Patents by Inventor Bo-Yong Yang

Bo-Yong Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8801223
    Abstract: An LED lamp includes a socket and a shallow dish-shaped body detachably connected to the socket. The socket is electrically connected to an external power source. The body includes a rear cover, a transparent front cover, a lamp board, a number of LED light sources, a driving circuit board and a fixing member. The LED light sources are mounted on the lamp board facing the front cover, wherein the LED light sources are visible from an outside of the transparent front cover when they are lit. The driving circuit board is electrically connected to the socket and the lamp board, and is configured for driving the LED light sources to emit light beams. The fixing member is configured for fixing the rear cover, the driving circuit board and the lamp board together.
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: August 12, 2014
    Assignees: Foxsemicon Integrated Technology (Shanghai) Inc., Foxsemicon Integrated Technology, Inc.
    Inventors: Kuan-Hong Hsieh, Te-Sheng Chen, Wen-Hsiang Lu, Bo-Yong Yang, Liang Yi, Yu Zhang
  • Publication number: 20130223065
    Abstract: A street lamp includes a lamp post and a lamp housing mounted on a distal end of the lamp post. An alternating current cable is received in the lamp post. A light source is received in the lamp housing. A power supplying device is electrically connected to the light source via a connecting cable. A connection device includes an Edison screw socket and an Edison male screw plug being detachably and threadedly engaged in the Edison screw socket. The Edison screw socket is electrically coupled to the alternating current cable, and the Edison male screw plug is electrically and mechanically coupled to the power supplying device. The power supplying device is configured for converting an alternating current into direct current and supplying the direct current to the light source.
    Type: Application
    Filed: January 13, 2013
    Publication date: August 29, 2013
    Inventors: KUAN-HONG HSIEH, TE-SHENG CHEN, WEN-HSIANG LU, BO-YONG YANG, ZHEN-RONG PENG, YU ZHANG
  • Publication number: 20130170182
    Abstract: An LED lamp includes a socket and a shallow dish-shaped body detachably connected to the socket. The body includes a rear cover, a front cover, a fixing member, a lamp board, a number of LED light sources and a driving circuit board. The fixing member includes a ring-shaped fixing element. The lamp board is mounted on an external circumferential surface of the fixing element, the LED light sources are mounted on the lamp board facing an inside of the rear cover. The driving circuit board is configured to drive the LED light sources to emit light beams towards the rear cover. The rear cover is configured for allowing a portion of the light beams from the LED light sources to pass therethrough and reflecting remaining portion of the light beams to the front cover, and the front cover is configured for allowing the reflected light to pass therethrough.
    Type: Application
    Filed: December 26, 2012
    Publication date: July 4, 2013
    Inventors: KUAN-HONG HSIEH, TE-SHENG CHEN, WEN-HSIANG LU, BO-YONG YANG, LIANG YI, YU ZHANG
  • Publication number: 20130170183
    Abstract: An LED lamp includes a socket and a shallow dish-shaped body detachably connected to the socket. The socket is electrically connected to an external power source. The body includes a rear cover, a transparent front cover, a lamp board, a number of LED light sources, a driving circuit board and a fixing member. The LED light sources are mounted on the lamp board facing the front cover, wherein the LED light sources are visible from an outside of the transparent front cover when they are lit. The driving circuit board is electrically connected to the socket and the lamp board, and is configured for driving the LED light sources to emit light beams. The fixing member is configured for fixing the rear cover, the driving circuit board and the lamp board together.
    Type: Application
    Filed: December 26, 2012
    Publication date: July 4, 2013
    Inventors: KUAN-HONG HSIEH, TE-SHENG CHEN, WEN-HSIANG LU, BO-YONG YANG, LIANG YI, YU ZHANG
  • Patent number: 7942195
    Abstract: A heat dissipation device (10) includes a first heat sink (20), a second heat sink (30) and a heat pipe (40) transferring heat from the first heat sink to the second heat sink. A bracket (50) includes a first end (51) attached to the first heat sink and a second end (52) attached to the second heat sink.
    Type: Grant
    Filed: March 14, 2006
    Date of Patent: May 17, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Yong-Dong Chen, Bo-Yong Yang, Guang Yu, Shih-Hsun Wung, Chun-Chi Chen
  • Patent number: 7417860
    Abstract: A heat sink assembly (10) includes a heat sink (12) and a wire clip (14). The heat sink includes a base (120) and a plurality of fins (124) mounted on the base. A channel (126) is defined between two neighboring ones of the fins. A pair of points (1250) are punched on one of the fins and received in the channel. The wire clip includes a main body (140), first and second legs (141, 142) extending from opposite ends of the main body. The wire clip intervenes across the points and extends through the channel such that the main body is received in the channel and the first and second legs are located at opposite ends of the channel. Thus, the wire clip is prevented from dropping from the channel in a direction parallel to the channel.
    Type: Grant
    Filed: January 8, 2007
    Date of Patent: August 26, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Bo-Yong Yang, Zhi-Yong Zhou, Cheng-Tien Lai
  • Publication number: 20080165503
    Abstract: A heat sink assembly (10) includes a heat sink (12) and a wire clip (14). The heat sink includes a base (120) and a plurality of fins (124) mounted on the base. A channel (126) is defined between two neighboring ones of the fins. A pair of points (1250) are punched on one of the fins and received in the channel. The wire clip includes a main body (140), first and second legs (141, 142) extending from opposite ends of the main body. The wire clip intervenes across the points and extends through the channel such that the main body is received in the channel and the first and second legs are located at opposite ends of the channel. Thus, the wire clip is prevented from dropping from the channel in a direction parallel to the channel.
    Type: Application
    Filed: January 8, 2007
    Publication date: July 10, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Bo-Yong Yang, Zhi-Yong Zhou, Cheng-Tien Lai
  • Publication number: 20080115914
    Abstract: A heat dissipation device includes a base, a plurality of first fins, a plate with a plurality of second fins, a plurality of third fins, three heat pipes and a fan assembly. Each heat pipe includes a heat-receiving portion sandwiched between the base and the first fins, a heat-exchange portion sandwiched between the plate and the first fins, a connecting portion connecting the heat-receiving portion and the heat-exchange portion, a heat-discharging portion extending through the plate and inserted into the third fins. The fan assembly is arranged beside the first, second and third fins and generates forced airflow flowing into channels defined by the first, second and third fins.
    Type: Application
    Filed: November 17, 2006
    Publication date: May 22, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: BO-YONG YANG, SHIH-HSUN WUNG, CHUN-CHI CHEN
  • Patent number: 7298621
    Abstract: A heat sink for dissipating heat from an electronic device includes a base for contacting the electronic device. A U-shaped heat pipe is fixed to the base and includes an evaporating portion contacting the base and two condensing portion extending from opposite ends of the evaporating portion and through a plurality of first fins stacked together parallel to each other. A plurality of second fins extends from the base towards the first fins and supports the first fins. A reinforcement is fixed on the base and joins with some of the first fins, thereby enhancing integrity of the first fins.
    Type: Grant
    Filed: August 23, 2005
    Date of Patent: November 20, 2007
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Wan-Lin Xia, Bo-Yong Yang, Min-Qi Xiao
  • Patent number: 7295439
    Abstract: A fastening assembly is for securing a heat sink to a heat generating electronic device located on a printed circuit board. The fastening assembly includes a first element and a second element slidably received in the first element. The first element includes a pressing portion, a plurality of outer flexible portions located below the pressing portion and a plurality of inner flexible portions integrally extending inwards from the outer flexible portions, respectively. The pressing portion of the first element presses downwardly the heat sink toward the electronic device. The outer flexible portions of the first element abut upwardly against the printed circuit board. The second element is capable of acting on the inner flexible portions of the first element to motivate the outer flexible portions to release their abutment from the printed circuit board.
    Type: Grant
    Filed: August 9, 2005
    Date of Patent: November 13, 2007
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Yong Zhong, Bo-Yong Yang, Wan-Lin Xia
  • Patent number: 7292444
    Abstract: A heat sink fastener includes a main body, a piercing member and a wire clip. The main body includes a pressing part for holding a heat sink in contact with a heat-generating component, an engaging part and a latching leg; the engaging part and the latching leg are disposed at opposing ends of the pressing part. The piercing member includes a piercing body extending through the engaging part of the main body and a tubular part and a hook. The wire clip includes a pivot shaft pivotally connected with the tubular part of the piercing member, a locking leg for fastening to the main body and a lever interconnecting the pivot shaft and the locking leg together, wherein the lever is rotatable to change the positional relationship between the piercing member and the engaging part of the main body.
    Type: Grant
    Filed: October 3, 2006
    Date of Patent: November 6, 2007
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Bo-Yong Yang, Yong-Dong Chen, Guang Yu, Shih-Hsun Wung, Chun-Chi Chen
  • Publication number: 20070215319
    Abstract: A heat dissipation device (10) includes a first heat sink (20), a second heat sink (30) and a heat pipe (40) transferring heat from the first heat sink to the second heat sink. A bracket (50) includes a first end (51) attached to the first heat sink and a second end (52) attached to the second heat sink, thus enhancing the strength and stability of the heat dissipation device.
    Type: Application
    Filed: March 14, 2006
    Publication date: September 20, 2007
    Applicant: FOXCONN TECHNOLOGY CO.,LTD.
    Inventors: Yong-Dong Chen, Bo-Yong Yang, Guang Yu, Shih-Hsun Wung, Chun-Chi Chen
  • Publication number: 20070195502
    Abstract: A heat sink fastener includes a main body, a piercing member and a wire clip. The main body includes a pressing part for holding a heat sink in contact with a heat-generating component, an engaging part and a latching leg; the engaging part and the latching leg are disposed at opposing ends of the pressing part. The piercing member includes a piercing body extending through the engaging part of the main body and a tubular part and a hook. The wire clip includes a pivot shaft pivotally connected with the tubular part of the piercing member, a locking leg for fastening to the main body and a lever interconnecting the pivot shaft and the locking leg together, wherein the lever is rotatable to change the positional relationship between the piercing member and the engaging part of the main body.
    Type: Application
    Filed: October 3, 2006
    Publication date: August 23, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Bo-Yong Yang, Yong-Dong Chen, Guang Yu, Shih-Hsun Wung, Chun-Chi Chen
  • Patent number: 7251136
    Abstract: A heat dissipation device includes a heat sink (20) having a plurality of fins (26), a fan duct (50), a fan (70) and a mounting bracket (60) for mounting the fan duct and the fan to the heat sink. The fan duct is mounted to a front side of the heat sink, and includes an inlet, an enlarged outlet covering the front side of the heat sink and at least two channels (56). The fan duct is capable of expanding an airflow generated by the fan by the enlarged outlet and dividing the airflow by the at least two channels into at least two sub-airflows. Thus, the fan can blow the airflow through all of the fins to thereby promote a heat dissipating efficiency of the heat dissipation device.
    Type: Grant
    Filed: December 29, 2005
    Date of Patent: July 31, 2007
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Bo-Yong Yang, Shih-Hsun Wung, Chun-Chi Chen
  • Publication number: 20070153476
    Abstract: A heat dissipation device includes a heat sink (20) having a plurality of fins (26), a fan duct (50), a fan (70) and a mounting bracket (60) for mounting the fan duct and the fan to the heat sink. The fan duct is mounted to a front side of the heat sink, and includes an inlet, an enlarged outlet covering the front side of the heat sink and at least two channels (56). The fan duct is capable of expanding an airflow generated by the fan by the enlarged outlet and dividing the airflow by the at least two channels into at least two sub-airflows. Thus, the fan can blow the airflow through all of the fins to thereby promote a heat dissipating efficiency of the heat dissipation device.
    Type: Application
    Filed: December 29, 2005
    Publication date: July 5, 2007
    Inventors: Bo-Yong Yang, Shih-Hsun Wung, Chun-Chi Chen
  • Patent number: 7239518
    Abstract: A locking device includes a flat plate for contacting with a heat-generating electronic component, a plurality of fins mounted on the flat plate, four locking feet and four fasteners. The flat plate includes two locking portions at opposite sides thereof. Each locking foot includes two spaced pivot plates at an end thereof, wherein the locking portions of the flat plate are sandwiched between the pivot plates. The locking feet are pivotably connected to the locking portions. The fasteners are secured to ends of the locking feet respectively, opposite to the ends where the spaced pivot plates are formed. The locking feet are pivotably movable between first and second positions. The locking device can be mounted to a first-typed PCB at the first position and a second-typed PCB at the second position.
    Type: Grant
    Filed: November 1, 2005
    Date of Patent: July 3, 2007
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Bo-Yong Yang, Shin-Hsuu Wung, Chun-Chi Chen
  • Patent number: 7227752
    Abstract: A heat dissipation device includes a base, at least one heat pipe having an evaporating section and a condensing section, at least one reinforcing member without phase-change therein, and a plurality of fins. The evaporating section of the heat pipe contacts the base. The condensing section of the heat pipe departs from the base. The fins are stacked on the heat pipe and the reinforcing member. Therefore, the heat dissipation device has steady configuration and low cost.
    Type: Grant
    Filed: May 23, 2005
    Date of Patent: June 5, 2007
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Wan-Lin Xia, Bo-Yong Yang, Tao Li
  • Patent number: 7215550
    Abstract: A heat sink fastener includes a main body, a piercing body and an operating member. The main body includes a pressing part adapted for pressing a heat sink toward a heat-generating component, an engaging part and a latching leg, the engaging part and the latching leg being disposed at opposite ends of the pressing part. The piercing body includes a piercing part piercing through the engaging part and movable up and down in the engaging part, and a latching part below the piercing part and facing the latching leg. The operating member is connected to the piercing part and linearly movable along a direction perpendicular to the engaging part to put the pressing part in tension by exerting a force on the engaging part or to relax the tension by relieving the force exerted on the engaging part.
    Type: Grant
    Filed: March 14, 2006
    Date of Patent: May 8, 2007
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Bo-Yong Yang, Yong-Dong Chen, Guang Yu, Shih-Hsun Wung, Chun-Chi Chen
  • Publication number: 20070097649
    Abstract: A locking device includes a flat plate for contacting with a heat-generating electronic component, a plurality of fins mounted on the flat plate, four locking feet and four fasteners. The flat plate includes two locking portions at opposite sides thereof. Each locking foot includes two spaced pivot plates at an end thereof, wherein the locking portions of the flat plate are sandwiched between the pivot plates. The locking feet are pivotably connected to the locking portions. The fasteners are secured to ends of the locking feet respectively, opposite to the ends where the spaced pivot plates are formed. The locking feet are pivotably movable between first and second positions. The locking device can be mounted to a first-typed PCB at the first position and a second-typed PCB at the second position.
    Type: Application
    Filed: November 1, 2005
    Publication date: May 3, 2007
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Bo-Yong Yang, Shin-Hsuu Wung, Chun-Chi Chen
  • Patent number: 7142430
    Abstract: A heat dissipating device assembly for an electronic components (70), includes a heat sink (10) for contacting the electronic component, and a locking device (20) and a back plate unit (40) for cooperatively mounting the heat sink to the electronic component. The locking device includes a retention module (28) located around the electronic component for supporting the heat sink thereon, and a clip (30) pivotably attached to the retention module. The clip includes a pressing portion and a pushing portion. The clip is pivotable between a first position in which the clip presses the heat sink toward the electronic component and a second position in which the clip pushes the heat sink in a direction away from the electronic component.
    Type: Grant
    Filed: September 29, 2004
    Date of Patent: November 28, 2006
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Wan-Lin Xia, Bao-Chun Chen, Bo-Yong Yang, Jin-Song Feng, Tao Li