Abstract: An optical lens includes a first lens having negative power, a second lens having positive power, a third lens, a fourth lens, and a fifth lens having positive power. The third lens and the fourth lens form an achromatic lens group. The fifth lens has two surfaces and at least one of the two surfaces is an aspherical surface.

Abstract: A method and apparatus are disclosed for determining behaviour of a plurality of candidate objects in a multi-candidate object scene. The method comprises the steps of frame-by-frame, extracting behaviour features from video data associated with a scene, providing the behaviour features to an input of a recognition module comprising an interval Type 2 Fuzzy Logic (IT2FLS) based recognition model and classifying candidate object behaviour for a plurality of candidate objects in a current frame by selecting a candidate behaviour model having a highest output degree for each candidate object.

Abstract: A lens assembly for an optical imaging lens is disclosed, which includes a first lens, wherein the first lens has a negative power, a second lens, a third lens, a fourth lens, a fifth lens, and a sixth lens, wherein the sixth lens has a positive power, wherein the second lens and the third lens define a first cemented achromatic lens assembly, and the fourth lens and the fifth lens define a second cemented achromatic lens assembly, wherein the first lens, the first cemented achromatic lens assembly, the second cemented achromatic lens assembly and the sixth lens are orderly arranged along the direction from the object side to the image side.

Abstract: Camphor-derived compounds are disclosed, which are represented as the following formula (I): wherein R1, R2, R3, and R4 each are defined as described in the specification. In addition, a method for manufacturing the camphor-derived compounds and application thereof are disclosed.

Abstract: A method for forming a metastable intermolecular composite (MIC) includes providing a vacuum level of <10?8 torr base pressure in a deposition chamber. A first layer of a first material of a metal that is reactive with water vapor is deposited, followed by depositing a second layer of a second material of a metal oxide on the first layer. The first and second material are capable of an exothermic chemical reaction to form at least one product, and the first and second layer are in sufficiently close physical proximity so that upon initiation of the exothermic reaction the reaction develops into a self initiating chemical reaction. An interfacial region averaging <1 nm thick is formed between the first layer and second layer from a reaction of the first material with water vapor. In one embodiment, the first material is Al and the second material is CuOx.

Abstract: A metastable intermolecular composite (MIC) and methods for forming the same includes a first material and a second material having an interfacial region therebetween. The first and second material are capable of an exothermic chemical reaction with one another to form at least one product and are in sufficiently close physical proximity to one another so that upon initiation the exothermic reaction develops into a self initiating reaction. At least one of said first and second materials include a metal that is reactive with water vapor at room temperature. The interfacial region averages <2 nm thick, such as <1 nm thick. In one embodiment, the first material is Al and the second material is CuOx.

Abstract: Camphor-derived compounds are disclosed, which are represented as the following formula (I): wherein R1, R2, R3, and R4 each are defined as described in the specification. In addition, a method for manufacturing the camphor-derived compounds and application thereof are disclosed.

Abstract: A multi-celled chip. The chip includes a plurality of hexagonal cells arranged in an array. A plurality of interconnects including Y's connect the cells in clusters of three cells each, so that each of the cells is interconnected.

Abstract: A multi-celled chip. The chip includes a plurality of hexagonal cells arranged in an array. A plurality of interconnects including Y's connect the cells in clusters of three cells each, so that each of the cells is interconnected.

Abstract: A heat dissipation system for use with a computer chip includes a heat sink with a fan mounted aslant to the lateral side thereof. The heat sink includes a base having a first surface and a second surface. The computer chip is positioned in contact with the first surface. A heat dissipation unit is mounted on the second surface of the base. The heat dissipation unit includes a plurality of heat dissipation fins. An air-conducting device has a shape of an inverted U and is used to cover the heat dissipation unit. A fan is mounted aslant to a lateral side of the heat dissipation unit. The heat dissipation unit includes a plurality of rectangular dissipation fins. The fins are mutually parallel and are collocated above the base. The heat dissipation unit includes a predetermined number of heat dissipation fins having a common inclination to form an accommodating area on the lateral side of the heat dissipation unit.

Abstract: A storage box for hard disk drive (HDD) is provided. The storage box includes an outer frame, a first holder, a second holder, a cooling module and a back panel board. The first and second holders are opposite and for supporting the HDD. The cooling module, for cooling the HDD, is fixed in the storage box via the second holder and the outer frame. The cooling air is drawn into the storage box by the cooling module. The back panel board is electrically connected to the cooling module. The back panel board has an outlet positioned relative to the cooling module. The cooling air is flowed through surface of the HDD and a heat sink of the cooling module, and then exhausted from the outlet of the back panel board.

Abstract: A heat dissipation system for use with a computer chip includes a heat sink with a fan mounted aslant to the lateral side thereof. The heat sink includes a base having a first surface and a second surface. The computer chip is positioned in contact with the first surface. A heat dissipation unit is mounted on the second surface of the base. The heat dissipation unit includes a plurality of heat dissipation fins. An air-conducting device has a shape of an inverted U and is used to cover the heat dissipation unit. A fan is mounted aslant to a lateral side of the heat dissipation unit. The heat dissipation unit includes a plurality of rectangular dissipation fins. The fins are mutually parallel and are collocated above the base. The heat dissipation unit includes a predetermined number of heat dissipation fins having a common inclination to form an accommodating area on the lateral side of the heat dissipation unit.