Patents by Inventor Bob Bigwood

Bob Bigwood has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Winged vias to increase overlay margin
    Patent number: 8058177
    Abstract: Winged via structures to increase overlay margin are generally described. In one example, a method comprises depositing a sacrificial layer to an interlayer dielectric, the interlayer dielectric being coupled with a semiconductor substrate, forming at least one trench structure in the sacrificial layer wherein the trench structure comprises a first direction along a length of the trench structure and a second direction along a width of the trench structure wherein the second direction is substantially perpendicular to the first direction, depositing a light sensitive material to the trench structure and the sacrificial layer, and patterning at least one winged via structure in the light sensitive material to overlay the trench structure wherein the winged via structure extends in the second direction beyond the width of the trench structure onto the sacrificial layer.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: November 15, 2011
    Assignee: Intel Corporation
    Inventors: Martin Weiss, Ruth Brain, Bob Bigwood, Shannon Daviess
  • WINGED VIAS TO INCREASE OVERLAY MARGIN
    Publication number: 20100025858
    Abstract: Winged via structures to increase overlay margin are generally described. In one example, a method comprises depositing a sacrificial layer to an interlayer dielectric, the interlayer dielectric being coupled with a semiconductor substrate, forming at least one trench structure in the sacrificial layer wherein the trench structure comprises a first direction along a length of the trench structure and a second direction along a width of the trench structure wherein the second direction is substantially perpendicular to the first direction, depositing a light sensitive material to the trench structure and the sacrificial layer, and patterning at least one winged via structure in the light sensitive material to overlay the trench structure wherein the winged via structure extends in the second direction beyond the width of the trench structure onto the sacrificial layer.
    Type: Application
    Filed: July 31, 2008
    Publication date: February 4, 2010
    Inventors: Martin Weiss, Ruth Brain, Bob Bigwood, Shannon Daviess