Patents by Inventor Bocai CHEN

Bocai CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210333458
    Abstract: A polarizer sheet, a display panel and a display device are provided. The polarizer sheet includes a supporting layer, a polarizing layer, and an electrically conductive layer. The display panel includes the polarizer sheet, a color filter substrate, an array substrate, and a silver adhesive layer. The display device includes the display panel. The invention reduces a used amount of silver adhesive, reduces cost, increases contacting area between the polarizer sheet and the color filter substrate, and increases a proportion of a screen, so that the polarizer sheet can be applied to a full screen narrow border mobile phone.
    Type: Application
    Filed: September 24, 2019
    Publication date: October 28, 2021
    Applicant: Wuhan China Star Optoelectronics Technology Co., Ltd.
    Inventors: Junfeng HUANG, Bocai CHEN
  • Patent number: 10678104
    Abstract: A display panel and a display module are provided. The display panel includes a bonding region. The bonding region includes a drive integrated circuit (IC) chip region, a first flexible circuit board region and a second flexible circuit board region. A first soldering pad is disposed in the first flexible circuit board region. A second soldering pad is disposed in the second flexible circuit board region. The first soldering pad and the second soldering pad are configured to output driving signals.
    Type: Grant
    Filed: November 22, 2018
    Date of Patent: June 9, 2020
    Assignee: Wuhan China Star Optoelectronics Technology Co., Ltd.
    Inventors: Bocai Chen, Jinglong Wang
  • Publication number: 20200103693
    Abstract: A display panel and a display module are provided. The display panel includes a bonding region. The bonding region includes a drive integrated circuit (IC) chip region, a first flexible circuit board region and a second flexible circuit board region. A first soldering pad is disposed in the first flexible circuit board region. A second soldering pad is disposed in the second flexible circuit board region. The first soldering pad and the second soldering pad are configured to output driving signals.
    Type: Application
    Filed: November 22, 2018
    Publication date: April 2, 2020
    Applicant: Wuhan China Star Optoelectronics Technology Co., Ltd.
    Inventors: Bocai CHEN, Jinglong WANG