Abstract: Some embodiments of the present invention include apparatuses and methods relating to processing and packaging microelectronic devices that reduce stresses on and limit or eliminate crack propagation in the devices.

Abstract: Some embodiments of the present invention include apparatuses and methods relating to processing and packaging microelectronic devices that reduce stresses on and limit or eliminate crack propagation in the devices.

Abstract: Some embodiments of the present invention include apparatuses and methods relating to processing and packaging microelectronic devices that reduce stresses on and limit or eliminate crack propagation in the devices.

Abstract: Some embodiments of the present invention include apparatuses and methods relating to processing and packaging microelectronic devices that reduce stresses on and limit or eliminate crack propagation in the devices.

Abstract: A flip-chip package is disclosed. The flip-chip package includes a substrate comprising at least one build-up layer. At least one longitudinal trench is formed in at least one build-up layer of the substrate. The at least one longitudinal trench filled with a conductive material. A conductive plane may be disposed at least partially on the at least one longitudinal trench. An insulating layer may cover the conductive plane and, at least in part, at least one build-up layer of the substrate. The solder resist layer may include a plurality of openings partially exposing the conductive plane. A plurality of conductive pads may be disposed on the conductive plane through the plurality of openings. A method for fabricating the flip-chip package is also disclosed.

Abstract: Provided are a method, device and system in which, in one embodiment, a socket for an integrated circuit package includes a standoff adapted to engage and support the package in a first position in which the package contact terminals are disengaged from socket contact terminals. The standoff is adapted to move to a second position in which the package contact terminals are engaged with the socket contact terminals. In another embodiment, male and female alignment members guide package contact terminals into engagement with socket contact terminals.

Abstract: A flip-chip package is disclosed. The flip-chip package includes a substrate comprising at least one build-up layer. At least one longitudinal trench is formed in at least one build-up layer of the substrate. The at least one longitudinal trench filled with a conductive material. A conductive plane may be disposed at least partially on the at least one longitudinal trench. An insulating layer may cover the conductive plane and, at least in part, at least one build-up layer of the substrate. The solder resist layer may include a plurality of openings partially exposing the conductive plane. A plurality of conductive pads may be disposed on the conductive plane through the plurality of openings. A method for fabricating the flip-chip package is also disclosed.

Abstract: Provided are a method, device and system in which, in one embodiment, a socket for an integrated circuit package includes a standoff adapted to engage and support the package in a first position in which the package contact terminals are disengaged from socket contact terminals. The standoff is adapted to move to a second position in which the package contact terminals are engaged with the socket contact terminals. In another embodiment, male and female alignment members guide package contact terminals into engagement with socket contact terminals.

Abstract: Provided are a method, device and system in which, in one embodiment, a socket for an integrated circuit package includes a standoff adapted to engage and support the package in a first position in which the package contact terminals are disengaged from socket contact terminals. The standoff is adapted to move to a second position in which the package contact terminals are engaged with the socket contact terminals. In another embodiment, male and female alignment members guide package contact terminals into engagement with socket contact terminals.

Abstract: Some embodiments of the present invention include apparatuses and methods relating to processing and packaging microelectronic devices that reduce stresses on and limit or eliminate crack propagation in the devices.

Abstract: Arrangements are used to supply power to a semiconductor package.

Abstract: Arrangements are used to supply power to a semiconductor package.

Abstract: A guided heating apparatus and a method for using the same is provided. The apparatus includes a guiding enclosure, a supporting piece, and an absorbing piece. The guiding enclosure guides and keeps energy from an energy source within the guiding enclosure. The guiding enclosure is made of a material reflective of the energy. The energy source is either one of a microwave source and an infrared source. The supporting piece is detachably coupled with the guiding enclosure and is made of a material transparent to the energy. The absorbing piece is coupled to and supported by the supporting piece within the guiding enclosure. The absorbing piece is made of at least one material that absorbs the energy and transfers the energy to an object to be heated. The absorbing piece has a predetermined composition that controls an energy absorption rate of the absorbing piece.

Abstract: Provided are a method, device and system in which, in one embodiment, a socket for an integrated circuit package includes a standoff adapted to engage and support the package in a first position in which the package contact terminals are disengaged from socket contact terminals. The standoff is adapted to move to a second position in which the package contact terminals are engaged with the socket contact terminals. In another embodiment, male and female alignment members guide package contact terminals into engagement with socket contact terminals.

Abstract: A guided heating apparatus and a method for using the same is provided. The apparatus includes a guiding enclosure, a supporting piece, and an absorbing piece. The guiding enclosure guides and keeps energy from an energy source within the guiding enclosure. The guiding enclosure is made of a material reflective of the energy. The energy source is either one of a microwave source and an infrared source. The supporting piece is detachably coupled with the guiding enclosure and is made of a material transparent to the energy. The absorbing piece is coupled to and supported by the supporting piece within the guiding enclosure. The absorbing piece is made of at least one material that absorbs the energy and transfers the energy to an object to be heated. The absorbing piece has a predetermined composition that controls an energy absorption rate of the absorbing piece.

Abstract: A guided heating apparatus and a method for using the same is provided. The apparatus includes a guiding enclosure, a supporting piece, and an absorbing piece. The guiding enclosure guides and keeps energy from an energy source within the guiding enclosure. The guiding enclosure is made of a material reflective of the energy. The energy source is either one of a microwave source and an infrared source. The supporting piece is detachably coupled with the guiding enclosure and is made of a material transparent to the energy. The absorbing piece is coupled to and supported by the supporting piece within the guiding enclosure. The absorbing piece is made of at least one material that absorbs the energy and transfers the energy to an object to be heated. The absorbing piece has a predetermined composition that controls an energy absorption rate of the absorbing piece.

Abstract: A system and method for embedding power and ground planes in a pin grid array (PGA) socket is provided. Integrated circuit pins are inserted into multiple insertion holes of varying dimensions in the power and ground planes. When the cover of the socket is slidably moved, power pins touch the power plane and ground pins touch the ground plane. Decoupling capacitors are also affixed to the substrate. Thus, the power delivery performance of the overall central processing unit (CPU) package is improved. Moreover, the power and ground planes enhance the mechanical strength of the socket which reduces warpage.

Abstract: A guided heating apparatus and a method for using the same is provided. The apparatus includes a guiding enclosure, a supporting piece, and an absorbing piece. The guiding enclosure guides and keeps energy from an energy source within the guiding enclosure. The guiding enclosure is made of a material reflective of the energy. The energy source is either one of a microwave source and an infrared source. The supporting piece is detachably coupled with the guiding enclosure and is made of a material transparent to the energy. The absorbing piece is coupled to and supported by the supporting piece within the guiding enclosure. The absorbing piece is made of at least one material that absorbs the energy and transfers the energy to an object to be heated. The absorbing piece has a predetermined composition that controls an energy absorption rate of the absorbing piece.

Abstract: A system and method for embedding power and ground planes in a pin grid array (PGA) socket is provided. Integrated circuit pins are inserted into multiple insertion holes of varying dimensions in the power and ground planes. When the cover of the socket is slidably moved, power pins touch the power plane and ground pins touch the ground plane. Decoupling capacitors are also affixed to the substrate. Thus, the power delivery performance of the overall central processing unit (CPU) package is improved. Moreover, the power and ground planes enhance the mechanical strength of the socket which reduces warpage.

Abstract: Arrangements are used to supply power to a semiconductor package.