Patents by Inventor Bob Sundahl

Bob Sundahl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Partial underfill for flip-chip electronic packages
    Patent number: 6700209
    Abstract: An integrated circuit package that contains an underfill material between an integrated circuit and a substrate. The integrated circuit may be mounted to the substrate with solder bumps in a C4 process. The underfill material may extend from an edge of the integrated circuit a length that is no less than approximately 25% of the length between the integrated circuit edge and the integrated circuit center. It has been discovered that a length greater than approximately 25% does not provide a significant reduction in the strain of the solder bumps.
    Type: Grant
    Filed: December 29, 1999
    Date of Patent: March 2, 2004
    Assignee: Intel Corporation
    Inventors: George F. Raiser, Bob Sundahl, Ravi Mahajan
  • Partial underfill for flip-chip electronic packages
    Patent number: 6365441
    Abstract: An integrated circuit package that contains an underfill material between an integrated circuit and a substrate. The integrated circuit may be mounted to the substrate with solder bumps in a C4 process. The underfill material may extend from an edge of the integrated circuit a length that is no less than approximately 25% of the length between the integrated circuit edge and the integrated circuit center. It has been discovered that a length greater than approximately 25% does not provide a significant reduction in the strain of the solder bumps.
    Type: Grant
    Filed: October 23, 2000
    Date of Patent: April 2, 2002
    Assignee: Intel Corporation
    Inventors: George F. Raiser, Bob Sundahl, Ravi Mahajan