Abstract: A system and method for providing secure transaction data access to trusted third parties are disclosed. An example embodiment is configured to: establish a data connection between a user platform including a data processor and a network connection, a digital exchange blockchain for storage and processing of digital assets using a consensus network protocol, and a Trusted Transparent Transaction (T3) service provider; provision a key for use by an institution to access transaction data collected by the T3 service provider; collect transaction data associated with a digital asset transfer transaction between the user platform and the blockchain; store the transaction data in a database; and enable the institution to access the transaction data by use of the provisioned key.

Abstract: A hydrogen boiloff capture system. The hydrogen boiloff capture system having a cryogenic tank for storing liquid hydrogen. The hydrogen boiloff capture system also includes an intermediate tank fluidically coupled with the cryogenic tank. The intermediate tank is configured to receive hydrogen gas boiloff from the cryogenic tank. The intermediate tank is further configured to provide the hydrogen gas boiloff to a lighter-than-air craft to regulate buoyancy of the lighter-than-air craft. The intermediate tank is also configured to provide the hydrogen gas boiloff to a hydrogen fuel cell coupled to the lighter-than-air craft.

Abstract: A semiconductor device includes a substrate and a semiconductor die including an active surface with bond pads, an opposite inactive surface, and stepped side surfaces extending between the active surface and the inactive surface. The stepped side surfaces include a first planar surface extending from the inactive surface towards the active surface, a second planar surface extending from the active surface towards the inactive surface, and a side surface offset between the first planar surface and the second planar surface. The semiconductor device further includes an adhesive layer covering at least a portion of a surface area of the second surface and attaching the semiconductor die to the substrate.

Abstract: A semiconductor package includes a metallic substrate, the metallic substrate including a roughened surface, a semiconductor die including bond pads, and an adhesive between the roughened surface of a topside of the metallic substrate and the semiconductor die, therein bonding the semiconductor die to the metallic substrate. The adhesive includes a resin. The metallic substrate further includes a groove about a perimeter of the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic substrate. The groove straddles the topside and a sidewall of the metallic substrate.

Abstract: A lighter-than-air craft including an envelope. A mixture of helium and hydrogen disposed within the envelope. The mixture having a ratio of helium to hydrogen such that the mixture is nonflammable during operating conditions for the lighter-than-air craft. The mixture provides buoyancy for the lighter-than-air craft. A hydrogen fuel cell fluidically coupled with the mixture and configured to utilize the mixture to generate electricity. A propulsion system is coupled to the envelope, and the propulsion system is configured to provide propulsion for the lighter-than-air craft. The propulsion system is electrically coupled with the hydrogen fuel cell and receives electricity generated by the hydrogen fuel cell. The propulsion system is configured to utilize the electricity in providing the propulsion to the lighter-than-air craft.

Abstract: A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.

Abstract: In some examples, a wireless card reader detects insertion of a chip card at a chip card reader interface that includes electrical contacts positioned in the wireless card reader to contact contacts of the chip card when inserted into the wireless card reader. The wireless card reader may send, to a mobile computing device, a wireless communication request to send a PIN to the card reader. The card reader may receive, from the mobile computing device, a wireless communication including the PIN entered by a user on the mobile computing device. The card reader may send the PIN for authentication of the PIN. The card reader may receive a confirmation that the PIN has been authenticated. The card reader may send, to the mobile computing device, via the communication component, an indication of the confirmation that the PIN has been authenticated.

Abstract: A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.

Abstract: A lighter-than-air craft including an envelope. A mixture of helium and hydrogen disposed within the envelope. The mixture having a ratio of helium to hydrogen such that the mixture is nonflammable during operating conditions for the lighter-than-air craft. The mixture provides buoyancy for the lighter-than-air craft. A hydrogen fuel cell fluidically coupled with the mixture and configured to utilize the mixture to generate electricity. A propulsion system is coupled to the envelope, and the propulsion system is configured to provide propulsion for the lighter-than-air craft. The propulsion system is electrically coupled with the hydrogen fuel cell and receives electricity generated by the hydrogen fuel cell. The propulsion system is configured to utilize the electricity in providing the propulsion to the lighter-than-air craft.

Abstract: A hydrogen boiloff capture system. The hydrogen boiloff capture system having a cryogenic tank for storing liquid hydrogen. The hydrogen boiloff capture system also includes an intermediate tank fluidically coupled with the cryogenic tank. The intermediate tank is configured to receive hydrogen gas boiloff from the cryogenic tank. The intermediate tank is further configured to provide the hydrogen gas boiloff to a lighter-than-air craft to regulate buoyancy of the lighter-than-air craft. The intermediate tank is also configured to provide the hydrogen gas boiloff to a hydrogen fuel cell coupled to the lighter-than-air craft.

Abstract: A fuel tank heat dissipation system for fuel cell (FC) cooling is disclosed. in one example, at least one FC is in thermal communication with an intermediary heat exchanger. A fuel tank is also in fluid communication with the intermediary heat exchanger. A fluid is used to receive heat from the intermediary heat exchanger and flow along a first fluid path to the fuel tank. A nozzle is used to spray the fluid about an interior surface of the fuel tank, where the spray of the fluid about the interior of the fuel tank allows the fluid to dissipate the heat. A second fluid path from the fuel tank to the intermediary heat exchanger, the second fluid path to return the fluid that has dissipated the heat to the intermediary heat exchanger.

Abstract: A semiconductor device includes a substrate and a semiconductor die including an active surface with bond pads, an opposite inactive surface, and stepped side surfaces extending between the active surface and the inactive surface. The stepped side surfaces include a first planar surface extending from the inactive surface towards the active surface, a second planar surface extending from the active surface towards the inactive surface, and a side surface offset between the first planar surface and the second planar surface. The semiconductor device further includes an adhesive layer covering at least a portion of a surface area of the second surface and attaching the semiconductor die to the substrate.

Abstract: A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.

Abstract: A fingerprint sensing device having an image sensing device and configured to detecting fingerprint data of an input object. The image sensing device includes a plurality of lenses, and a plurality of sensing elements. The plurality of sensing elements includes a first sensing element has a field of view associated with a first lens of the plurality of lenses and laterally offset from a center of the first lens, and a second sensing element has a field of view associated with a second lens of the plurality of lens and laterally offset from a center of the second lens. Further, a processing system may be coupled to the image sensing device and operate the image sensing device to acquire fingerprint image to authenticate a user.

Abstract: A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.

Abstract: A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.

Abstract: Disclosed are systems and methods for imaging an object. For example, an optical sensor for imaging an input object, comprises: a sensor substrate comprising detector pixels; a scattering layer; a cover layer including a sensing surface, wherein the scattering layer is disposed between the sensor substrate and the cover layer; and, a light source. The optical sensor is configured to: illuminate the light source causing light beams to emanate from the light source to produce an effect of a point light source at the scattering layer; and acquire image data, from one or more detector pixels, of an input object in contact with the sensing surface, wherein the image data corresponds to light from the light source that is reflected at the sensing surface of the cover layer.

Abstract: A leadframe includes a die pad having a plurality of sides which collectively define the rectangular die pad area including at least two securing sides that include a linear portion with a cantilever interrupting the linear portion. The die pad has a top surface defining a top plane and a bottom surface defining a bottom plane. Lead terminals are beyond the die pad. The cantilevers have a fixed end and a free end opposite the fixed ends that enables flexing or bending responsive to a received force. The free ends include a distal end with an electronic component locking feature. The fixed ends are positioned beyond the die pad area, and the electronic component locking feature extends inward over the rectangular die pad area for providing mechanical support and for securing the electronic component.

Abstract: Disclosed is a device for optical sensing, comprising: a display comprising a transparent substrate and a plurality of light emitters disposed above the transparent substrate; a transparent cover layer disposed above the display, wherein a top surface of the transparent cover layer provides an input surface for sensing an input object; and, an angled filter disposed below the transparent substrate of the display, wherein the angled filter is configured to allow light within a tolerance angle of an acceptance angle to pass through the angled filter, wherein the acceptance angle is centered around a non-zero angle relative to a normal of the input surface.

Abstract: Optical sensing systems and methods for imaging objects include under-display optical sensors with one or multiple discrete light sources positioned on, in or under the display. The optical sensors may include an array of optical sensing elements, e.g., photodetectors, arranged in or under the display. The displays include OLED or LCD displays.