module form a first unity gain amplifier outputting the driving voltages. During the stable period, the main input stage unit, gain stage module, and output stage module form a second unity gain amplifier outputting the driving voltages. A display device is also disclosed.

Abstract: A system includes a programmable non-volatile memory, a switch, a control chipset, and a basic input/output (BIOS) module. The switch has a first terminal coupled to the programmable non-volatile memory, and a second terminal coupled to the control chipset. The control chipset is configured to store a SKU parameter set in the programmable non-volatile memory according to a predetermined memory allocation. The BIOS module is coupled to the control chipset, and is configured to load and update the SKU parameter set according to the predetermined memory configuration during a booting operation of the motherboard.

Abstract: A system includes a programmable non-volatile memory, a switch, a control chipset, and a basic input/output (BIOS) module. The switch has a first terminal coupled to the programmable non-volatile memory, and a second terminal coupled to the control chipset. The control chipset is configured to store a SKU parameter set in the programmable non-volatile memory according to a predetermined memory allocation. The BIOS module is coupled to the control chipset, and is configured to load and update the SKU parameter set according to the predetermined memory configuration during a booting operation of the motherboard.