Patents by Inventor Bobby O'Donley

Bobby O'Donley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device with enhanced adhesion between heat spreader and leads and plastic mold compound
    Patent number: 5402006
    Abstract: A semiconductor device (10) includes a semiconductor die (18) and a heat spreader (16) adjacent the semiconductor die (18) for carrying heat away from the semiconductor die (18). The heat spreader (16) has a copper core (30) and a cupric oxide coating (32) formed on at least a portion of the core (30). A plastic package (12) is molded onto the semiconductor die (18) and the heat spreader (16) for supporting the semiconductor die (18) and the heat spreader (16). The cupric oxide coating (32) enhances adhesion of the heat spreader (16) to the plastic package (12).
    Type: Grant
    Filed: November 10, 1992
    Date of Patent: March 28, 1995
    Assignee: Texas Instruments Incorporated
    Inventor: Bobby O'Donley