Abstract: An electronic device includes a lead with a first portion that extends outward from a package structure and is coated with a dielectric film that extends to the side of the package structure, and an uncoated second portion that extends from the first portion to an end of the lead. A method includes forming a package structure to enclose an interior portion of a lead structure and coating an exterior first portion of the lead structure with a dielectric film that extends to a side of the package structure and leaving an exterior second portion of the lead structure uncoated.

Abstract: An electronic device includes a leadframe having connection pads, where the connection pads are off-set in a direction elevated from the leadframe. A substrate is attached to the leadframe and at least one die is attached to the substrate. A mold compound encapsulates the substrate and the at least one die.

Abstract: A semiconductor package includes a metallic substrate, the metallic substrate including a roughened surface, a semiconductor die including bond pads, and an adhesive between the roughened surface of a topside of the metallic substrate and the semiconductor die, therein bonding the semiconductor die to the metallic substrate. The adhesive includes a resin. The metallic substrate further includes a groove about a perimeter of the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic substrate. The groove straddles the topside and a sidewall of the metallic substrate.

Abstract: A semiconductor package includes a metallic substrate, the metallic substrate including a roughened surface, a semiconductor die including bond pads, and an adhesive between the roughened surface of a topside of the metallic substrate and the semiconductor die, therein bonding the semiconductor die to the metallic substrate. The adhesive includes a resin. The metallic substrate further includes a groove about a perimeter of the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic substrate. The groove straddles the topside and a sidewall of the metallic substrate.

Abstract: A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.

Abstract: An IC (integrated circuit) package includes a first interconnect. The first interconnect includes a first surface having connection pads. The connection pads include pillars extending in a direction normal to the first surface and a second surface opposing the first surface having connection pads for leads. The IC package also includes a second interconnect including the leads mounted on the connection pads of the second surface of the first interconnect and a die mounted with solder bumps on the connection pads of the first surface of the first interconnect. A portion of the solder bumps flow over the pillars.

Abstract: An IC (integrated circuit) package includes a first interconnect. The first interconnect includes a first surface comprising connection pads. The connection pads include cavity pillars on the first surface and the cavity pillars include a recess in the first surface with a pillar in a center region of a respective cavity pillar. The first interconnect includes a second surface opposing the first surface having connection pads for leads. The IC package includes a second interconnect with the leads mounted on the connection pads of the second surface of the first interconnect. The IC package also includes a die mounted with solder bumps on the connection pads of the first surface of the first interconnect. A portion of the solder bumps flow over the cavity pillars.

Abstract: A system and method for providing secure transaction data access to trusted third parties are disclosed. An example embodiment is configured to: establish a data connection between a user platform including a data processor and a network connection, a digital exchange blockchain for storage and processing of digital assets using a consensus network protocol, and a Trusted Transparent Transaction (T3) service provider; provision a key for use by an institution to access transaction data collected by the T3 service provider; collect transaction data associated with a digital asset transfer transaction between the user platform and the blockchain; store the transaction data in a database; and enable the institution to access the transaction data by use of the provisioned key.

Abstract: A semiconductor device includes a substrate and a semiconductor die including an active surface with bond pads, an opposite inactive surface, and stepped side surfaces extending between the active surface and the inactive surface. The stepped side surfaces include a first planar surface extending from the inactive surface towards the active surface, a second planar surface extending from the active surface towards the inactive surface, and a side surface offset between the first planar surface and the second planar surface. The semiconductor device further includes an adhesive layer covering at least a portion of a surface area of the second surface and attaching the semiconductor die to the substrate.

Abstract: A semiconductor package includes a metallic substrate, the metallic substrate including a roughened surface, a semiconductor die including bond pads, and an adhesive between the roughened surface of a topside of the metallic substrate and the semiconductor die, therein bonding the semiconductor die to the metallic substrate. The adhesive includes a resin. The metallic substrate further includes a groove about a perimeter of the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic substrate. The groove straddles the topside and a sidewall of the metallic substrate.

Abstract: A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.

Abstract: In some examples, a wireless card reader detects insertion of a chip card at a chip card reader interface that includes electrical contacts positioned in the wireless card reader to contact contacts of the chip card when inserted into the wireless card reader. The wireless card reader may send, to a mobile computing device, a wireless communication request to send a PIN to the card reader. The card reader may receive, from the mobile computing device, a wireless communication including the PIN entered by a user on the mobile computing device. The card reader may send the PIN for authentication of the PIN. The card reader may receive a confirmation that the PIN has been authenticated. The card reader may send, to the mobile computing device, via the communication component, an indication of the confirmation that the PIN has been authenticated.

Abstract: A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.

Abstract: A semiconductor device includes a substrate and a semiconductor die including an active surface with bond pads, an opposite inactive surface, and stepped side surfaces extending between the active surface and the inactive surface. The stepped side surfaces include a first planar surface extending from the inactive surface towards the active surface, a second planar surface extending from the active surface towards the inactive surface, and a side surface offset between the first planar surface and the second planar surface. The semiconductor device further includes an adhesive layer covering at least a portion of a surface area of the second surface and attaching the semiconductor die to the substrate.

Abstract: A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.

Abstract: A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.

Abstract: A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.

Abstract: A leadframe includes a die pad having a plurality of sides which collectively define the rectangular die pad area including at least two securing sides that include a linear portion with a cantilever interrupting the linear portion. The die pad has a top surface defining a top plane and a bottom surface defining a bottom plane. Lead terminals are beyond the die pad. The cantilevers have a fixed end and a free end opposite the fixed ends that enables flexing or bending responsive to a received force. The free ends include a distal end with an electronic component locking feature. The fixed ends are positioned beyond the die pad area, and the electronic component locking feature extends inward over the rectangular die pad area for providing mechanical support and for securing the electronic component.

Abstract: In some examples, a wireless card reader detects insertion of a chip card at a chip card reader interface that includes electrical contacts positioned in the wireless card reader to contact contacts of the chip card when inserted into the wireless card reader. The wireless card reader may send, to a mobile computing device, a wireless communication request to send a PIN to the card reader. The card reader may receive, from the mobile computing device, a wireless communication including the PIN entered by a user on the mobile computing device. The card reader may send the PIN for authentication of the PIN. The card reader may receive a confirmation that the PIN has been authenticated. The card reader may send, to the mobile computing device, via the communication component, an indication of the confirmation that the PIN has been authenticated.

Abstract: A card reader configured to read a smart card can be detachably connected to a mobile computing device. When the card reader is attached to the mobile device, an application installed on the mobile computing device permits the mobile device to communicate with the card reader in order to process transactions. Security measures can be used on the mobile device to prevent theft of a PIN during software PIN entry of a payment transaction. The mobile device can prevent the keypad or other input interface from displaying feedback. The mobile device can also prevent passcodes from being stolen by displaying media encoded with digital rights management (DRM) and by managing the media and user inputs at a secure server. A mobile device can securely communicate with a card reader for a payment transaction using asymmetric or symmetric encryption.