Patents by Inventor Bo Yoon Yoo

Bo Yoon Yoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240429183
    Abstract: In one example, an electronic device comprises a first substrate comprising a first dielectric structure and a first conductive structure, a first interconnect structure over an inward side of the first substrate and coupled with the first conductive structure, a first encapsulant over the inward side of the first substrate and contacting a lateral side of the first interconnect structure, a second substrate over the first encapsulant and comprising a second dielectric structure and a second conductive structure, wherein the second conductive structure is coupled with the first interconnect structure, and a first electronic component coupled with an outward side of the first substrate. The first electronic component is coupled with the second conductive structure via the first interconnect structure and the first conductive structure. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: June 22, 2023
    Publication date: December 26, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Tae Yong Lee, Min Won Park, Jeong Hyun Yang, Bo Yoon Yoo
  • Publication number: 20240006279
    Abstract: In one example, an electronic device includes a substrate having a substrate top side, a substrate bottom side opposite to the substrate top side, and a substrate conductive structure. The substrate conductive structure includes a grounded path and a powered path. An electronic component is coupled to the substrate top side. An encapsulant covers the electronic component and the substrate top side. The encapsulant includes apertures and the powered path is exposed by the apertures. A first network structure includes a first network cover over the encapsulant. and first network interconnects coupled to the first network cover and the powered path through the apertures. A second network structure includes a second network cover having a second cover ceiling and second cover sidewalls extending from the second cover ceiling; and a second network contact coupled to the second network cover and the grounded path.
    Type: Application
    Filed: June 30, 2022
    Publication date: January 4, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Min Won PARK, Tae Yong LEE, Bo Yoon YOO
  • Patent number: 10777866
    Abstract: Disclosed is a quasi-circulator using an asymmetric directional coupler. The quasi-circulator using the asymmetric directional coupler according to an embodiment of the present invention may enhance a characteristic of isolating a transmitting signal from a receiving signal with the same characteristic as transmitting signal loss of a symmetric directional coupler in the related art by arranging impedance of each line of a directional coupler asymmetrically.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: September 15, 2020
    Assignee: RESEARCH COOPERATION FOUNDATION OF THE YEUNGNAM UNIVERSITY
    Inventors: Jong Ryul Yang, Bo Yoon Yoo, Ha Neul Lee, Ju Hee Son
  • Publication number: 20190067774
    Abstract: Disclosed is a quasi-circulator using an asymmetric directional coupler. The quasi-circulator using the asymmetric directional coupler according to an embodiment of the present invention may enhance a characteristic of isolating a transmitting signal from a receiving signal with the same characteristic as transmitting signal loss of a symmetric directional coupler in the related art by arranging impedance of each line of a directional coupler asymmetrically.
    Type: Application
    Filed: August 22, 2018
    Publication date: February 28, 2019
    Inventors: Jong Ryul YANG, Bo Yoon Yoo, Ha Neul Lee, Ju Hee Son