Abstract: A device includes first and second gate structures respectively extending across the first and second fins, and a gate isolation plug between a longitudinal end of the first gate structure and a longitudinal end of the second gate structure. The gate isolation plug comprises a first dielectric layer and a second dielectric layer over the first dielectric layer. The first dielectric layer has an upper portion and a lower portion below the upper portion. The upper portion has a thickness smaller than a thickness of the lower portion of the first dielectric layer.

Abstract: An electronic device includes a first component and a second component. The first component includes a first housing and a protrusion element. The first housing has a first cover plate, and the protrusion element is disposed on the first cover plate. The second component is rotationally assembled with the first component along a first direction. The second component includes a second housing, an elastic structure, and a switching element. The elastic structure has an elastic post. The second housing has a second cover plate having a through hole. One part of the elastic post passes through the through hole and is exposed on the second cover plate. The protrusion element moves along a first direction relative to the elastic structure, such that the elastic post is squeezed by the protrusion element to move along a second direction and presses the switching element.

Abstract: A buffer circuit includes an input terminal configured to receive an input signal, an output terminal, an inverter, and a resistor-capacitor (RC) circuit coupled in series with the inverter between the input terminal and the output terminal. The RC circuit includes an NMOS transistor coupled between an RC circuit output terminal and a reference node, a resistor coupled between the RC circuit output terminal and a power supply node, and a capacitor coupled between the RC circuit output terminal and one of the power supply node or the reference node, and the inverter and the RC circuit are configured to generate an output signal at the output terminal based on the input signal.

Abstract: A heat dissipation structure includes a heat sink, a first thermal interface material, a second thermal interface material, a circuit board and a circuit element. The first thermal interface material is connected to the heat sink and has fluidity. The second thermal interface material is connected to the first thermal interface material and has no fluidity. The circuit board is connected to the second thermal interface material and has an opening, a top board surface and a bottom board surface. The circuit element includes a convex portion and a base portion. The convex portion has a top convex surface and is disposed in the opening. The base portion is connected to the convex portion and the bottom board surface. The second thermal interface material is connected to the top board surface and the top convex surface.

Abstract: A composite sucker is for being sucked on an attached surface. The composite sucker includes a suction element, a pressing element and a pressure adjusting element. The suction element is for being connected to and sucked on the attached surface. The suction element includes a suction elastic portion. An air space is formed between the suction elastic portion and the attached surface. The pressing element is connected to the suction element and includes a pressing elastic portion. The pressing elastic portion is disposed farther away from the attached surface than the suction elastic portion therefrom. The pressure adjusting element is connected to the suction element. The pressure adjusting element is able to drive the suction elastic portion to be deformed, so that a volume of the air space is able to become greater.

Abstract: A heat dissipation structure includes a heat sink, a first thermal interface material, a second thermal interface material, a circuit board and a circuit element. The first thermal interface material is connected to the heat sink and has fluidity. The second thermal interface material is connected to the first thermal interface material and has no fluidity. The circuit board is connected to the second thermal interface material and has an opening, a top board surface and a bottom board surface. The circuit element includes a convex portion and a base portion. The convex portion has a top convex surface and is disposed in the opening. The base portion is connected to the convex portion and the bottom board surface. The second thermal interface material is connected to the top board surface and the top convex surface.

Abstract: A composite sucker is for being sucked on an attached surface. The composite sucker includes a suction element, a pressing element and a pressure adjusting element. The suction element is for being connected to and sucked on the attached surface. The suction element includes a suction elastic portion. An air space is formed between the suction elastic portion and the attached surface. The pressing element is connected to the suction element and includes a pressing elastic portion. The pressing elastic portion is disposed farther away from the attached surface than the suction elastic portion therefrom. The pressure adjusting element is connected to the suction element. The pressure adjusting element is able to drive the suction elastic portion to be deformed, so that a volume of the air space is able to become greater.