Patents by Inventor Bo Yearn Cho

Bo Yearn Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for thin film vapor deposition of a dialkyl amido dihydroaluminum compound
    Patent number: 7985450
    Abstract: A method for the vapor deposition of aluminum films is provided. Such method employs a dialkyl amido dihydroaluminum compound of the formula [H2AlNR1R2]n wherein R1 and R2 are the same or different alkyl groups having 1 to 3 carbons, and n is an integer of 2 or 3. The aluminum films may be thick or thin and may be aluminum films or may be mixed metal films with aluminum metal. Both CVD and ALD methods may be employed.
    Type: Grant
    Filed: November 16, 2006
    Date of Patent: July 26, 2011
    Assignee: UP Chemical Co., Ltd.
    Inventors: Hyun Koock Shin, Bum Soo Kim, Jin Sik Kim, Jun Young Kim, Young Seop Kim, Bo Yearn Cho
  • Method for thin film vapor deposition of a dialkyl amido dihydroaluminum compound
    Publication number: 20100099257
    Abstract: A method for the vapor deposition of aluminum films is provided. Such method employs a dialkyl amido dihydroaluminum compound of the formula [H2AlNR1R2]n wherein R1 and R2 are the same or different alkyl groups having 1 to 3 carbons, and n is an integer of 2 or 3. The aluminum films may be thick or thin and may be aluminum films or may be mixed metal films with aluminum metal. Both CVD and ALD methods may be employed.
    Type: Application
    Filed: November 16, 2006
    Publication date: April 22, 2010
    Applicant: Rohm and Haas Company
    Inventors: Hyun Koock Shin, Bum Soo Kim, Jin Sik Kim, Jun Young Kim, Young Seop Kim, Bo Yearn Cho