Patents by Inventor Bo-Zhang LAI

Bo-Zhang LAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11115767
    Abstract: A diaphragm structure is used for an audio signal output device. The diaphragm structure includes a film substrate, a polymer fiber structure and a thin film metallic glass. The film substrate includes a first surface and a second surface opposite to the first surface. The polymer fiber structure is combined with the first surface of the film substrate. The thin film metallic glass is formed on at least a part of the second surface of the film substrate.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: September 7, 2021
    Assignee: National Taiwan University of Science and Technology
    Inventors: Jinn P. Chu, Chia-Chi Yu, Bo-Zhang Lai, Chun-Tao Chen
  • Publication number: 20200368856
    Abstract: A diamond blade includes a base and a thin film metallic glass. The base includes a plurality of diamond particles, and the plurality of diamond particles protrude from a surface of the base. The thin film metallic glass is formed on the surface of the base, and the plurality of diamond particles are exposed on the thin film metallic glass.
    Type: Application
    Filed: December 18, 2019
    Publication date: November 26, 2020
    Applicant: National Taiwan University of Science and Technology
    Inventors: Jinn P. Chu, Bo-Zhang Lai
  • Publication number: 20200068328
    Abstract: A diaphragm structure is used for an audio signal output device. The diaphragm structure includes a film substrate, a polymer fiber structure and a thin film metallic glass. The film substrate includes a first surface and a second surface opposite to the first surface. The polymer fiber structure is combined with the first surface of the film substrate. The thin film metallic glass is formed on at least a part of the second surface of the film substrate.
    Type: Application
    Filed: November 9, 2018
    Publication date: February 27, 2020
    Inventors: Jinn P. CHU, Chia-Chi YU, Bo-Zhang LAI, Chun-Tao CHEN