Abstract: An electronic interconnection system for delivering high-current power and ground voltages using a non-bottom side of a chip package substrate. The system includes a printed wiring board (PWB), a chip package, and a bridge lead. The PWB has at least a first and a second contact pad. The chip package includes a chip and a package substrate. The chip is mounted onto the package substrate and the package substrate has a bottom surface having at least a first contact pad and a second surface having at least a second contact pad. The first contact pad of the PWB and the first contact pad of the package substrate are coupled together. The bridge lead couples the second contact pad of the PWB with the second contact pad of the package substrate. The bridge lead may be selected from styles including flying lead, edge wiping, top wiping, and double wiping.

Abstract: A grounding plug structure configured for push-type snap lock fastening in circuit board screw holes is provided with a resilient deformable conductive member. When a circuit board with one or more such plug structures fastened thereto is mounted with respect to a tray or chassis, the conductive portion of the plug structure is deformed against a surface of the tray, forming an effective conductive pathway, e.g., for grounding, between the tray and the circuit board. In this way, grounding pathways can be established while eliminating the need for at least some screw mounting and/or standoff structures.

Abstract: A guide device receives and engages a cutout in a distal pin-bearing edge of a printed circuit board for aligning pins with pin sockets. The alignment device includes a web, sized and shaped to be received in a circuit board cutout and a shelf surface for engaging a part of a major surface of the circuit board, to provide for biaxial guidance during board insertion. By positioning guide devices and circuit board cutouts in different locations, for different circuit boards, insertion of circuit boards in an incorrect slot or location is avoided.